 | | MCIMX6Q6AVT10AER | NXP Semiconductors | IC MPU I.MX6Q 1.0GHZ 624FCBGA | Microprocessors | 624-FCBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21×21) | 611 | |
 | | MCIMX6Q7CVT08AC | NXP Semiconductors | IC MPU I.MX6Q 800MHZ 624FCBGA | Microprocessors | 624-FCBGA (21x21) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21×21) | 1,161 | |
 | | MCIMX6Q7CVT08AD | NXP Semiconductors | IC MPU I.MX6Q 800MHZ 624FCBGA | Microprocessors | 624-FCBGA (21x21) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21×21) | 156 | |
 | | MCIMX6Q7CVT08AE | NXP Semiconductors | IC MPU I.MX6Q 800MHZ 624FCBGA | Microprocessors | 624-FCBGA (21x21) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21×21) | 149 | |
| N/A | | MCIMX6Q7CZK08AD | NXP Semiconductors | IC MPU I.MX6Q 800MHZ 569MAPBGA | Microprocessors | 569-MAPBGA (12x12) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 569-MAPBGA (12×12) | 1,461 | |
| N/A | | MCIMX6Q7CZK08AE | NXP Semiconductors | IC MPU I.MX6Q 800MHZ 569MAPBGA | Microprocessors | 569-MAPBGA (12x12) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 569-MAPBGA (12×12) | 744 | |
 | | MCIMX6QP4AVT1AA | NXP Semiconductors | IC MPU I.MX6QP 1.0GHZ 624FCBGA | Microprocessors | 624-FCBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21×21) | 1,127 | |
| N/A | | MCIMX6QP4AVT1AB | NXP Semiconductors | IC MPU I.MX6QP 1.0GHZ 624FCBGA | Microprocessors | 624-FCBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21×21) | 498 | |
 | | MCIMX6QP4AVT8AA | NXP Semiconductors | IC MPU I.MX6QP 852MHZ 624FCBGA | Microprocessors | 624-FCBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21×21) | 352 | |
| N/A | | MCIMX6QP4AVT8AB | NXP Semiconductors | IC MPU I.MX6QP 1.0GHZ 624FCBGA | Microprocessors | 624-FCBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21×21) | 969 | |
| N/A | | MCIMX6QP5EVT2AA | NXP Semiconductors | IC MPU I.MX6QP 1.2GHZ 624FCBGA | Microprocessors | 624-FCBGA (21x21) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21×21) | 736 | |
| N/A | | MCIMX6QP5EVT2AB | NXP Semiconductors | IC MPU I.MX6QP 1.2GHZ 624FCBGA | Microprocessors | 624-FCBGA (21x21) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21×21) | 1,233 | |
 | | MCIMX6QP5EYM1AA | NXP Semiconductors | IC MPU I.MX6QP 1.0GHZ 624FCPBGA | Microprocessors | 624-FCPBGA (21x21) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Package / Case: 624-LFBGA, FCBGA Supplier Device Package: 624-FCPBGA (21×21) | 325 | |
 | | MCIMX6QP5EYM1AB | NXP Semiconductors | IC MPU I.MX6QP 1.0GHZ 624FCPBGA | Microprocessors | 624-FCPBGA (21x21) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Package / Case: 624-LFBGA, FCBGA Supplier Device Package: 624-FCPBGA (21×21) | 1,510 | |
 | | MCIMX6QP6AVT1AA | NXP Semiconductors | IC MPU I.MX6QP 1.0GHZ 624FCBGA | Microprocessors | 624-FCBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21×21) | 1,118 | |
| N/A | | MCIMX6QP6AVT1AAR | NXP Semiconductors | IC MPU I.MX6QP 1.0GHZ 624FCBGA | Microprocessors | 624-FCBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21×21) | 363 | |
 | | MCIMX6QP6AVT1AB | NXP Semiconductors | IC MPU I.MX6QP 1.0GHZ 624FCBGA | Microprocessors | 624-FCBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21×21) | 462 | |
| N/A | | MCIMX6QP6AVT1ABR | NXP Semiconductors | I.MX 6 SERIES 32-BIT MPU, QUAD A | Microprocessors | 624-FCBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21×21) | 917 | |
 | | MCIMX6QP6AVT8AA | NXP Semiconductors | IC MPU I.MX6QP 852MHZ 624FCBGA | Microprocessors | 624-FCBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21×21) | 601 | |
| N/A | | MCIMX6QP6AVT8AB | NXP Semiconductors | IC MPU I.MX6QP 852MHZ 624FCBGA | Microprocessors | 624-FCBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21×21) | 1,069 | |