MCIMX6Q5EYM12AE

IC MPU I.MX6Q 1.2GHZ 624FCPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6Q 4 Core, 32-Bit 1.2GHz 624-FCPBGA (21x21)

Quantity 599 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6Q
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCPBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width4 Core, 32-Bit
Operating Temperature-20°C ~ 105°C (TJ)Package / Case624-LFBGA, FCBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed1.2GHzSupplier Device Package624-FCPBGA (21×21)
USBUSB 2.0 + PHY (4)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6Q5EYM12AE – IC MPU I.MX6Q 1.2GHZ 624FCPBGA

The MCIMX6Q5EYM12AE is an NXP i.MX 6Quad multimedia applications microprocessor featuring a quad ARM® Cortex®-A9 core architecture running at 1.2 GHz. Engineered for embedded and industrial multimedia products, it combines multi-core processing, graphics acceleration and a broad set of high-speed interfaces to support advanced HMI, video and connectivity use cases.

Designed for integrated systems, this device offers on-chip multimedia acceleration, diverse memory controller support and comprehensive security features—delivering a compact, surface-mount solution in a 624-FCPBGA (21 × 21 mm, 0.8 mm pitch) package.

Key Features

  • Core & Architecture Quad ARM® Cortex®-A9 32-bit processor cores operating at 1.2 GHz for concurrent application and multimedia workloads.
  • Multimedia & Graphics Integrated graphics acceleration and multimedia-capable co-processors including NEON™ SIMD to support rich user interfaces and media processing.
  • Memory Subsystem Built-in memory controllers compatible with LPDDR2, LVDDR3 and DDR3 to accommodate a range of system memory configurations.
  • Display & HMI Display interface controllers with LCD and keypad support for human-machine interfaces and on-device displays.
  • High-Speed Connectivity Gigabit Ethernet (10/100/1000 Mbps), SATA 3 Gbps (1) and four USB 2.0 ports with PHY provide broad wired I/O for storage and networking.
  • Peripheral Interfaces Additional interfaces include CAN for vehicle-style or industrial network integration and multiple peripheral buses for camera and sensor connections.
  • Security & Reliability Hardware security features including ARM TrustZone, Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC and Tamper Detection to help protect system integrity.
  • Package & Thermal 624-FCPBGA surface-mount package (21 × 21 mm, 0.8 mm pitch). Rated for an operating temperature range of −20 °C to 105 °C.
  • Standards & Compliance RoHS compliant for environmental regulation alignment.

Typical Applications

  • Industrial HMI Drive interactive displays and touchscreen interfaces using the integrated graphics acceleration and LCD controller.
  • Multimedia Devices Support video playback and media-rich applications leveraging the NEON SIMD acceleration and multimedia co-processors.
  • Embedded Networking & Storage Enable networked appliances and embedded servers with Gigabit Ethernet, SATA 3 Gbps and multiple USB 2.0 ports.
  • Imaging & Vision Systems Interface with camera sensors and process image data using the processor’s multimedia capabilities and peripheral interfaces.

Unique Advantages

  • Integrated Multimedia Processing: On-chip multimedia co-processors and NEON SIMD provide hardware acceleration for media and signal processing tasks.
  • Flexible Memory Support: Native support for LPDDR2, LVDDR3 and DDR3 memory types enables designers to match performance and cost targets.
  • Comprehensive Connectivity: A combination of Gigabit Ethernet, SATA, USB with PHY and CAN simplifies system integration for networking, storage and control.
  • Robust Security Suite: Multiple hardware security features protect boot, runtime and sensitive keys or storage areas for secure embedded deployments.
  • Compact, Production-Ready Package: The 624-FCPBGA (21 × 21 mm, 0.8 mm pitch) surface-mount package delivers a high-pin-count solution in a compact footprint.
  • Industrial Temperature Range: Rated from −20 °C to 105 °C to support demanding embedded and industrial environments.

Why Choose MCIMX6Q5EYM12AE?

The MCIMX6Q5EYM12AE positions itself as a high-performance, highly integrated application processor for embedded and industrial multimedia products. With a quad-core Cortex-A9 architecture at 1.2 GHz, broad memory compatibility, hardware multimedia acceleration and a wide set of high-speed interfaces, it is well suited to designs requiring responsive user interfaces, multimedia handling and robust connectivity.

Backed by NXP Semiconductors’ i.MX 6 series documentation and package options, this device offers a compact form factor and comprehensive security features that support scalability and system-level integration for professional embedded designs.

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