MCIMX6Q5EYM10ADR

IC MPU I.MX6Q 1.0GHZ 624FCPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6Q 4 Core, 32-Bit 1.0GHz 624-FCPBGA (21x21)

Quantity 1,192 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6Q
ManufacturerNXP USA Inc.
Manufacturing StatusNot For New Designs
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCPBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width4 Core, 32-Bit
Operating Temperature-20°C ~ 105°C (TJ)Package / Case624-LFBGA, FCBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed1.0GHzSupplier Device Package624-FCPBGA (21×21)
USBUSB 2.0 + PHY (4)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6Q5EYM10ADR – IC MPU I.MX6Q 1.0GHZ 624FCPBGA

The MCIMX6Q5EYM10ADR is an NXP i.MX 6Quad series multimedia applications microprocessor built around a quad ARM® Cortex®-A9 architecture running at 1.0 GHz. It is designed for embedded and industrial multimedia applications that require multi-core processing, graphics acceleration and a broad set of peripheral interfaces.

Targeted use cases include display-centric systems, multimedia processing and connected embedded devices. The device combines processing performance with integrated I/O and security features to simplify system design in industrial and embedded product families.

Key Features

  • Quad ARM® Cortex®-A9 Cores: Four 32-bit cores operating at 1 GHz for parallel processing of application and multimedia workloads.
  • Multimedia Acceleration: On-chip 2D/3D graphics and video processing capabilities, with NEON™ SIMD for enhanced multimedia and signal processing.
  • Memory Interfaces: Supports LPDDR2, LVDDR3 and DDR3 memory controllers for flexible system memory configurations.
  • High-speed Connectivity: Integrated 10/100/1000 Mbps Ethernet and a SATA 3 Gbps interface for networking and storage connectivity.
  • USB and Peripheral I/O: Four USB 2.0 ports with PHY and additional interfaces including CAN for robust peripheral connectivity.
  • Display and Human Interface: Display interface controllers supporting LCD and keypad integration for HMI and embedded display systems.
  • Comprehensive Security: Security features provided include ARM TrustZone (TZ), boot security, cryptography, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection.
  • Package and Mounting: 624-FCPBGA package (21 × 21 mm) in a surface-mount form factor suitable for compact embedded boards.
  • Operating Range: Rated for operation from −20 °C to 105 °C, supporting a wide range of industrial temperature requirements.
  • RoHS Compliance: Device is RoHS compliant for environmental and manufacturing considerations.

Typical Applications

  • Industrial HMI and Control Panels: Drives LCD displays and keypad interfaces while handling application logic and connectivity for industrial systems.
  • Multimedia and Video Devices: Utilizes on-chip 2D/3D graphics and video processing for display-based multimedia applications.
  • Networked Embedded Systems: Integrates gigabit Ethernet and SATA connectivity for networked appliances and storage-capable embedded platforms.
  • Connected Sensor and Peripheral Gateways: Supports interfaces such as USB and CAN for attaching sensors, wireless modules and peripheral devices.
  • Camera and Imaging Systems: Interfaces with camera sensors and display subsystems for vision and imaging applications.

Unique Advantages

  • Highly Integrated Multimedia Platform: Combines quad-core processing, graphics acceleration and video processing to reduce external components and simplify BOM.
  • Extensive I/O Set: Built-in gigabit Ethernet, SATA 3 Gbps, multiple USB ports and CAN enable diverse connectivity options without additional controllers.
  • Flexible Memory Support: Compatibility with LPDDR2, LVDDR3 and DDR3 memory types allows designers to optimize performance and cost for target applications.
  • Robust Security Features: A broad set of hardware security functions (ARM TZ, secure boot, cryptography, secure JTAG, secure memory and tamper detection) supports secure system designs.
  • Industrial Temperature Capability: Rated from −20 °C to 105 °C for deployment in a wide range of environmental conditions.
  • Family Scalability: Part of the i.MX 6Dual/6Quad product family, enabling design reuse and scalability across related product variants.

Why Choose MCIMX6Q5EYM10ADR?

The MCIMX6Q5EYM10ADR delivers a balanced combination of multi-core CPU performance, integrated multimedia acceleration, and a comprehensive set of interfaces suited to embedded and industrial multimedia systems. Its security features and flexible memory support make it appropriate for designs that require both performance and system-level protection.

As a member of the i.MX 6Quad family from NXP, the device supports scalable design approaches across related processors, helping teams standardize hardware and firmware while addressing connectivity, display and storage requirements in compact 624-FCPBGA packaging.

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