MCIMX6S4AVM08ADR

IC MPU I.MX6S 800MHZ 624MAPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6S 1 Core, 32-Bit 800MHz 624-MAPBGA (21x21)

Quantity 423 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6S
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-MAPBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Speed800MHzSupplier Device Package624-MAPBGA (21×21)USBUSB 2.0 + PHY (4)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6S4AVM08ADR – IC MPU I.MX6S 800MHz 624-MAPBGA

The MCIMX6S4AVM08ADR is an ARM® Cortex®‑A9 microprocessor IC featuring a single 32‑bit core running at 800 MHz in a 624‑MAPBGA (21 × 21 mm) package. It integrates multimedia acceleration, NEON™ SIMD coprocessing and on‑chip power management to support complex display and multimedia applications.

Built for embedded infotainment, telematics, HMI and display‑centric designs, the device combines a compact surface‑mount package with a broad set of I/O and security capabilities for systems that require processing, graphics and connectivity in a single device.

Key Features

  • Core  Single ARM® Cortex®‑A9 core, 32‑bit, up to 800 MHz.
  • Multimedia & Acceleration  Integrated multimedia coprocessors with NEON™ SIMD and 2D/3D graphics acceleration plus support for 1080p video processing (series datasheet).
  • Memory Interfaces  Memory controller support for LPDDR2, LVDDR3 and DDR3 memories.
  • Display and HMI  Display interface controllers including LCD and keypad support for rich user interfaces.
  • Connectivity  Gigabit Ethernet (10/100/1000 Mbps, 1), four USB 2.0 ports with PHY, and CAN interface for vehicle and industrial networking.
  • Security  Hardware features including ARM TrustZone (TZ), boot security, cryptography, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection.
  • Power & Integration  On‑chip integrated power management elements and PLL/oscillator support (series datasheet) to simplify system power design.
  • Package & Temperature  624‑LFBGA / 624‑MAPBGA surface‑mount package (21 × 21 mm) and wide operating range from −40 °C to 125 °C.
  • Mounting  Surface mount package suitable for high‑density PCB designs.

Typical Applications

  • Infotainment systems  High‑performance multimedia and display processing for entertainment and information head units.
  • Telematics units  Processing and connectivity for navigation, communication and vehicle telematics modules.
  • Human‑Machine Interfaces (HMI)  Driving rich graphical user interfaces and touchscreen controls for embedded displays.
  • Display‑based clusters  Centralized display and instrument cluster processing with integrated graphics and video support.

Unique Advantages

  • Highly integrated multimedia platform: Combines an ARM® Cortex®‑A9 core with NEON™ SIMD and graphics/video acceleration from the i.MX6S series for consolidated processing and display tasks.
  • Flexible memory support: Native controller support for LPDDR2, LVDDR3 and DDR3 enables designers to select memory options to match performance and cost targets.
  • Comprehensive connectivity: Gigabit Ethernet, four USB 2.0 ports with PHY and CAN provide a broad I/O set for networked and peripheral‑rich systems.
  • Robust security building blocks: Multiple hardware security features including TrustZone, secure boot, cryptography and tamper detection address system integrity and data protection requirements.
  • Board‑level friendliness: 624‑MAPBGA 21 × 21 mm surface‑mount package and integrated power management features support compact, production‑oriented designs.
  • Wide operating temperature: −40 °C to 125 °C operating range supports designs deployed in demanding thermal environments.

Why Choose MCIMX6S4AVM08ADR?

The MCIMX6S4AVM08ADR positions itself as a compact, integration‑focused MPU for embedded multimedia and display systems. With a single ARM® Cortex®‑A9 core at 800 MHz, NEON™ SIMD support, dedicated graphics and video processing from the i.MX6S family, and a broad set of interfaces, it targets designs that require a balance of processing, graphics and connectivity in a single device.

Designers developing infotainment, telematics, HMI or display‑centric products will benefit from the memory flexibility, hardware security features and the wide operating temperature range provided by this 624‑MAPBGA packaged microprocessor.

If you would like pricing, availability or a formal quote for MCIMX6S4AVM08ADR, submit a request or inquiry to receive a personalized quotation and lead‑time information.

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