MCIMX6Q6AVT08AE

IC MPU I.MX6Q 852MHZ 624FCBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6Q 4 Core, 32-Bit 852MHz 624-FCBGA (21x21)

Quantity 721 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6Q
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width4 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-FBGA, FCBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed852MHzSupplier Device Package624-FCBGA (21×21)
USBUSB 2.0 + PHY (4)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6Q6AVT08AE – IC MPU I.MX6Q 852MHz 624-FCBGA

The MCIMX6Q6AVT08AE is a high-integration microprocessor IC from NXP Semiconductors' i.MX 6Q series. It features a quad ARM® Cortex®-A9 architecture operating at 852 MHz with a 32-bit core bus, engineered for multimedia-focused embedded systems.

Designed for applications requiring combined processing and display capabilities, this device delivers multicore compute, dedicated multimedia acceleration and a broad set of peripheral interfaces, all in a 624-FCBGA (21 × 21 mm) surface-mount package.

Key Features

  • Processor Core Quad ARM® Cortex®-A9 cores, 32-bit architecture running at 852 MHz for multi-threaded application performance.
  • Multimedia and Acceleration Integrated multimedia co‑processors and NEON™ SIMD support plus 2D/3D graphics and 1080p video processing as described in the i.MX 6Dual/6Quad documentation.
  • Memory Interfaces Multi‑mode memory controller supporting LPDDR2, LVDDR3 and DDR3; series documentation references a 64‑bit DDR interface for high-bandwidth memory configurations.
  • Connectivity & I/O Gigabit Ethernet (10/100/1000 Mbps, 1 port), SATA 3 Gbps (1 port), four USB 2.0 ports with PHY, and CAN interface support for diverse peripheral connectivity.
  • Display & Human Interface Display interface controllers for LCD and keypad support to drive interactive user interfaces.
  • Security Features On‑chip security suite including ARM TrustZone (ARM TZ), boot security, cryptography, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection.
  • Package & Thermal 624‑FCBGA supplier package (21 × 21 mm, 0.8 mm pitch), surface‑mount; operating temperature range −40 °C to 125 °C.
  • Compliance RoHS compliant.

Typical Applications

  • Infotainment and Navigation Systems Multi‑core processing and multimedia acceleration support rich audio/video playback and responsive user interfaces.
  • Telematics and Connectivity Gateways Integrated Ethernet, CAN and USB interfaces enable data aggregation and networked communications.
  • Human‑Machine Interfaces (HMI) LCD and keypad display controllers plus graphics acceleration enable responsive HMI designs.
  • Display‑Based Instrumentation High‑resolution video processing and graphics engines support complex visual displays and instrument clusters.

Unique Advantages

  • Highly integrated processing and multimedia: Quad Cortex‑A9 cores combined with dedicated multimedia engines and NEON SIMD reduce the need for external accelerators.
  • Flexible memory support: LPDDR2, LVDDR3 and DDR3 controller options and a 64‑bit DDR interface enable a range of memory-performance tradeoffs.
  • Extensive peripheral set: Built‑in Gigabit Ethernet, SATA 3 Gbps, multiple USB 2.0 ports with PHY and CAN simplify system-level connectivity.
  • Comprehensive device security: Multiple hardware security features including ARM TrustZone, secure boot elements and tamper detection enhance platform protection.
  • Robust thermal range: −40 °C to 125 °C operation supports deployment in thermally demanding embedded environments.
  • Compact, manufacturable package: 624‑FCBGA (21 × 21 mm, 0.8 mm pitch) surface‑mount package streamlines PCB integration for space‑constrained designs.

Why Choose MCIMX6Q6AVT08AE?

The MCIMX6Q6AVT08AE balances multicore processing, multimedia acceleration and broad peripheral connectivity within a single package, making it well suited to embedded systems that require integrated audio/video and display capabilities alongside networked interfaces. Its extensive security features and flexible memory support provide designers with the tools to build robust, feature-rich products.

This part is targeted at developers and product teams building advanced infotainment, HMI, telematics and display-centric embedded systems who need an integrated microprocessor solution with proven architectural building blocks and a compact FCBGA package.

If you would like pricing, availability or to request a formal quote for MCIMX6Q6AVT08AE, submit an inquiry specifying the part number and your quantity and application requirements.

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