MCIMX6S1AVM10AC

IC MPU I.MX6S 1GHZ 624MAPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6S 1 Core, 32-Bit 1GHz 624-MAPBGA (21x21)

Quantity 162 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6S
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-MAPBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Speed1GHzSupplier Device Package624-MAPBGA (21×21)USBUSB 2.0 + PHY (4)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6S1AVM10AC – IC MPU I.MX6S 1GHZ 624MAPBGA

The MCIMX6S1AVM10AC is an NXP Semiconductors microprocessor based on a single ARM® Cortex®-A9 core running at 1 GHz. Designed for embedded applications, it delivers multimedia-capable processing with integrated interfaces and security features for industrial-grade systems.

This device targets applications that require responsive, graphics-capable control and reliable operation across a wide temperature range, combining a 32-bit core architecture, multimedia acceleration, broad peripheral support and industrial qualification.

Key Features

  • Core — Single ARM® Cortex®-A9 core, 32-bit, operating at 1 GHz for general-purpose embedded processing.
  • Multimedia Acceleration — Integrated multimedia co-processors with NEON™ SIMD support and graphics acceleration for graphically rich user interfaces and video processing.
  • Memory Controllers — Supports LPDDR2, LVDDR3 and DDR3 memory interfaces to match a range of system memory designs.
  • Display and UI — Display interface controllers including LCD and keypad support for human‑machine interfaces.
  • Connectivity — Integrated 10/100/1000 Mbps Ethernet (1) plus USB 2.0 with PHY (4) and additional CAN interface for diverse peripheral and network connections.
  • Security — On-chip security capabilities including ARM TrustZone (TZ), boot security, cryptography, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection.
  • Power and Integration — Integrated power management features noted in the device series documentation to support system-level power control and efficiency.
  • Package and Mounting — 624-MAPBGA supplier device package (21 × 21 mm), 624-LFBGA package case; surface-mount device suitable for compact system designs.
  • Qualification and Temperature — Industrial qualification with an operating temperature range of −40 °C to 125 °C for deployment in demanding environments.
  • Compliance — RoHS compliant.

Typical Applications

  • Industrial HMI and control panels — Drives graphically rich displays and responsive user interfaces while meeting industrial temperature and reliability requirements.
  • Medical instrumentation — Provides multimedia processing and secure boot/security features suitable for advanced medical devices requiring secure operation.
  • Embedded networking equipment — Integrated Gigabit Ethernet and multiple USB ports support networking and peripheral connectivity in embedded routers, gateways or controllers.
  • Machine interfaces and monitoring — CAN and other peripheral interfaces enable sensor and actuator integration for machine control and monitoring systems.

Unique Advantages

  • Highly integrated multimedia platform: ARM Cortex‑A9 core combined with NEON SIMD and graphics acceleration enables responsive UI and video-capable embedded designs.
  • Flexible memory support: On-chip controllers for LPDDR2, LVDDR3 and DDR3 simplify memory selection across performance and cost trade-offs.
  • Broad peripheral set: Gigabit Ethernet, multiple USB 2.0 ports with PHY and CAN support a wide range of connectivity and I/O requirements.
  • Industrial-grade robustness: Qualified for industrial applications and rated for −40 °C to 125 °C operation to meet demanding environmental needs.
  • Comprehensive security features: Built-in TrustZone, boot and cryptography features help protect device integrity and IP at the system level.
  • Compact BGA packaging: 624-MAPBGA (21 × 21 mm) surface-mount package supports dense PCB layouts for space-constrained systems.

Why Choose MCIMX6S1AVM10AC?

The MCIMX6S1AVM10AC positions itself as a capable embedded application processor that balances single‑core performance with multimedia and security integration for industrial and medical systems. Its combination of a 1 GHz ARM® Cortex®‑A9 core, hardware multimedia support, flexible memory interfaces and extensive I/O makes it suitable for designs requiring responsive user interfaces, video capability and reliable connectivity.

Engineers building compact, rugged embedded products will find the device well-suited to systems that demand industrial temperature operation, on-chip security and a broad set of peripheral interfaces, backed by NXP Semiconductors product documentation and series-level technical detail.

Request a quote or submit a quote to begin sourcing MCIMX6S1AVM10AC for your next embedded design project.

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