MCIMX6S1AVM08ABR

IC MPU I.MX6S 800MHZ 624MAPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6S 1 Core, 32-Bit 800MHz 624-MAPBGA (21x21)

Quantity 441 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6S
ManufacturerNXP USA Inc.
Manufacturing StatusNot For New Designs
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-MAPBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Speed800MHzSupplier Device Package624-MAPBGA (21×21)USBUSB 2.0 + PHY (4)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6S1AVM08ABR – IC MPU I.MX6S 800MHZ 624MAPBGA

The MCIMX6S1AVM08ABR is an i.MX 6S series microprocessor IC featuring a single ARM® Cortex®-A9 core running at 800 MHz. It targets embedded multimedia-focused designs and provides a compact, high-integration solution for systems requiring display, video and peripheral connectivity.

Built with a broad set of interfaces and on-chip multimedia support, this device addresses applications that combine user interfaces, connectivity and multimedia processing while offering a high-density 624-MAPBGA package and extended operating temperature range.

Key Features

  • Core  ARM® Cortex®-A9 single core, 32-bit architecture at 800 MHz for deterministic application processing.
  • Multimedia Acceleration  Integrated graphics acceleration with series-level support for 2D/3D graphics and 1080p video processing as described in the i.MX6Solo/6DualLite datasheet.
  • Co-processors  Multimedia and NEON™ SIMD support for enhanced signal processing and media workloads.
  • Memory Interfaces  On-chip controllers for LPDDR2, LVDDR3 and DDR3 memory types to match system memory choices.
  • Display and HMI  Display interface controllers including LCD and keypad support for user interface implementations.
  • Connectivity  Integrated Ethernet 10/100/1000 Mbps (1), USB 2.0 with PHY (4), and additional CAN interface for robust system connectivity.
  • Security  Hardware security features including ARM TrustZone (TZ), boot security, cryptography, RTIC, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection.
  • Package and Mounting  624-MAPBGA supplier device package (21 × 21 mm); surface-mount package with BGA layout and 0.8 mm pitch package information referenced in the datasheet.
  • Operating Range  Extended operating temperature range from −40 °C to 125 °C for deployment in temperature-challenging environments.
  • Compliance  RoHS compliant.

Typical Applications

  • Web and Multimedia Tablets  Series-level documentation identifies web and multimedia tablets as target applications, leveraging the processor’s multimedia and display capabilities.
  • Display and Camera Systems  On-chip display controllers and series-level support for camera sensor interfaces make this device suitable for systems with integrated displays and image capture.
  • Embedded Networking and Gateways  Gigabit Ethernet, multiple USB ports and CAN support enable use in networked embedded devices and communication gateways.

Unique Advantages

  • Integrated multimedia and power features  Series documentation cites integrated power management plus 2D/3D graphics and 1080p video processing—reducing external component count for multimedia designs.
  • Flexible memory support  Native controllers for LPDDR2, LVDDR3 and DDR3 allow designers to optimize memory choice for cost and performance.
  • Comprehensive I/O set  Multiple USB 2.0 ports with PHY, Gigabit Ethernet and CAN provide a broad connectivity footprint for peripherals and networking.
  • Hardware security suite  On-chip features such as ARM TrustZone, secure JTAG and cryptography support system-level protection and secure boot strategies.
  • High-density package  624-MAPBGA (21 × 21 mm) packaging delivers a compact footprint for space-constrained embedded boards.
  • Extended temperature capability  −40 °C to 125 °C operating range enables deployment across a wide range of thermal environments.

Why Choose MCIMX6S1AVM08ABR?

The MCIMX6S1AVM08ABR combines a single ARM® Cortex®-A9 core at 800 MHz with a rich set of multimedia, security and connectivity features in a compact 624-MAPBGA package. It is positioned for embedded designs that require integrated display and media capabilities alongside robust peripheral support.

With flexible memory interfaces, multiple USB ports, Gigabit Ethernet and on-chip security primitives, this device supports designers building multimedia-focused embedded systems that need a balance of performance, integration and thermal endurance.

Request a quote or submit a purchasing inquiry for MCIMX6S1AVM08ABR to receive pricing and availability information tailored to your project needs.

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