MCIMX6Q6AVT08ADR

IC MPU I.MX6Q 852MHZ 624FCBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6Q 4 Core, 32-Bit 852MHz 624-FCBGA (21x21)

Quantity 1,180 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6Q
ManufacturerNXP USA Inc.
Manufacturing StatusNot For New Designs
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width4 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-FBGA, FCBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed852MHzSupplier Device Package624-FCBGA (21×21)
USBUSB 2.0 + PHY (4)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6Q6AVT08ADR – ARM Cortex-A9 4-Core MPU, 852 MHz, 624-FCBGA

The MCIMX6Q6AVT08ADR is an i.MX 6Quad family microprocessor based on four ARM® Cortex®-A9 cores running at 852 MHz. It delivers a highly integrated embedded processing platform with multimedia acceleration, multiple memory interfaces, and a broad set of peripheral connectivity.

Designed for embedded multimedia and display-focused systems, this device targets use cases such as infotainment, HMI and display-based clusters where CPU performance, graphics acceleration and rich I/O integration are required.

Key Features

  • Core & Performance Quad ARM® Cortex®-A9 cores, 32-bit architecture, operating at 852 MHz to handle multi-threaded application and multimedia workloads.
  • Multimedia & Graphics Multimedia co-processors and NEON™ SIMD acceleration plus graphics acceleration for 2D/3D workloads and advanced media processing.
  • Memory Support Integrated memory controllers for LPDDR2, LVDDR3 and DDR3 to support flexible system memory configurations.
  • Storage & Connectivity Integrated interfaces including Gigabit Ethernet (10/100/1000 Mbps), SATA 3 Gbps, four USB 2.0 ports with PHY and CAN for broad peripheral and storage connectivity.
  • Security & Boot Hardware security features including ARM TrustZone (ARM TZ), boot security, cryptography, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection.
  • Package & Thermal 624-FCBGA package (21 × 21 mm) in a surface-mount format and rated for operation from −40 °C to 125 °C.
  • Standards & Compliance RoHS compliant for environmental regulatory requirements.

Typical Applications

  • Infotainment systems — High-performance multimedia processing and graphics acceleration support audio, video and user interface workloads.
  • Human–Machine Interfaces (HMI) — Multiple display controllers, keypad and graphics support enable responsive and feature-rich operator displays.
  • Multimedia processing and video playback — NEON SIMD and multimedia co-processors accelerate video and media decode/encode pipelines.
  • Display-based instrumentation — Integrated display interfaces and graphics engines suit instrument clusters and information displays.

Unique Advantages

  • Highly integrated multimedia platform: Quad-core Cortex-A9 compute, NEON SIMD and graphics acceleration reduce external component needs for multimedia systems.
  • Broad peripheral set: Gigabit Ethernet, SATA, multiple USB ports, and CAN provide flexible connectivity for diverse system architectures.
  • Flexible memory support: LPDDR2, LVDDR3 and DDR3 controllers enable designers to match memory choices to performance and power targets.
  • Comprehensive security features: Built-in TrustZone, secure boot and cryptography elements support hardened boot and runtime protection strategies.
  • Wide operating temperature: Rated from −40 °C to 125 °C for deployment in thermally demanding embedded environments.
  • Compact, production-ready package: 624-FCBGA (21 × 21 mm) surface-mount package fits space-constrained designs while supporting high pin-count integration.

Why Choose MCIMX6Q6AVT08ADR?

The MCIMX6Q6AVT08ADR combines quad-core ARM Cortex-A9 processing with dedicated multimedia acceleration and a comprehensive set of interfaces to deliver a balanced platform for embedded multimedia and display-centric systems. Its integrated memory controllers, security features and connectivity options simplify system design and reduce bill-of-materials for complex applications.

This part suits designers seeking scalable compute and media handling in a compact BGA package, offering robustness across a wide operating temperature range and compliance with RoHS requirements for regulated deployments.

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