MCIMX6Q5EYM10AER

IC MPU I.MX6Q 1.0GHZ 624FCPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6Q 4 Core, 32-Bit 1.0GHz 624-FCPBGA (21x21)

Quantity 1,210 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6Q
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCPBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width4 Core, 32-Bit
Operating Temperature-20°C ~ 105°C (TJ)Package / Case624-LFBGA, FCBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed1.0GHzSupplier Device Package624-FCPBGA (21×21)
USBUSB 2.0 + PHY (4)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6Q5EYM10AER – IC MPU I.MX6Q 1.0GHZ 624FCPBGA

The MCIMX6Q5EYM10AER is a quad-core ARM® Cortex®-A9 microprocessor operating at 1.0 GHz, designed for embedded multimedia and industrial applications. Built on the i.MX 6Q family architecture, it combines multi-core processing, NEON™ SIMD acceleration and dedicated graphics/video capabilities to support advanced user interfaces and multimedia workloads.

This device targets designers of connected embedded systems that require integrated connectivity, storage and secure boot features while maintaining a compact surface-mount package and wide operating temperature range.

Key Features

  • Core — Quad ARM® Cortex®-A9 cores, 32-bit, operating at 1 GHz to support multi-threaded embedded applications.
  • Multimedia & Acceleration — NEON™ SIMD co-processor and graphics acceleration with 2D/3D and 1080p video processing listed in the i.MX6Dual/6Quad datasheet for the series.
  • Memory Support — Memory interface support for LPDDR2, LVDDR3 and DDR3; datasheet documents a 64-bit DDR3/DDR3L/LPDDR2-800 memory interface for the series.
  • Connectivity & Storage — Integrated Gigabit Ethernet (10/100/1000 Mbps, 1), SATA 3 Gbps (1), USB 2.0 with PHY (4 ports) and CAN for broad peripheral connectivity and local storage options.
  • Security — Hardware security features including ARM TrustZone, boot security, cryptography, RTIC, secure fusebox, secure JTAG, secure memory and secure RTC, plus tamper detection.
  • Package & Mounting — 624-FCPBGA supplier device package (21 × 21 mm, 0.8 mm pitch) in a 624-LFBGA/FCBGA family; surface-mount mounting type.
  • Operating Range — Specified operating temperature range from −20 °C to 105 °C for deployment in a range of embedded environments.
  • Integration & Power — Series datasheet references integrated power management and on-chip regulators to simplify system power design and sequencing.

Typical Applications

  • Human-Machine Interfaces (HMIs) — Drives advanced touchscreen UIs and multimedia displays using the integrated graphics and video processing capabilities.
  • Industrial Control & Monitoring — Provides multi-core processing and secure boot features suitable for industrial embedded controllers and operator panels.
  • Networking & Gateways — Gigabit Ethernet, multiple USB ports and CAN support make the device suitable for edge networking and protocol gateway applications.
  • Media & Video Systems — 1080p-capable video processing and 2D/3D graphics acceleration support local media playback and video display subsystems.

Unique Advantages

  • Highly integrated multimedia platform: NEON SIMD plus graphics and video processing reduce the need for external accelerators for rich UIs and media playback.
  • Broad memory flexibility: Support for LPDDR2, LVDDR3 and DDR3 memory types enables designers to choose the memory that best fits performance and cost targets.
  • Comprehensive connectivity: On-chip Gigabit Ethernet, SATA, multiple USB 2.0 ports and CAN consolidate interfaces and lower BOM complexity.
  • Robust security feature set: Multiple hardware security mechanisms — including TrustZone and secure boot options — help protect system integrity from power-up.
  • Compact, manufacturable package: 624-FCPBGA 21 × 21 mm surface-mount package provides a dense footprint suitable for space-constrained embedded boards.
  • Wide operating range: −20 °C to 105 °C operation accommodates many industrial and embedded deployment environments.

Why Choose MCIMX6Q5EYM10AER?

The MCIMX6Q5EYM10AER positions itself as a balanced, highly integrated quad-core application processor for embedded designs that require multimedia capabilities, broad connectivity and hardware security. Its combination of ARM® Cortex®-A9 cores, NEON acceleration, graphics/video processing and flexible memory support targets engineers building HMIs, industrial controllers, networking appliances and media systems.

Designed for longevity and system consolidation, the device supports common embedded memory types, on-chip power elements referenced in the series datasheet, and a compact 624-FCPBGA package—providing a practical platform for scalable, secure and connected product designs.

If you would like pricing, availability or to submit a quote request for MCIMX6Q5EYM10AER, please request a quote or contact sales through your preferred procurement channel.

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