MCIMX6Q6AVT10AC

IC MPU I.MX6Q 1.0GHZ 624FCBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6Q 4 Core, 32-Bit 1.0GHz 624-FCBGA (21x21)

Quantity 1,460 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6Q
ManufacturerNXP USA Inc.
Manufacturing StatusNot For New Designs
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width4 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-FBGA, FCBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed1.0GHzSupplier Device Package624-FCBGA (21×21)
USBUSB 2.0 + PHY (4)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6Q6AVT10AC – IC MPU I.MX6Q 1.0GHz 624-FCBGA

The MCIMX6Q6AVT10AC is an NXP Semiconductors i.MX 6Quad ARM® Cortex®-A9 microprocessor IC featuring four 32‑bit cores running at up to 1.0 GHz in a 624‑FCBGA (21×21 mm) package. It targets multimedia-focused embedded designs that require integrated processing, graphics acceleration, and a broad set of peripheral interfaces.

Typical market uses include infotainment, telematics, human‑machine interfaces (HMI), and display‑based clusters where a combination of CPU performance, multimedia co‑processing and extensive I/O support deliver a compact, integrated solution.

Key Features

  • Core  Quad ARM® Cortex®‑A9 architecture, four 32‑bit cores at up to 1 GHz for parallel processing and multitasking.
  • Multimedia and SIMD  Integrated multimedia co‑processors and NEON™ SIMD support for accelerated media and signal processing workloads.
  • Memory Interfaces  On‑chip controllers supporting LPDDR2, LVDDR3 and DDR3 memory types to match system memory requirements and performance targets.
  • Graphics and Display  Graphics acceleration plus display interface controllers for LCD and keypad connection to support rich user interfaces and graphics display.
  • Networking and Storage  Integrated Gigabit Ethernet (10/100/1000 Mbps, 1 port) and SATA 3 Gbps (1 port) for high‑speed networking and storage connectivity.
  • USB and Expansion  Four USB 2.0 ports with integrated PHY for peripheral connectivity and device expansion.
  • Additional Interfaces  CAN interface support for automotive/industrial communication networks and flexible peripheral integration.
  • Security Features  Hardware security building blocks including ARM TrustZone (ARM TZ), boot security, cryptography, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection to support secure system designs.
  • Package and Mounting  624‑FBGA / 624‑FCBGA package (21×21 mm, surface mount) suitable for compact, high‑density system boards.
  • Operating Range  Specified operating temperature from ‑40 °C to 125 °C for deployment in thermally demanding environments.
  • Compliance  RoHS compliant.

Typical Applications

  • Infotainment and Navigation Systems  Integrated multimedia processing and display support for navigation, media playback and HMI functions.
  • Telematics  Connectivity and processing capabilities for telematics modules requiring network interfaces and data handling.
  • Human‑Machine Interfaces (HMI)  Graphics acceleration and display controllers for responsive touch and visual interfaces in embedded panels.
  • Display‑Based Instrument Clusters  Multi‑core processing and graphics support for modern instrument cluster displays.

Unique Advantages

  • Quad‑core processing density: Four ARM® Cortex®‑A9 cores at up to 1 GHz provide parallel compute headroom for multimedia and multitasking workloads.
  • Integrated multimedia and graphics: On‑chip multimedia co‑processors and graphics acceleration reduce external component needs and simplify system design.
  • Flexible memory support: Controllers for LPDDR2, LVDDR3 and DDR3 allow designers to choose memory technologies that match cost and performance targets.
  • Broad connectivity: Gigabit Ethernet, SATA 3 Gbps, four USB 2.0 ports, and CAN deliver extensive I/O options for networking, storage and peripheral interfacing.
  • Comprehensive hardware security: Multiple security primitives (TrustZone, secure boot, cryptography, secure JTAG, secure memory and tamper detection) enable secure system architectures.
  • Wide temperature capability: Rated from ‑40 °C to 125 °C for reliable operation across demanding thermal environments.

Why Choose MCIMX6Q6AVT10AC?

The MCIMX6Q6AVT10AC combines quad‑core ARM® Cortex®‑A9 performance with integrated multimedia, graphics and a rich set of interfaces in a compact 624‑FCBGA package. It is well suited for embedded systems that need consolidated processing, secure boot and multiple high‑speed I/O options while minimizing external components.

As part of the i.MX 6 family from NXP Semiconductors, this processor fits designs that prioritize multimedia capability, connectivity and thermal resilience, offering a path for scalable designs within the same processor family.

Request a quote or submit a procurement inquiry to get pricing and availability for MCIMX6Q6AVT10AC and discuss volume or delivery needs.

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