MCIMX6S4AVM08AB

IC MPU I.MX6S 800MHZ 624MAPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6S 1 Core, 32-Bit 800MHz 624-MAPBGA (21x21)

Quantity 70 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6S
ManufacturerNXP USA Inc.
Manufacturing StatusNot For New Designs
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-MAPBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Speed800MHzSupplier Device Package624-MAPBGA (21×21)USBUSB 2.0 + PHY (4)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6S4AVM08AB – IC MPU I.MX6S 800MHZ 624MAPBGA

The MCIMX6S4AVM08AB is an NXP Semiconductors i.MX 6S series microprocessor featuring a single ARM® Cortex®-A9 32-bit core running at 800 MHz. It combines multimedia acceleration and integrated system features to address display-driven and networked embedded applications.

Built for compact, thermally robust designs, this device offers graphics acceleration, multiple high-speed interfaces and secure boot/security capabilities, packaged in a 624-ball MAPBGA (21 × 21 mm) with an integrated power management approach described in the i.MX6 series documentation.

Key Features

  • Core and Compute: Single ARM® Cortex®-A9 32-bit core at 800 MHz with NEON™ SIMD and multimedia DSP co-processor support for media processing and acceleration.
  • Memory Support: Controllers for LPDDR2, LVDDR3 and DDR3 memory types to support a range of performance and power trade-offs.
  • Graphics and Video: On-chip graphics acceleration with 2D/3D processing and 1080p-capable video processing as described for the i.MX6 family.
  • High-speed Connectivity: Integrated 10/100/1000 Mbps Ethernet (1), four USB 2.0 ports with PHY and CAN interface for networked peripheral integration.
  • Display and HMI: Dedicated display interface controllers including LCD and keypad support for embedded user interfaces.
  • System Security: Comprehensive security features including ARM TrustZone (ARM TZ), boot security, cryptography, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection.
  • Package and Mounting: 624-MAPBGA supplier package in a 21 × 21 mm footprint with 0.8 mm pitch; surface-mount device.
  • Operating Range: Rated for operation from -40 °C to 125 °C.
  • Environmental Compliance: RoHS compliant.

Typical Applications

  • Web and Multimedia Tablets: Single-core Cortex‑A9 plus multimedia/NEON support enables web and multimedia content playback and interactive applications described for the i.MX6Solo/6DualLite family.
  • Display-Driven Embedded Systems: LCD and keypad interface controllers combined with graphics acceleration make the device suitable for HMIs and touchscreen displays.
  • Networked Appliances: Gigabit Ethernet, multiple USB ports and CAN support enable networked and peripheral-rich embedded devices that require wired connectivity.

Unique Advantages

  • Integrated multimedia acceleration: NEON SIMD and multimedia DSP capabilities alongside graphics/video processing reduce the need for external media co-processors.
  • Flexible memory interfacing: Support for LPDDR2, LVDDR3 and DDR3 lets designers match system memory to performance and power targets.
  • Rich I/O set: Gigabit Ethernet, four USB 2.0 ports with PHY and CAN provide broad connectivity for peripherals and networks.
  • Comprehensive security building blocks: Hardware security features including TrustZone, secure boot, cryptography and tamper detection support secure system architectures.
  • Compact, manufacturable package: 624-MAPBGA (21 × 21 mm, 0.8 mm pitch) surface-mount package supports high-density PCB implementations.
  • Wide operating temperature: -40 °C to 125 °C ratings enable deployment across extended-temperature environments.

Why Choose MCIMX6S4AVM08AB?

The MCIMX6S4AVM08AB positions itself as a compact, secure, and multimedia-capable microprocessor for embedded designs that require a single ARM® Cortex®-A9 core at 800 MHz with advanced media and graphics support. Its combination of flexible memory interfaces, comprehensive I/O (Ethernet, USB, CAN), and on-chip security features makes it suitable for display-centric and networked embedded products.

Backed by the i.MX6S series technical foundation and NXP Semiconductors documentation, this part supports designs that need integrated multimedia processing, robust connectivity, and a compact BGA footprint while meeting RoHS environmental compliance.

Request a quote or submit an inquiry to receive pricing and availability for MCIMX6S4AVM08AB and to discuss how it fits your next embedded design.

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