MCIMX6Q6AVT08ACR

IC MPU I.MX6Q 852MHZ 624FCBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6Q 4 Core, 32-Bit 852MHz 624-FCBGA (21x21)

Quantity 10 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6Q
ManufacturerNXP USA Inc.
Manufacturing StatusNot For New Designs
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width4 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-FBGA, FCBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed852MHzSupplier Device Package624-FCBGA (21×21)
USBUSB 2.0 + PHY (4)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6Q6AVT08ACR – IC MPU I.MX6Q 852MHZ 624FCBGA

The MCIMX6Q6AVT08ACR is a quad-core ARM® Cortex®-A9 microprocessor in the i.MX 6Q series, specified at 852 MHz with a 32-bit core architecture. It combines multi-core compute, multimedia acceleration and a broad set of peripheral interfaces in a 624‑FCBGA (21 × 21 mm) package for embedded multimedia and display-focused designs.

Designed for systems that require integrated graphics acceleration, extensive I/O and flexible memory support, this device targets infotainment, telematics, human‑machine interface (HMI) and other multimedia applications where sustained performance and wide operating temperature range are important.

Key Features

  • Core — ARM® Cortex®-A9 quad‑core, 32‑bit architecture running at 852 MHz for multi-threaded application processing.
  • Multimedia and DSP — Integrated multimedia co‑processor capabilities including NEON™ SIMD for accelerated media and signal processing tasks.
  • Memory Support — MMDC-compatible controllers supporting LPDDR2, LVDDR3 and DDR3 memory options for flexible system designs.
  • Graphics & Display — Graphics acceleration and dedicated display interface controllers for LCD and keypad subsystems to drive rich user interfaces.
  • High-speed Interfaces — On‑chip connectivity including one Gigabit Ethernet (10/100/1000 Mbps), one SATA 3 Gbps port and four USB 2.0 ports with PHY.
  • Additional I/O — CAN interface plus a variety of peripheral connections for sensors, storage and communications.
  • Security — Comprehensive security feature set including ARM TrustZone (TZ), boot security, cryptography, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection options.
  • Package & Mounting — 624‑FCBGA (21 × 21 mm) surface‑mount package with 0.8 mm pitch.
  • Operating Range — Extended temperature operation from −40 °C to 125 °C for deployment in demanding environments.
  • Compliance — RoHS compliant.

Typical Applications

  • Infotainment Systems — Drives multimedia playback and display control with integrated graphics acceleration and multiple high‑speed I/O options.
  • Telematics — Supports connectivity and data processing needs with Ethernet, USB and CAN interfaces alongside secure boot capabilities.
  • Human‑Machine Interfaces (HMI) — Powers responsive graphical interfaces using the device’s display controllers and multimedia processing features.
  • Display‑based Clusters — Manages high‑resolution displays and sensor inputs with dedicated display and memory controller support.

Unique Advantages

  • Balanced Multi‑Core Performance: Four Cortex‑A9 cores at 852 MHz provide parallel processing capability for multitasking embedded applications.
  • Integrated Multimedia Acceleration: NEON™ SIMD and graphics acceleration reduce external processing requirements for media and UI workloads.
  • Flexible Memory Interfaces: Support for LPDDR2, LVDDR3 and DDR3 lets designers select memory options that match performance and power targets.
  • Comprehensive I/O Suite: Built‑in Gigabit Ethernet, SATA 3 Gbps, multiple USB 2.0 ports and CAN simplify system integration and reduce BOM complexity.
  • Robust Security Features: A broad security feature set (TrustZone, secure boot, cryptography, secure JTAG, etc.) enables hardware‑anchored system security measures.
  • Wide Temperature Capability: −40 °C to 125 °C rating supports deployment in thermally demanding environments.

Why Choose MCIMX6Q6AVT08ACR?

The MCIMX6Q6AVT08ACR places quad‑core ARM® Cortex®‑A9 compute alongside integrated multimedia and extensive peripheral connectivity in a compact 624‑FCBGA package. Its combination of multi‑core performance, hardware-accelerated media processing and flexible memory and I/O support makes it suitable for embedded systems that require responsive user interfaces, media handling and reliable communications.

Backed by NXP Semiconductors documentation and a datasheet detailing package, electrical and system integration guidance, this device is suited to designers building display‑centric and multimedia embedded products where integration and a defined thermal range are priorities.

Request a quote or submit a procurement inquiry to get pricing, lead time and availability for MCIMX6Q6AVT08ACR.

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