MCIMX6Q6AVT08ACR
| Part Description |
ARM® Cortex®-A9 Microprocessor IC i.MX6Q 4 Core, 32-Bit 852MHz 624-FCBGA (21x21) |
|---|---|
| Quantity | 10 Available (as of October 9, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6Q |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Not For New Designs |
| Manufacturer Standard Lead Time | 15 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A9 | Device Package | 624-FCBGA (21x21) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Keypad, LCD | ECCN | 5A992C | Ethernet | 10/100/1000Mbps (1) | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 4 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 125°C (TJ) | Package / Case | 624-FBGA, FCBGA | RAM Controllers | LPDDR2, LVDDR3, DDR3 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | SATA | SATA 3Gbps (1) | ||
| Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Speed | 852MHz | Supplier Device Package | 624-FCBGA (21×21) | ||
| USB | USB 2.0 + PHY (4) | Voltage – I/O | 1.8V, 2.5V, 2.8V, 3.3V |
Overview of MCIMX6Q6AVT08ACR – IC MPU I.MX6Q 852MHZ 624FCBGA
The MCIMX6Q6AVT08ACR is a quad-core ARM® Cortex®-A9 microprocessor in the i.MX 6Q series, specified at 852 MHz with a 32-bit core architecture. It combines multi-core compute, multimedia acceleration and a broad set of peripheral interfaces in a 624‑FCBGA (21 × 21 mm) package for embedded multimedia and display-focused designs.
Designed for systems that require integrated graphics acceleration, extensive I/O and flexible memory support, this device targets infotainment, telematics, human‑machine interface (HMI) and other multimedia applications where sustained performance and wide operating temperature range are important.
Key Features
- Core — ARM® Cortex®-A9 quad‑core, 32‑bit architecture running at 852 MHz for multi-threaded application processing.
- Multimedia and DSP — Integrated multimedia co‑processor capabilities including NEON™ SIMD for accelerated media and signal processing tasks.
- Memory Support — MMDC-compatible controllers supporting LPDDR2, LVDDR3 and DDR3 memory options for flexible system designs.
- Graphics & Display — Graphics acceleration and dedicated display interface controllers for LCD and keypad subsystems to drive rich user interfaces.
- High-speed Interfaces — On‑chip connectivity including one Gigabit Ethernet (10/100/1000 Mbps), one SATA 3 Gbps port and four USB 2.0 ports with PHY.
- Additional I/O — CAN interface plus a variety of peripheral connections for sensors, storage and communications.
- Security — Comprehensive security feature set including ARM TrustZone (TZ), boot security, cryptography, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection options.
- Package & Mounting — 624‑FCBGA (21 × 21 mm) surface‑mount package with 0.8 mm pitch.
- Operating Range — Extended temperature operation from −40 °C to 125 °C for deployment in demanding environments.
- Compliance — RoHS compliant.
Typical Applications
- Infotainment Systems — Drives multimedia playback and display control with integrated graphics acceleration and multiple high‑speed I/O options.
- Telematics — Supports connectivity and data processing needs with Ethernet, USB and CAN interfaces alongside secure boot capabilities.
- Human‑Machine Interfaces (HMI) — Powers responsive graphical interfaces using the device’s display controllers and multimedia processing features.
- Display‑based Clusters — Manages high‑resolution displays and sensor inputs with dedicated display and memory controller support.
Unique Advantages
- Balanced Multi‑Core Performance: Four Cortex‑A9 cores at 852 MHz provide parallel processing capability for multitasking embedded applications.
- Integrated Multimedia Acceleration: NEON™ SIMD and graphics acceleration reduce external processing requirements for media and UI workloads.
- Flexible Memory Interfaces: Support for LPDDR2, LVDDR3 and DDR3 lets designers select memory options that match performance and power targets.
- Comprehensive I/O Suite: Built‑in Gigabit Ethernet, SATA 3 Gbps, multiple USB 2.0 ports and CAN simplify system integration and reduce BOM complexity.
- Robust Security Features: A broad security feature set (TrustZone, secure boot, cryptography, secure JTAG, etc.) enables hardware‑anchored system security measures.
- Wide Temperature Capability: −40 °C to 125 °C rating supports deployment in thermally demanding environments.
Why Choose MCIMX6Q6AVT08ACR?
The MCIMX6Q6AVT08ACR places quad‑core ARM® Cortex®‑A9 compute alongside integrated multimedia and extensive peripheral connectivity in a compact 624‑FCBGA package. Its combination of multi‑core performance, hardware-accelerated media processing and flexible memory and I/O support makes it suitable for embedded systems that require responsive user interfaces, media handling and reliable communications.
Backed by NXP Semiconductors documentation and a datasheet detailing package, electrical and system integration guidance, this device is suited to designers building display‑centric and multimedia embedded products where integration and a defined thermal range are priorities.
Request a quote or submit a procurement inquiry to get pricing, lead time and availability for MCIMX6Q6AVT08ACR.

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