 | | MCIMX6L8DVN10AB | NXP Semiconductors | IC MPU I.MX6SL 1.0GHZ 432MAPBGA | Microprocessors | 432-MAPBGA (13x13) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Voltage – I/O: 1.2V, 1.8V, 3.0V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 432-MAPBGA (13×13) | 288 | |
 | | MCIMX6L8DVN10ABR | NXP Semiconductors | IC MPU I.MX6SL 1.0GHZ 432MAPBGA | Microprocessors | 432-MAPBGA (13x13) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Voltage – I/O: 1.2V, 1.8V, 3.0V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 432-MAPBGA (13×13) | 1,485 | |
 | | MCIMX6L8DVN10AC | NXP Semiconductors | IC MPU I.MX6SL 1.0GHZ 432MAPBGA | Microprocessors | 432-MAPBGA (13x13) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Voltage – I/O: 1.2V, 1.8V, 3.0V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 432-MAPBGA (13×13) | 1,092 | |
 | | MCIMX6L8DVN10ACR | NXP Semiconductors | IC MPU I.MX6SL 1.0GHZ 432MAPBGA | Microprocessors | 432-MAPBGA (13x13) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Voltage – I/O: 1.2V, 1.8V, 3.0V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 432-MAPBGA (13×13) | 780 | |
 | | MCIMX6Q4AVT08AC | NXP Semiconductors | IC MPU I.MX6Q 852MHZ 624FCBGA | Microprocessors | 624-FCBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21×21) | 783 | |
 | | MCIMX6Q4AVT08ACR | NXP Semiconductors | IC MPU I.MX6Q 852MHZ 624FCBGA | Microprocessors | 624-FCBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21×21) | 38 | |
 | | MCIMX6Q4AVT08AD | NXP Semiconductors | IC MPU I.MX6Q 852MHZ 624FCBGA | Microprocessors | 624-FCBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21×21) | 1,657 | |
 | | MCIMX6Q4AVT08ADR | NXP Semiconductors | IC MPU I.MX6Q 852MHZ 624FCBGA | Microprocessors | 624-FCBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21×21) | 686 | |
| N/A | | MCIMX6Q4AVT08AE | NXP Semiconductors | IC MPU I.MX6Q 852MHZ 624FCBGA | Microprocessors | 624-FCBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21×21) | 3 | |
| N/A | | MCIMX6Q4AVT08AER | NXP Semiconductors | IC MPU I.MX6Q 852MHZ 624FCBGA | Microprocessors | 624-FCBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21×21) | 1,131 | |
 | | MCIMX6Q4AVT10AC | NXP Semiconductors | IC MPU I.MX6Q 1.0GHZ 624FCBGA | Microprocessors | 624-FCBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21×21) | 236 | |
 | | MCIMX6Q4AVT10ACR | NXP Semiconductors | IC MPU I.MX6Q 1.0GHZ 624FCBGA | Microprocessors | 624-FCBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21×21) | 59 | |
 | | MCIMX6Q4AVT10AD | NXP Semiconductors | IC MPU I.MX6Q 1.0GHZ 624FCBGA | Microprocessors | 624-FCBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21×21) | 650 | |
 | | MCIMX6Q4AVT10ADR | NXP Semiconductors | IC MPU I.MX6Q 1.0GHZ 624FCBGA | Microprocessors | 624-FCBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21×21) | 1,589 | |
| N/A | | MCIMX6Q4AVT10AE | NXP Semiconductors | IC MPU I.MX6Q 1.0GHZ 624FCBGA | Microprocessors | 624-FCBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21×21) | 268 | |
| N/A | | MCIMX6Q4AVT10AER | NXP Semiconductors | IC MPU I.MX6Q 1.0GHZ 624FCBGA | Microprocessors | 624-FCBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21×21) | 1,772 | |
 | | MCIMX6Q5EYM10AC | NXP Semiconductors | IC MPU I.MX6Q 1.0GHZ 624FCPBGA | Microprocessors | 624-FCPBGA (21x21) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 624-LFBGA, FCBGA Supplier Device Package: 624-FCPBGA (21×21) | 39 | |
 | | MCIMX6Q5EYM10ACR | NXP Semiconductors | IC MPU I.MX6Q 1.0GHZ 624FCPBGA | Microprocessors | 624-FCPBGA (21x21) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 624-LFBGA, FCBGA Supplier Device Package: 624-FCPBGA (21×21) | 708 | |
 | | MCIMX6Q5EYM10AD | NXP Semiconductors | IC MPU I.MX6Q 1.0GHZ 624FCPBGA | Microprocessors | 624-FCPBGA (21x21) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 624-LFBGA, FCBGA Supplier Device Package: 624-FCPBGA (21×21) | 1,284 | |
 | | MCIMX6Q5EYM10ADR | NXP Semiconductors | IC MPU I.MX6Q 1.0GHZ 624FCPBGA | Microprocessors | 624-FCPBGA (21x21) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 624-LFBGA, FCBGA Supplier Device Package: 624-FCPBGA (21×21) | 614 | |