MCIMX6Q5EYM10AC

IC MPU I.MX6Q 1.0GHZ 624FCPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6Q 4 Core, 32-Bit 1.0GHz 624-FCPBGA (21x21)

Quantity 923 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6Q
ManufacturerNXP USA Inc.
Manufacturing StatusNot For New Designs
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCPBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width4 Core, 32-Bit
Operating Temperature-20°C ~ 105°C (TJ)Package / Case624-LFBGA, FCBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed1.0GHzSupplier Device Package624-FCPBGA (21×21)
USBUSB 2.0 + PHY (4)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6Q5EYM10AC – IC MPU I.MX6Q 1.0GHZ 624FCPBGA

The MCIMX6Q5EYM10AC is an NXP i.MX 6Quad series application processor implementing a quad ARM® Cortex®-A9, 32‑bit architecture running at 1.0 GHz. Designed for embedded multimedia applications, the device targets industrial and embedded markets that require multi‑core CPU performance, integrated multimedia processing and a wide set of peripheral interfaces.

As part of the i.MX 6Dual/6Quad family, this processor offers integrated 2D/3D graphics and 1080p video processing capabilities, a 64‑bit DDR memory interface, and on‑chip power management features that support compact, highly integrated system designs.

Key Features

  • Processor Core — ARM® Cortex®‑A9, 4 cores, 32‑bit running at 1 GHz for parallel application and multimedia workloads.
  • Multimedia Acceleration — Integrated 2D and 3D graphics processors and 1080p video processing (series-level feature) to support rich user interfaces and video playback.
  • Memory — RAM controllers for LPDDR2, LVDDR3 and DDR3; series documentation references a 64‑bit DDR3/DDR3L/LPDDR2‑800 memory interface for high bandwidth system memory.
  • Connectivity — Gigabit Ethernet (10/100/1000 Mbps, 1), SATA 3 Gbps (1), multiple USB 2.0 ports with PHY (4), and CAN interface support for broad peripheral connectivity.
  • Security — Hardware security features including ARM TrustZone (TZ), boot security, cryptography, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection for protected system design.
  • System Integration — On‑chip peripherals and integrated power management (series-level) reduce external component count and simplify BOMs for embedded systems.
  • Package and Mounting — 624‑FCPBGA supplier device package (21 × 21 mm) with FCPBGA/FCBGA package options and 0.8 mm ball pitch (package details per datasheet); surface mount device.
  • Operating Range — Industrial operating temperature range from −20 °C to 105 °C to support elevated temperature deployments.
  • Compliance — RoHS compliant.

Typical Applications

  • Multimedia Systems — High‑performance multimedia playback and UI control leveraging integrated 2D/3D graphics and 1080p video processing.
  • Human‑Machine Interfaces (HMI) — Display‑driven embedded HMI and control panels using the processor’s display and keypad interface controllers.
  • Industrial Embedded Controllers — Networked industrial products requiring Ethernet, CAN and SATA connectivity combined with robust security features.
  • Imaging and Sensor Gateways — Camera and sensor interfacing for systems that benefit from onboard video processing and multiple high‑speed interfaces.

Unique Advantages

  • Quad‑core ARM® Compute — Four Cortex‑A9 cores at 1.0 GHz enable concurrent application and multimedia tasks for responsive embedded systems.
  • Integrated Multimedia Engine — On‑chip graphics and video processing reduce the need for external accelerators and simplify software stacks for visual applications.
  • Broad Memory Support — Support for LPDDR2, LVDDR3 and DDR3 with a 64‑bit memory interface provides flexibility for different performance and cost targets.
  • Comprehensive I/O — Gigabit Ethernet, SATA, multiple USB 2.0 ports with PHY, and CAN give designers multiple options for connectivity and storage integration.
  • Hardware Security Suite — Built‑in TrustZone and secure boot/cryptography features help protect system integrity and sensitive data.
  • Industrial Temperature and Packaging — Surface-mount 624‑FCPBGA package and −20 °C to 105 °C operating range accommodate compact boards in elevated temperature environments.

Why Choose MCIMX6Q5EYM10AC?

The MCIMX6Q5EYM10AC delivers a balanced combination of multicore processing, multimedia acceleration and extensive peripheral integration suitable for embedded and industrial multimedia applications. Its series‑level features—such as integrated graphics/video processing, broad memory controller support and a diverse set of high‑speed interfaces—enable designers to consolidate system functions and reduce external components.

Built by NXP Semiconductors and supported by comprehensive technical documentation, this i.MX 6Quad device is appropriate for development teams seeking a scalable, well‑documented platform for connected embedded products that require performance, integration and security.

Request a quote or submit an inquiry today to obtain pricing, availability and lead‑time information for the MCIMX6Q5EYM10AC.

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