MCIMX6Q6AVT08ADR
| Part Description |
ARM® Cortex®-A9 Microprocessor IC i.MX6Q 4 Core, 32-Bit 852MHz 624-FCBGA (21x21) |
|---|---|
| Quantity | 1,180 Available (as of October 9, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6Q |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Not For New Designs |
| Manufacturer Standard Lead Time | 15 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A9 | Device Package | 624-FCBGA (21x21) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Keypad, LCD | ECCN | 5A992C | Ethernet | 10/100/1000Mbps (1) | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 4 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 125°C (TJ) | Package / Case | 624-FBGA, FCBGA | RAM Controllers | LPDDR2, LVDDR3, DDR3 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | SATA | SATA 3Gbps (1) | ||
| Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Speed | 852MHz | Supplier Device Package | 624-FCBGA (21×21) | ||
| USB | USB 2.0 + PHY (4) | Voltage – I/O | 1.8V, 2.5V, 2.8V, 3.3V |
Overview of MCIMX6Q6AVT08ADR – ARM Cortex-A9 4-Core MPU, 852 MHz, 624-FCBGA
The MCIMX6Q6AVT08ADR is an i.MX 6Quad family microprocessor based on four ARM® Cortex®-A9 cores running at 852 MHz. It delivers a highly integrated embedded processing platform with multimedia acceleration, multiple memory interfaces, and a broad set of peripheral connectivity.
Designed for embedded multimedia and display-focused systems, this device targets use cases such as infotainment, HMI and display-based clusters where CPU performance, graphics acceleration and rich I/O integration are required.
Key Features
- Core & Performance Quad ARM® Cortex®-A9 cores, 32-bit architecture, operating at 852 MHz to handle multi-threaded application and multimedia workloads.
- Multimedia & Graphics Multimedia co-processors and NEON™ SIMD acceleration plus graphics acceleration for 2D/3D workloads and advanced media processing.
- Memory Support Integrated memory controllers for LPDDR2, LVDDR3 and DDR3 to support flexible system memory configurations.
- Storage & Connectivity Integrated interfaces including Gigabit Ethernet (10/100/1000 Mbps), SATA 3 Gbps, four USB 2.0 ports with PHY and CAN for broad peripheral and storage connectivity.
- Security & Boot Hardware security features including ARM TrustZone (ARM TZ), boot security, cryptography, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection.
- Package & Thermal 624-FCBGA package (21 × 21 mm) in a surface-mount format and rated for operation from −40 °C to 125 °C.
- Standards & Compliance RoHS compliant for environmental regulatory requirements.
Typical Applications
- Infotainment systems — High-performance multimedia processing and graphics acceleration support audio, video and user interface workloads.
- Human–Machine Interfaces (HMI) — Multiple display controllers, keypad and graphics support enable responsive and feature-rich operator displays.
- Multimedia processing and video playback — NEON SIMD and multimedia co-processors accelerate video and media decode/encode pipelines.
- Display-based instrumentation — Integrated display interfaces and graphics engines suit instrument clusters and information displays.
Unique Advantages
- Highly integrated multimedia platform: Quad-core Cortex-A9 compute, NEON SIMD and graphics acceleration reduce external component needs for multimedia systems.
- Broad peripheral set: Gigabit Ethernet, SATA, multiple USB ports, and CAN provide flexible connectivity for diverse system architectures.
- Flexible memory support: LPDDR2, LVDDR3 and DDR3 controllers enable designers to match memory choices to performance and power targets.
- Comprehensive security features: Built-in TrustZone, secure boot and cryptography elements support hardened boot and runtime protection strategies.
- Wide operating temperature: Rated from −40 °C to 125 °C for deployment in thermally demanding embedded environments.
- Compact, production-ready package: 624-FCBGA (21 × 21 mm) surface-mount package fits space-constrained designs while supporting high pin-count integration.
Why Choose MCIMX6Q6AVT08ADR?
The MCIMX6Q6AVT08ADR combines quad-core ARM Cortex-A9 processing with dedicated multimedia acceleration and a comprehensive set of interfaces to deliver a balanced platform for embedded multimedia and display-centric systems. Its integrated memory controllers, security features and connectivity options simplify system design and reduce bill-of-materials for complex applications.
This part suits designers seeking scalable compute and media handling in a compact BGA package, offering robustness across a wide operating temperature range and compliance with RoHS requirements for regulated deployments.
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