MCIMX6Q6AVT10AE

IC MPU I.MX6Q 1.0GHZ 624FCBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6Q 4 Core, 32-Bit 1.0GHz 624-FCBGA (21x21)

Quantity 139 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6Q
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width4 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-FBGA, FCBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed1.0GHzSupplier Device Package624-FCBGA (21×21)
USBUSB 2.0 + PHY (4)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6Q6AVT10AE – IC MPU I.MX6Q 1.0GHZ 624FCBGA

The MCIMX6Q6AVT10AE is a quad‑core ARM® Cortex®‑A9 microprocessor delivering up to 1.0 GHz of processing capability in a 624‑FCBGA (21×21 mm) package. Built for embedded multimedia applications, the i.MX 6Q architecture combines multi‑core CPU performance with integrated graphics, video and a wide set of peripheral interfaces.

Designed for high‑integration systems such as infotainment, telematics, HMI and display‑based platforms, this device targets applications that require concurrent CPU throughput, multimedia acceleration and robust peripheral connectivity while operating across a wide temperature range.

Key Features

  • Core & Performance Quad ARM® Cortex®‑A9 cores, 32‑bit, up to 1 GHz clock speed for multicore application processing.
  • Memory Controllers Integrated controllers for LPDDR2, LVDDR3 and DDR3 memory types to support a range of system memory configurations.
  • Graphics & Video On‑chip 2D/3D graphics acceleration and 1080p video processing capability as described in the i.MX6 series technical documentation.
  • High‑speed Interfaces Gigabit Ethernet (10/100/1000 Mbps, single port), SATA 3 Gbps (single port) and four USB 2.0 ports with PHY for wide I/O connectivity.
  • Additional Peripherals Integrated CAN interface and display interface controllers for keypad and LCD support.
  • Security & Boot Hardware security features including ARM TrustZone, boot security, cryptography, secure fusebox, secure JTAG, secure memory and secure RTC, plus tamper detection.
  • Package & Mounting 624‑FBGA (FCBGA) surface‑mount package, 21 × 21 mm footprint for compact board implementations.
  • Operating Range & Compliance Rated for operation from −40 °C to 125 °C and RoHS compliant.

Typical Applications

  • Infotainment and Multimedia Systems — Multi‑core processing with integrated graphics and 1080p video support for media playback and user interfaces.
  • Telematics and Connectivity Gateways — Gigabit Ethernet, CAN and multiple USB ports enable high‑throughput networking and peripheral connectivity.
  • Human‑Machine Interfaces (HMI) — LCD and keypad controller support plus graphics acceleration for responsive, display‑centric interfaces.
  • High‑performance Embedded Controllers — Quad‑core CPU and flexible memory options suitable for compute‑intensive embedded applications.

Unique Advantages

  • Quad‑Core Processing: Multi‑core ARM® Cortex®‑A9 architecture enables parallel task handling and application throughput.
  • Extensive Multimedia Support: Integrated 2D/3D graphics and video processing reduce external component needs for display and playback functions.
  • Broad Peripheral Integration: Built‑in Ethernet, SATA, USB and CAN interfaces simplify board design and reduce BOM complexity.
  • Comprehensive Security: Multiple hardware security mechanisms (TrustZone, secure boot, cryptography and tamper detection) provide layered device protection.
  • Wide Temperature Operation: −40 °C to 125 °C rating supports deployment in thermally demanding embedded environments.
  • Compact Package: 624‑FCBGA (21×21 mm) package offers high integration in a space‑efficient footprint.

Why Choose MCIMX6Q6AVT10AE?

The MCIMX6Q6AVT10AE brings together a quad‑core ARM® Cortex®‑A9 CPU, integrated multimedia acceleration, comprehensive peripheral interfaces and hardware security features in a single, compact package. It is well suited for designers who need balanced compute performance, multimedia capabilities and a wide set of on‑chip peripherals for embedded multimedia and display‑oriented systems.

As part of the i.MX 6Q family from NXP Semiconductors, this device provides a scalable platform for development across applications that demand concurrent processing, graphics/video handling and robust connectivity, while supporting industry‑standard memory types and operating across an extended temperature range.

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