MCIMX6QP6AVT8ABR

IC MPU I.MX6QP 852MHZ 624FCBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6QP 4 Core, 32-Bit 852MHz 624-FCBGA (21x21)

Quantity 195 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6QP
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCBGA (21x21)
Display & Interface ControllersHDMI, Keypad, LCD, LVDS, MIPI/DSI, ParallelECCNN/AEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS CodeN/AMoisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width4 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-FBGA, FCBGARAM ControllersDDR3, DDR3L, LPDDR2
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, A-HAB, CAAM, CSU, SJC, SNVSSpeed852MHzSupplier Device Package624-FCBGA (21×21)
USBUSB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6QP6AVT8ABR – ARM Cortex-A9 4-Core MPU, 852 MHz, 624-FCBGA

The MCIMX6QP6AVT8ABR is an NXP i.MX 6QP-series microprocessor featuring an ARM® Cortex®-A9 multicore architecture. Configured as a 4-core, 32-bit MPU running at 852 MHz, it targets graphics- and media-oriented embedded systems that require multi-core application processing combined with a wide set of peripheral interfaces.

Engineered for integration and flexible system design, the device provides a 64-bit DDR memory interface, extensive display and I/O support, hardware security primitives, and a compact 624-FCBGA (21 × 21 mm) package suitable for surface-mount applications across a broad operating temperature range.

Key Features

  • Processor Core — ARM® Cortex®-A9 architecture with 4 cores (32-bit) running at 852 MHz to support multi-threaded application workloads.
  • Memory Subsystem — 64-bit DDR memory interface compatible with DDR3, DDR3L and LPDDR2 memory controllers for high-bandwidth system memory.
  • Multimedia & DSP — Integrated multimedia co-processors with NEON™ SIMD acceleration to assist media and signal processing tasks.
  • Graphics & Display — Graphics acceleration plus multiple display controllers including HDMI, LVDS, MIPI/DSI and parallel LCD interfaces for rich user interfaces and video output.
  • Connectivity — Single Gigabit Ethernet (10/100/1000 Mbps), one SATA 3 Gbps port, multiple USB 2.0 ports with PHYs (three host + one OTG), and CAN for robust peripheral connectivity.
  • Security & System Management — Hardware security features such as ARM TrustZone, A-HAB, CAAM, CSU, SJC and SNVS to enable secure boot and runtime protection options.
  • Package & Mounting — 624-FCBGA (21 × 21 mm) surface-mount package suitable for board-level integration where small footprint and high pin count are required.
  • Operating Range — Industrial-grade operating temperature from −40 °C to 125 °C for deployment in thermally demanding environments.
  • Regulatory Status — RoHS compliant.

Typical Applications

  • High-performance infotainment — Drives multimedia playback, multiple displays and user interfaces using integrated graphics acceleration and multiple display controllers.
  • Reconfigurable instrument clusters — Enables complex UI and graphical dashboards with the MPU’s multi-core processing and extensive display connectivity.
  • Embedded multimedia systems — Supports video processing and sensor interfaces with dedicated multimedia co-processors and a broad set of I/O options.

Unique Advantages

  • Multi-core processing capability — Four ARM® Cortex®-A9 cores at 852 MHz provide parallel compute resources for responsive user interfaces and concurrent system tasks.
  • Comprehensive peripheral set — On-chip Ethernet, SATA, USB hosts/OTG, CAN and multiple display interfaces reduce external components and simplify BOM.
  • Flexible memory support — 64-bit DDR interface with DDR3/DDR3L/LPDDR2 controller compatibility enables scalable memory bandwidth for demanding applications.
  • Built-in security primitives — Hardware features including ARM TrustZone, CAAM and secure boot elements help implement device-level security strategies.
  • Wide thermal range — −40 °C to 125 °C operating range supports deployment in thermally challenging environments.
  • Compact, high-pin-count package — 624-FCBGA (21 × 21 mm) package facilitates integration of many I/Os in a limited board area.

Why Choose MCIMX6QP6AVT8ABR?

The MCIMX6QP6AVT8ABR combines quad-core ARM® Cortex®-A9 processing with a broad set of multimedia, display and high-speed interfaces in a compact FCBGA package. Its 64-bit DDR memory interface, NEON™ SIMD acceleration and on-chip connectivity options make it well suited to embedded designs that require concurrent multimedia processing and rich I/O integration.

This part is appropriate for design teams building graphics-oriented embedded systems that need a balance of compute, connectivity and system-level security, while maintaining a small board footprint and wide operating temperature capability.

Request a quote or submit a product inquiry to receive pricing, availability and technical support information for the MCIMX6QP6AVT8ABR.

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