MCIMX6S4AVM08ACR
| Part Description |
ARM® Cortex®-A9 Microprocessor IC i.MX6S 1 Core, 32-Bit 800MHz 624-MAPBGA (21x21) |
|---|---|
| Quantity | 78 Available (as of October 9, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6S |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A9 | Device Package | 624-MAPBGA (21x21) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Keypad, LCD | ECCN | 5A992C | Ethernet | 10/100/1000Mbps (1) | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 125°C (TJ) | Package / Case | 624-LFBGA | RAM Controllers | LPDDR2, LVDDR3, DDR3 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | ||
| Speed | 800MHz | Supplier Device Package | 624-MAPBGA (21×21) | USB | USB 2.0 + PHY (4) | ||
| Voltage – I/O | 1.8V, 2.5V, 2.8V, 3.3V |
Overview of MCIMX6S4AVM08ACR – IC MPU I.MX6S 800MHZ 624MAPBGA
The MCIMX6S4AVM08ACR from NXP Semiconductors is an i.MX 6S series microprocessor featuring a single ARM® Cortex®-A9 32-bit core running at 800 MHz in a 624-MAPBGA (21 × 21 mm) package. It combines multimedia-oriented processing, NEON™ SIMD and DSP capabilities with a compact BGA footprint.
Targeted at embedded applications, the device integrates rich connectivity and display interfaces alongside advanced security and memory controller options, providing a balanced platform for networked and multimedia-focused embedded designs operating across a broad temperature range.
Key Features
- Core ARM® Cortex®-A9 single core, 32-bit, operating at 800 MHz for embedded processing tasks.
- Multimedia & DSP Multimedia co-processor and NEON™ SIMD support with graphics acceleration to accelerate media and UI workloads.
- Memory Integrated controllers for LPDDR2, LVDDR3 and DDR3 memory technologies for flexible memory subsystem options.
- Connectivity Gigabit Ethernet (10/100/1000 Mbps, 1 port), four USB 2.0 ports with PHY and CAN interface for broad peripheral and network integration.
- Display & I/O Dedicated display interface controllers including LCD and keypad support for HMI implementations.
- Security Comprehensive security features including ARM TrustZone, boot security, cryptography, RTIC, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection.
- Package & Thermal 624-MAPBGA (21 × 21 mm) supplier package with 0.8 mm pitch BGA construction; surface-mount device rated for operation from −40 °C to 125 °C.
- Compliance RoHS compliant.
Typical Applications
- Multimedia Devices Leverage NEON SIMD and graphics acceleration to drive responsive user interfaces and multimedia features.
- Networked Embedded Systems Gigabit Ethernet and multiple USB ports support connectivity-rich designs and peripheral expansion.
- Industrial Controls Wide operating temperature range and CAN interface enable robust embedded control applications.
- Human-Machine Interfaces (HMIs) Integrated LCD and keypad controllers with graphics acceleration simplify the development of interactive displays.
Unique Advantages
- High-performance single-core processing: 800 MHz ARM Cortex-A9 delivers consistent single-threaded performance for real-time and control tasks.
- Integrated multimedia acceleration: NEON SIMD, DSP and graphics acceleration reduce the need for external co-processors.
- Flexible memory support: On-chip controllers for LPDDR2, LVDDR3 and DDR3 enable adaptable memory subsystem choices to match application needs.
- Rich peripheral set: Gigabit Ethernet, four USB 2.0 + PHY ports and CAN simplify system-level integration and reduce BOM complexity.
- Comprehensive security: Hardware and system-level security features protect boot integrity and runtime operations.
- Thermally robust packaging: Compact 21 × 21 mm BGA package and −40 °C to 125 °C rating support deployments in demanding environments.
Why Choose MCIMX6S4AVM08ACR?
The MCIMX6S4AVM08ACR brings together an established ARM Cortex-A9 core with integrated multimedia, connectivity and security capabilities in a compact BGA package. Its combination of memory flexibility, hardware acceleration and peripheral interfaces makes it suitable for embedded designs that require a balanced mix of performance and system integration.
Engineers building networked, HMI or industrial embedded products will benefit from the device’s extensive interface set, robust thermal range and comprehensive security features, all supported by documentation and ecosystem resources from NXP Semiconductors.
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