MCIMX6S4AVM08ACR

IC MPU I.MX6S 800MHZ 624MAPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6S 1 Core, 32-Bit 800MHz 624-MAPBGA (21x21)

Quantity 78 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6S
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-MAPBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Speed800MHzSupplier Device Package624-MAPBGA (21×21)USBUSB 2.0 + PHY (4)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6S4AVM08ACR – IC MPU I.MX6S 800MHZ 624MAPBGA

The MCIMX6S4AVM08ACR from NXP Semiconductors is an i.MX 6S series microprocessor featuring a single ARM® Cortex®-A9 32-bit core running at 800 MHz in a 624-MAPBGA (21 × 21 mm) package. It combines multimedia-oriented processing, NEON™ SIMD and DSP capabilities with a compact BGA footprint.

Targeted at embedded applications, the device integrates rich connectivity and display interfaces alongside advanced security and memory controller options, providing a balanced platform for networked and multimedia-focused embedded designs operating across a broad temperature range.

Key Features

  • Core  ARM® Cortex®-A9 single core, 32-bit, operating at 800 MHz for embedded processing tasks.
  • Multimedia & DSP  Multimedia co-processor and NEON™ SIMD support with graphics acceleration to accelerate media and UI workloads.
  • Memory  Integrated controllers for LPDDR2, LVDDR3 and DDR3 memory technologies for flexible memory subsystem options.
  • Connectivity  Gigabit Ethernet (10/100/1000 Mbps, 1 port), four USB 2.0 ports with PHY and CAN interface for broad peripheral and network integration.
  • Display & I/O  Dedicated display interface controllers including LCD and keypad support for HMI implementations.
  • Security  Comprehensive security features including ARM TrustZone, boot security, cryptography, RTIC, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection.
  • Package & Thermal  624-MAPBGA (21 × 21 mm) supplier package with 0.8 mm pitch BGA construction; surface-mount device rated for operation from −40 °C to 125 °C.
  • Compliance  RoHS compliant.

Typical Applications

  • Multimedia Devices  Leverage NEON SIMD and graphics acceleration to drive responsive user interfaces and multimedia features.
  • Networked Embedded Systems  Gigabit Ethernet and multiple USB ports support connectivity-rich designs and peripheral expansion.
  • Industrial Controls  Wide operating temperature range and CAN interface enable robust embedded control applications.
  • Human-Machine Interfaces (HMIs)  Integrated LCD and keypad controllers with graphics acceleration simplify the development of interactive displays.

Unique Advantages

  • High-performance single-core processing: 800 MHz ARM Cortex-A9 delivers consistent single-threaded performance for real-time and control tasks.
  • Integrated multimedia acceleration: NEON SIMD, DSP and graphics acceleration reduce the need for external co-processors.
  • Flexible memory support: On-chip controllers for LPDDR2, LVDDR3 and DDR3 enable adaptable memory subsystem choices to match application needs.
  • Rich peripheral set: Gigabit Ethernet, four USB 2.0 + PHY ports and CAN simplify system-level integration and reduce BOM complexity.
  • Comprehensive security: Hardware and system-level security features protect boot integrity and runtime operations.
  • Thermally robust packaging: Compact 21 × 21 mm BGA package and −40 °C to 125 °C rating support deployments in demanding environments.

Why Choose MCIMX6S4AVM08ACR?

The MCIMX6S4AVM08ACR brings together an established ARM Cortex-A9 core with integrated multimedia, connectivity and security capabilities in a compact BGA package. Its combination of memory flexibility, hardware acceleration and peripheral interfaces makes it suitable for embedded designs that require a balanced mix of performance and system integration.

Engineers building networked, HMI or industrial embedded products will benefit from the device’s extensive interface set, robust thermal range and comprehensive security features, all supported by documentation and ecosystem resources from NXP Semiconductors.

Request a quote or submit an inquiry to receive pricing and availability information for the MCIMX6S4AVM08ACR.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 2006


    Headquarters: Eindhoven, North Brabant, Netherlands


    Employees: 38,000+


    Revenue: $10.53 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up