MCIMX6Q5EYM10ACR

IC MPU I.MX6Q 1.0GHZ 624FCPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6Q 4 Core, 32-Bit 1.0GHz 624-FCPBGA (21x21)

Quantity 534 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6Q
ManufacturerNXP USA Inc.
Manufacturing StatusNot For New Designs
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCPBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width4 Core, 32-Bit
Operating Temperature-20°C ~ 105°C (TJ)Package / Case624-LFBGA, FCBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed1.0GHzSupplier Device Package624-FCPBGA (21×21)
USBUSB 2.0 + PHY (4)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6Q5EYM10ACR – IC MPU I.MX6Q 1.0GHZ 624FCPBGA

The MCIMX6Q5EYM10ACR is a quad-core ARM® Cortex®-A9 microprocessor operating at 1.0 GHz, delivered in a 624-FCPBGA (21 × 21 mm) package for surface-mount applications. It is part of the i.MX 6Quad family and is designed for embedded multimedia and industrial applications that require multi-core processing, graphics acceleration and a broad set of peripheral interfaces.

This device combines high-performance application cores with integrated multimedia and security features, offering a compact, connectivity-rich platform for HMI, networking, storage and multimedia systems in industrial and embedded products.

Key Features

  • Core & Performance  Quad ARM® Cortex®-A9 cores (32-bit) running at 1 GHz, providing multi-threaded application processing for embedded workloads.
  • Media & SIMD Acceleration  Includes multimedia co-processor support and NEON™ SIMD for accelerated media and signal-processing tasks; integrates 2D/3D graphics and video processing capabilities as described for the i.MX 6 family.
  • Memory Interfaces  64-bit memory interface with controllers for LPDDR2, LVDDR3 and DDR3, enabling flexible memory configurations for performance and capacity tradeoffs.
  • Display & User Interface  On-chip display interface controllers support LCD and keypad connections for human-machine interface designs.
  • Connectivity & Peripherals  Integrated Ethernet 10/100/1000 Mbps (1), SATA 3 Gbps (1), USB 2.0 with PHY (4 ports), and CAN interface provide broad I/O for networking, storage and peripheral expansion.
  • Security & Trusted Boot  Hardware security features include ARM TrustZone, boot security, cryptography engines, secure fusebox, secure JTAG, secure memory and tamper detection to support protected boot and runtime operation.
  • Package & Mounting  624-ball FCPBGA package (21 × 21 mm, 0.8 mm pitch) offered as a surface-mount device suited for compact board designs.
  • Operating Range  Specified operating temperature range of −20 °C to 105 °C for demanding embedded environments.

Typical Applications

  • Industrial HMI and Control  Drives advanced user interfaces and display subsystems using the integrated LCD controller and graphics acceleration for responsive control panels and operator displays.
  • Multimedia Systems  Handles video and graphics workloads with dedicated media processing and NEON SIMD acceleration for 1080p-class processing as provided by the i.MX 6 family.
  • Networking and Edge Storage  Supports wired networking and local storage with Gigabit Ethernet and SATA 3 Gbps, plus multiple USB 2.0 ports for peripheral connectivity.
  • Embedded Communication Nodes  Offers CAN and abundant peripheral interfaces for integration into industrial communication and sensor gateway designs.

Unique Advantages

  • Multimedia-Ready Platform: Combines quad Cortex-A9 cores with multimedia co-processors and NEON SIMD to accelerate graphics, video and signal-processing tasks without external ASICs.
  • Broad On-Chip Connectivity: Integrated Gigabit Ethernet, SATA, multiple USB 2.0 ports and CAN reduce board-level complexity and simplify system-level design.
  • Flexible Memory Support: Support for LPDDR2, LVDDR3 and DDR3 via a 64-bit memory interface allows designers to optimize for cost or performance.
  • Security-Focused Features: On-chip boot and runtime security capabilities (ARM TrustZone, cryptography, secure JTAG/fusebox) help implement protected systems and secure boot flows.
  • Industrial Temperature Capability: Rated for −20 °C to 105 °C operation to meet a range of embedded and industrial environmental requirements.
  • Compact, Manufacturable Package: 624-FCPBGA (21 × 21 mm, 0.8 mm pitch) surface-mount package supports dense, manufacturable board layouts.

Why Choose MCIMX6Q5EYM10ACR?

The MCIMX6Q5EYM10ACR positions itself as a high-performance, integrated microprocessor for embedded and industrial multimedia applications. With a quad-core ARM® Cortex®-A9 architecture, multimedia acceleration, comprehensive peripheral set and hardware security features, it delivers a balanced platform for designers focusing on connectivity, user interface and media capabilities.

As part of the i.MX 6Quad family, this device offers a consistent platform for scalable designs that require multi-core processing, robust I/O and secure boot/runtime capabilities—helping streamline development across product variants and deployment scenarios.

Request a quote or submit an inquiry to receive pricing and availability information for MCIMX6Q5EYM10ACR and to discuss how this i.MX 6Quad processor can meet your embedded design requirements.

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