MCIMX6QP6AVT8ABR
| Part Description |
ARM® Cortex®-A9 Microprocessor IC i.MX6QP 4 Core, 32-Bit 852MHz 624-FCBGA (21x21) |
|---|---|
| Quantity | 195 Available (as of October 9, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6QP |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 15 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A9 | Device Package | 624-FCBGA (21x21) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | ECCN | N/A | Ethernet | 10/100/1000Mbps (1) | ||
| Graphics Acceleration | Yes | HTS Code | N/A | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 4 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 125°C (TJ) | Package / Case | 624-FBGA, FCBGA | RAM Controllers | DDR3, DDR3L, LPDDR2 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | SATA | SATA 3Gbps (1) | ||
| Security Features | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | Speed | 852MHz | Supplier Device Package | 624-FCBGA (21×21) | ||
| USB | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | Voltage – I/O | 1.8V, 2.5V, 2.8V, 3.3V |
Overview of MCIMX6QP6AVT8ABR – ARM Cortex-A9 4-Core MPU, 852 MHz, 624-FCBGA
The MCIMX6QP6AVT8ABR is an NXP i.MX 6QP-series microprocessor featuring an ARM® Cortex®-A9 multicore architecture. Configured as a 4-core, 32-bit MPU running at 852 MHz, it targets graphics- and media-oriented embedded systems that require multi-core application processing combined with a wide set of peripheral interfaces.
Engineered for integration and flexible system design, the device provides a 64-bit DDR memory interface, extensive display and I/O support, hardware security primitives, and a compact 624-FCBGA (21 × 21 mm) package suitable for surface-mount applications across a broad operating temperature range.
Key Features
- Processor Core — ARM® Cortex®-A9 architecture with 4 cores (32-bit) running at 852 MHz to support multi-threaded application workloads.
- Memory Subsystem — 64-bit DDR memory interface compatible with DDR3, DDR3L and LPDDR2 memory controllers for high-bandwidth system memory.
- Multimedia & DSP — Integrated multimedia co-processors with NEON™ SIMD acceleration to assist media and signal processing tasks.
- Graphics & Display — Graphics acceleration plus multiple display controllers including HDMI, LVDS, MIPI/DSI and parallel LCD interfaces for rich user interfaces and video output.
- Connectivity — Single Gigabit Ethernet (10/100/1000 Mbps), one SATA 3 Gbps port, multiple USB 2.0 ports with PHYs (three host + one OTG), and CAN for robust peripheral connectivity.
- Security & System Management — Hardware security features such as ARM TrustZone, A-HAB, CAAM, CSU, SJC and SNVS to enable secure boot and runtime protection options.
- Package & Mounting — 624-FCBGA (21 × 21 mm) surface-mount package suitable for board-level integration where small footprint and high pin count are required.
- Operating Range — Industrial-grade operating temperature from −40 °C to 125 °C for deployment in thermally demanding environments.
- Regulatory Status — RoHS compliant.
Typical Applications
- High-performance infotainment — Drives multimedia playback, multiple displays and user interfaces using integrated graphics acceleration and multiple display controllers.
- Reconfigurable instrument clusters — Enables complex UI and graphical dashboards with the MPU’s multi-core processing and extensive display connectivity.
- Embedded multimedia systems — Supports video processing and sensor interfaces with dedicated multimedia co-processors and a broad set of I/O options.
Unique Advantages
- Multi-core processing capability — Four ARM® Cortex®-A9 cores at 852 MHz provide parallel compute resources for responsive user interfaces and concurrent system tasks.
- Comprehensive peripheral set — On-chip Ethernet, SATA, USB hosts/OTG, CAN and multiple display interfaces reduce external components and simplify BOM.
- Flexible memory support — 64-bit DDR interface with DDR3/DDR3L/LPDDR2 controller compatibility enables scalable memory bandwidth for demanding applications.
- Built-in security primitives — Hardware features including ARM TrustZone, CAAM and secure boot elements help implement device-level security strategies.
- Wide thermal range — −40 °C to 125 °C operating range supports deployment in thermally challenging environments.
- Compact, high-pin-count package — 624-FCBGA (21 × 21 mm) package facilitates integration of many I/Os in a limited board area.
Why Choose MCIMX6QP6AVT8ABR?
The MCIMX6QP6AVT8ABR combines quad-core ARM® Cortex®-A9 processing with a broad set of multimedia, display and high-speed interfaces in a compact FCBGA package. Its 64-bit DDR memory interface, NEON™ SIMD acceleration and on-chip connectivity options make it well suited to embedded designs that require concurrent multimedia processing and rich I/O integration.
This part is appropriate for design teams building graphics-oriented embedded systems that need a balance of compute, connectivity and system-level security, while maintaining a small board footprint and wide operating temperature capability.
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