MCIMX6Q6AVT08AD

IC MPU I.MX6Q 852MHZ 624FCBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6Q 4 Core, 32-Bit 852MHz 624-FCBGA (21x21)

Quantity 1,379 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6Q
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width4 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-FBGA, FCBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed852MHzSupplier Device Package624-FCBGA (21×21)
USBUSB 2.0 + PHY (4)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6Q6AVT08AD – IC MPU I.MX6Q 852MHz 624-FCBGA

The MCIMX6Q6AVT08AD is a 4-core ARM® Cortex®-A9 microprocessor operating at 852 MHz, delivered in a 624-FCBGA (21 × 21 mm) package. It is part of the i.MX 6Q series of multimedia-focused processors and provides a high degree of functional integration for embedded multimedia and display-oriented applications.

Designed for systems that require multi-core processing, advanced multimedia and graphics acceleration, and a broad set of high-speed interfaces, this device combines CPU performance with integrated memory and peripheral controllers to simplify system design and integration.

Key Features

  • Quad ARM Cortex‑A9 cores (32‑bit) — Four Cortex‑A9 cores provide simultaneous multi-threaded processing for responsive embedded workloads.
  • Operating Frequency — Processor nominal speed of 852 MHz for balanced performance and power trade-offs.
  • Multimedia and SIMD — Includes multimedia co‑processors and NEON™ SIMD for accelerated media and signal processing tasks.
  • Graphics and Video — Integrated 2D/3D graphics and 1080p video processing capabilities for advanced display and UI implementations.
  • Memory Interfaces — Supports LPDDR2, LVDDR3, and DDR3 memory controllers; datasheet references a 64‑bit DDR interface to support high memory bandwidth.
  • High‑Speed I/O — On‑chip controllers for Gigabit Ethernet (10/100/1000 Mbps), SATA 3 Gbps, and four USB 2.0 ports with PHYs.
  • Additional Interfaces — CAN interface and multiple display interface controllers including LCD and keypad support.
  • Security Features — Comprehensive security building blocks including ARM TrustZone, boot security, cryptography, secure fusebox, secure JTAG, secure memory, secure RTC, RTIC, and tamper detection.
  • Power Management — Integrated power management and on‑chip regulators referenced in the technical documentation to simplify system power design.
  • Package and Mounting — 624‑FBGA (624‑FCBGA, 21 × 21 mm) surface‑mount package for compact board designs.
  • Industrial Temperature Range — Rated operation from −40 °C to 125 °C for thermally demanding embedded environments.
  • Regulatory Compliance — RoHS compliant.

Typical Applications

  • Multimedia and Infotainment Systems — Drives advanced user interfaces, video playback and graphics rendering in embedded multimedia platforms.
  • Human‑Machine Interfaces (HMI) — Supports rich display control and touch/keyboard interfaces for interactive control panels and kiosks.
  • Connected Embedded Systems — Provides high‑speed connectivity via Gigabit Ethernet, multiple USB ports, SATA and CAN for networked or storage‑attached devices.
  • Video and Imaging Processing — NEON SIMD and multimedia accelerators enable efficient processing of video and image workloads at up to 1080p.

Unique Advantages

  • High integration of compute and peripherals: Quad cores, graphics, video processing and extensive I/O reduce external component count and simplify BOM.
  • Broad memory support: Native controllers for LPDDR2, LVDDR3 and DDR3 (64‑bit interface documented) support high bandwidth memory configurations.
  • Comprehensive security stack: Multiple hardware security features protect boot, runtime and sensitive keys, enabling secure system architectures.
  • Flexible connectivity: Built‑in Gigabit Ethernet, SATA 3 Gbps, USB 2.0 with PHYs and CAN deliver versatile options for networking and peripheral attachments.
  • Package and thermal range: Compact 624‑FCBGA package combined with −40 °C to 125 °C operation supports dense board layouts in thermally variable environments.
  • Multimedia acceleration: 2D/3D graphics and 1080p video processing offload rendering and playback tasks from the CPU cores, improving responsiveness.

Why Choose MCIMX6Q6AVT08AD?

The MCIMX6Q6AVT08AD positions itself as a highly integrated multimedia microprocessor that balances multi‑core compute, dedicated media acceleration and a wide array of high‑speed interfaces. Its combination of Cortex‑A9 quad cores, NEON SIMD, integrated graphics/video engines and robust I/O support makes it suitable for embedded designs that require both processing throughput and system integration.

As part of the i.MX 6Q family, this device aligns with a product line focused on delivering functional integration and scalable multimedia capabilities. It offers designers a compact package option and long‑lifetime support through documented technical details to aid system development and deployment.

Request a quote or submit an inquiry to receive pricing and availability for the MCIMX6Q6AVT08AD and to discuss how it can fit into your next embedded multimedia design.

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