MCIMX6Q5EZK08AD

IC MPU I.MX6Q 800MHZ 569MAPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6Q 4 Core, 32-Bit 800MHz 569-MAPBGA (12x12)

Quantity 205 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6Q
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package569-MAPBGA (12x12)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width4 Core, 32-Bit
Operating Temperature-20°C ~ 105°C (TJ)Package / Case569-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed800MHzSupplier Device Package569-MAPBGA (12×12)
USBUSB 2.0 + PHY (4)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6Q5EZK08AD – ARM Cortex-A9 4-Core 800 MHz MPU

The MCIMX6Q5EZK08AD is an NXP i.MX 6Q series multimedia microprocessor featuring a quad-core ARM® Cortex®-A9 architecture running up to 800 MHz. Designed for embedded systems requiring integrated graphics, multimedia acceleration and a broad set of peripheral interfaces, this device targets applications that need balanced processing performance and extensive I/O integration.

Built in a 569-MAPBGA (12 × 12 mm) package and rated for operation from -20 °C to 105 °C, the device combines multi-core compute, memory controller support and hardware security to simplify system design in connected and media-rich products.

Key Features

  • CPU Core  Quad ARM® Cortex®-A9, 32-bit cores operating up to 800 MHz for parallel processing of application and multimedia tasks.
  • Multimedia and SIMD  Integrated multimedia co-processors and NEON™ SIMD support for accelerated media and signal-processing workloads.
  • Memory Interfaces  Memory controller support for LPDDR2, LVDDR3 and DDR3; datasheet indicates a 2 × 32-bit LPDDR2-800 memory interface for high-bandwidth memory connectivity.
  • Graphics and Video  On-chip 2D/3D graphics acceleration and 1080p-capable video processing to support rich user interfaces and video playback.
  • Rich Connectivity  Integrated interfaces including Gigabit Ethernet (10/100/1000 Mbps), SATA 3 Gbps (1), USB 2.0 with PHY (4 ports) and CAN for a wide range of peripheral and network connections.
  • Display and UI  Dedicated display controllers supporting LCD and keypad interfaces to enable embedded HMI implementations.
  • Security  Comprehensive hardware security features including ARM TrustZone, boot security, cryptography support, secure fusebox, secure JTAG, secure memory and secure RTC plus tamper detection.
  • Package and Mounting  569-MAPBGA supplier package (12 × 12 mm, 0.4 mm pitch), surface-mount construction suitable for compact embedded assemblies.
  • Operating Range and Compliance  Operating temperature from -20 °C to 105 °C and RoHS-compliant for standard environmental requirements.

Typical Applications

  • High-end mobile Internet devices  Multi-core processing and multimedia acceleration support responsive browsing and media playback in portable products.
  • Portable media players and HD video devices  Integrated 2D/3D graphics and 1080p video processing enable playback and user-interface rendering for media-centric applications.
  • Embedded HMI and industrial displays  LCD controller and keypad support plus robust thermal range allow deployment in embedded human-machine interfaces.
  • Connectivity-enabled systems  Built-in Gigabit Ethernet, SATA, USB and CAN interfaces facilitate networking, storage and peripheral integration in connected devices.

Unique Advantages

  • Multi-core processing with multimedia acceleration: Quad ARM Cortex-A9 cores plus NEON™ SIMD and multimedia co-processors provide compute and media throughput for UI and video tasks.
  • Broad peripheral integration: On-chip Gigabit Ethernet, SATA, multiple USB 2.0 ports, CAN and display controllers reduce external components and simplify board design.
  • Memory flexibility: Support for LPDDR2, LVDDR3 and DDR3 gives designers options for balancing cost, performance and power in system memory selection.
  • Comprehensive hardware security: Multiple security mechanisms including TrustZone, secure JTAG and secure memory help protect boot and runtime assets.
  • Compact, mountable package: 569-MAPBGA (12 × 12 mm) surface-mount package enables high-density PCBs for space-constrained designs.
  • Extended operating temperature: Rated from -20 °C to 105 °C for use in a range of embedded environments.

Why Choose MCIMX6Q5EZK08AD?

The MCIMX6Q5EZK08AD positions itself as a balanced, multimedia-capable processor for embedded designs that require multi-core compute, integrated graphics/video handling and extensive I/O integration. Its hardware security features and flexible memory support make it suitable for systems where data protection and memory bandwidth are important design considerations.

Engineers and procurement teams will find the device appropriate for compact, connected platforms that need consolidated functionality—reducing board-level complexity while maintaining the processing and interface options necessary for media-rich and networked embedded products.

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