MCIMX6Q7CVT08AC

IC MPU I.MX6Q 800MHZ 624FCBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6Q 4 Core, 32-Bit 800MHz 624-FCBGA (21x21)

Quantity 1,417 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6Q
ManufacturerNXP USA Inc.
Manufacturing StatusNot For New Designs
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width4 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TA)Package / Case624-FBGA, FCBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed800MHzSupplier Device Package624-FCBGA (21×21)
USBUSB 2.0 + PHY (4)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6Q7CVT08AC – IC MPU I.MX6Q 800MHZ 624FCBGA

The MCIMX6Q7CVT08AC is an NXP i.MX 6Quad series microprocessor featuring a quad ARM® Cortex®-A9 32‑bit core architecture running at up to 800 MHz. It is designed for embedded and multimedia-focused industrial applications that require multi‑core processing, graphics acceleration and extensive peripheral integration.

With integrated multimedia acceleration, broad memory interface support and a wide set of high‑speed I/O, this device targets applications that need performance, security and industrial temperature operation in a compact 624‑FCBGA package.

Key Features

  • Core  ARM® Cortex®‑A9, 4‑core 32‑bit implementation running up to 800 MHz for parallel processing of embedded and multimedia workloads.
  • Memory Controllers  Support for LPDDR2, LVDDR3 and DDR3 memory types to match system performance and power targets.
  • Multimedia & Graphics  Integrated multimedia co‑processors including NEON™ SIMD and graphics acceleration for 2D/3D and video processing.
  • High‑Speed Connectivity  Gigabit Ethernet (10/100/1000 Mbps, 1 port) and CAN interface for networking and industrial communications.
  • Storage & USB  SATA 3 Gbps (1) for direct storage attachment and up to four USB 2.0 ports with PHY for host/device connectivity.
  • Display & Human Interface  Built‑in display controllers supporting LCD and keypad interfaces for HMI and visualization applications.
  • Security Features  Hardware security including ARM TrustZone, boot security, cryptography, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection.
  • Package & Mounting  624‑FCBGA package (21 × 21 mm), surface‑mount assembly for compact system designs.
  • Industrial Qualification & Temperature Range  Industrial qualification with operating temperature range −40 °C to 105 °C for harsh environments.
  • Power & Integration  Integrated power management features documented in the device family datasheet to simplify system power design.
  • Compliance  RoHS compliant.

Typical Applications

  • Industrial Human‑Machine Interfaces (HMI)  Driving LCD displays and keypad inputs with on‑chip graphics acceleration and multiple memory options for responsive user interfaces.
  • Multimedia and Video Systems  2D/3D graphics and video processing capabilities suitable for embedded multimedia players and vision‑enabled devices.
  • Networked Gateways and Appliances  Gigabit Ethernet, USB and CAN support enable industrial gateways, routers and connectivity appliances.
  • Storage‑Capable Embedded Systems  Integrated SATA 3 Gbps and USB 2.0 connectivity for devices requiring local storage or removable media support.
  • Sensor and Camera Interfaces  Peripheral interfaces and multimedia blocks make the device suitable for camera sensors and imaging applications.

Unique Advantages

  • Multi‑core processing with multimedia acceleration: Quad ARM® Cortex®‑A9 cores plus NEON™ SIMD deliver parallel compute and media processing in a single device.
  • Broad external interface set: Built‑in Gigabit Ethernet, SATA, multiple USB ports and CAN reduce the need for external bridge chips and simplify BOM.
  • Flexible memory support: LPDDR2, LVDDR3 and DDR3 controller support allows designers to choose memory optimized for cost, power or performance.
  • Industrial‑grade operation: Industrial qualification and −40 °C to 105 °C operating range support deployment in harsh environments.
  • Comprehensive hardware security: On‑chip TrustZone, secure boot and cryptography features help protect system integrity and sensitive data.
  • Compact, manufacturable package: 624‑FCBGA (21 × 21 mm) surface‑mount package balances I/O density with board space efficiency.

Why Choose MCIMX6Q7CVT08AC?

The MCIMX6Q7CVT08AC positions itself as a highly integrated multimedia and embedded application processor within the i.MX 6Quad family, delivering a combination of multi‑core compute, graphics acceleration, extensive I/O and hardware security. Its industrial qualification and wide operating temperature range make it suitable for robust embedded designs that require sustained operation in challenging environments.

As part of the i.MX 6 family of multimedia‑focused processors, this device supports scalable design choices across memory and peripheral configurations, enabling reuse across product variants and long‑lifecycle deployments.

Request a quote or submit an inquiry to receive pricing and availability information for the MCIMX6Q7CVT08AC. Technical documentation is available for detailed electrical, packaging and interface specifications.

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