MCIMX6S1AVM08AB

IC MPU I.MX6S 800MHZ 624MAPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6S 1 Core, 32-Bit 800MHz 624-MAPBGA (21x21)

Quantity 1,681 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6S
ManufacturerNXP USA Inc.
Manufacturing StatusNot For New Designs
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-MAPBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Speed800MHzSupplier Device Package624-MAPBGA (21×21)USBUSB 2.0 + PHY (4)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6S1AVM08AB – IC MPU I.MX6S 800MHZ 624MAPBGA

The MCIMX6S1AVM08AB is a single-core ARM® Cortex®-A9 microprocessor operating at 800 MHz, supplied by NXP Semiconductors as part of the i.MX 6S series. It targets embedded, multimedia-focused designs that require a compact, integrated application processor.

Built for multimedia-enabled embedded systems, the device combines a 32-bit Cortex-A9 core with integrated graphics acceleration, video processing and power management to support responsive user interfaces and connected applications.

Key Features

  • Core  ARM® Cortex®-A9 single core, 32-bit, running at 800 MHz for general-purpose application processing.
  • Multimedia & SIMD  Includes multimedia coprocessors and NEON™ SIMD to accelerate media and signal processing workloads.
  • Graphics & Video  Integrated graphics acceleration with support for 2D/3D processing and 1080p video processing as described in the device series documentation.
  • Memory Controllers  On-chip controllers for LPDDR2, LVDDR3 and DDR3 memory types to match common embedded DRAM choices.
  • Connectivity  Single 10/100/1000 Mbps Ethernet interface, four USB 2.0 ports with PHY, and CAN support for robust peripheral and network connectivity.
  • Display & HMI  Dedicated display/interface controllers for LCD and keypad integration to support human–machine interfaces.
  • Security  Hardware security features including ARM TrustZone (ARM TZ), boot security, cryptography, secure fusebox, secure JTAG, secure memory and secure RTC, plus tamper detection.
  • Package & Mounting  624-MAPBGA (21 × 21 mm) supplier device package (also referenced as 624‑LFBGA) with surface-mount mounting type.
  • Operating Range  Rated for an operating temperature range of −40 °C to 125 °C.
  • Compliance  RoHS compliant.

Typical Applications

  • Web and Multimedia Tablets  Supports multimedia playback and responsive UI workloads through integrated graphics acceleration and multimedia coprocessors.
  • Embedded HMI and Display Systems  LCD and keypad controllers plus graphics support make the device suitable for touch or button-driven human–machine interfaces.
  • Connected Embedded Devices  Integrated Ethernet, multiple USB 2.0 ports with PHY and CAN provide connectivity options for networked embedded systems.

Unique Advantages

  • Balanced single-core performance: Single 800 MHz Cortex‑A9 core provides deterministic, application-level processing for streamlined embedded designs.
  • Integrated multimedia acceleration: Built-in 2D/3D graphics and video processing capabilities reduce external chipset needs for media-rich applications.
  • Flexible memory support: Controllers for LPDDR2, LVDDR3 and DDR3 enable designers to choose memory solutions that match performance and cost targets.
  • Comprehensive security suite: Multiple hardware security blocks (ARM TZ, secure boot, cryptography, secure JTAG, secure memory, secure fusebox, secure RTC, tamper detection) help protect device integrity and sensitive assets.
  • Extensive I/O integration: Gigabit Ethernet, four USB 2.0 + PHY ports and CAN reduce external component count and simplify board-level integration.
  • Wide operating temperature: −40 °C to 125 °C rating supports deployment in temperature-challenging environments.

Why Choose MCIMX6S1AVM08AB?

The MCIMX6S1AVM08AB positions itself as an integrated application processor option for embedded systems that require multimedia capabilities, hardware security and a compact BGA footprint. Its ARM Cortex‑A9 core, multimedia accelerators and broad interface set make it suitable for designs that combine responsive user interfaces with networked connectivity.

Designers seeking a RoHS-compliant, surface-mount processor with flexible memory support, comprehensive security features and a wide operating temperature range will find this part aligns with embedded multimedia and connected device requirements, backed by NXP's i.MX 6S series documentation and technical detail.

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