MCIMX6S5DVM10ABR

IC MPU I.MX6S 1.0GHZ 624MAPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6S 1 Core, 32-Bit 1.0GHz 624-MAPBGA (21x21)

Quantity 442 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6S
ManufacturerNXP USA Inc.
Manufacturing StatusNot For New Designs
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-MAPBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature0°C ~ 95°C (TJ)Package / Case624-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Speed1.0GHzSupplier Device Package624-MAPBGA (21×21)USBUSB 2.0 + PHY (4)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6S5DVM10ABR – IC MPU I.MX6S 1.0GHZ 624MAPBGA

The MCIMX6S5DVM10ABR is an NXP i.MX 6S series application processor featuring a single ARM® Cortex®-A9 core running at up to 1.0 GHz. It targets embedded multimedia-focused designs that require integrated graphics acceleration, flexible memory support, and a comprehensive set of connectivity and security features.

Designed for consumer and embedded markets, this processor combines multimedia processing (including 2D/3D graphics and video capabilities described in the i.MX6Solo/6DualLite family documentation) with integrated power management and a broad peripheral set to simplify system design.

Key Features

  • Core — Single ARM® Cortex®-A9 32-bit core operating at 1 GHz for general-purpose embedded processing.
  • Multimedia & Acceleration — Graphics acceleration and multimedia DSP support with NEON™ SIMD for enhanced media processing.
  • Memory Interfaces — Integrated controllers for LPDDR2, LVDDR3 and DDR3 memory types, supporting common embedded memory configurations.
  • Display & Input — Display interface controllers including LCD and keypad support for human-machine interfaces.
  • Connectivity — Integrated 10/100/1000 Mbps Ethernet (1), four USB 2.0 ports with PHY, and additional interfaces including CAN for vehicle and industrial networks.
  • Security & Boot — Security feature set includes ARM TrustZone, boot security, cryptography, RTIC, secure fusebox, secure JTAG, secure memory, secure RTC, and tamper detection.
  • Package & Mounting — Supplier device package: 624-MAPBGA (21×21); package case listed as 624-LFBGA; surface-mount design for compact embedded PCBs.
  • Operating Range & Compliance — Operating temperature range 0 °C to 95 °C; RoHS compliant and qualified for consumer applications.

Typical Applications

  • Web and Multimedia Tablets — Supports high-performance user interfaces and media playback using the Cortex-A9 core and integrated graphics acceleration.
  • Smart Displays & HMIs — LCD and keypad interface support enables responsive human-machine interfaces for consumer and embedded products.
  • Connected Devices — Gigabit Ethernet, multiple USB 2.0 ports with PHY, and CAN connectivity make the device suitable for networked embedded systems and gateway applications.
  • Multimedia Devices — 2D/3D graphics and video processing capabilities support applications requiring rich multimedia and UI rendering.

Unique Advantages

  • Integrated Multimedia Processing: Single-core Cortex-A9 with NEON SIMD and multimedia DSP support reduces the need for external accelerators in media-centric designs.
  • Flexible Memory Support: Built-in controllers for LPDDR2, LVDDR3 and DDR3 simplify memory selection and BOM optimization across multiple designs.
  • Comprehensive Security Suite: On-chip security features including TrustZone, secure boot, cryptography, and tamper detection help protect system integrity and IP.
  • Broad Peripheral Connectivity: Gigabit Ethernet, four USB 2.0 + PHY ports and CAN support provide multiple options for wired connectivity and peripheral interfacing.
  • Compact Surface-Mount Package: 624-ball MAPBGA (21×21) packaging enables dense PCB layouts for space-constrained embedded systems.
  • Series-Level Documentation: Part of the i.MX 6S family with detailed technical documentation and package information to support design and integration.

Why Choose MCIMX6S5DVM10ABR?

The MCIMX6S5DVM10ABR combines a 1.0 GHz ARM® Cortex®-A9 core with multimedia acceleration, broad memory support, and a rich set of connectivity and security features—positioning it for consumer and embedded products that require responsive UIs, robust media handling, and secure operation. Its compact BGA packaging and integrated capabilities help reduce system complexity and component count.

This processor is well suited for designers building multimedia tablets, smart displays, connected devices, and other consumer embedded systems that benefit from the i.MX 6S series documentation, integrated power management features, and industry-standard interfaces.

Request a quote or submit a procurement inquiry to receive pricing, availability, and lead-time information for the MCIMX6S5DVM10ABR.

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