MCIMX6Q5EYM12AC

IC MPU I.MX6Q 1.2GHZ 624FCPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6Q 4 Core, 32-Bit 1.2GHz 624-FCPBGA (21x21)

Quantity 1,360 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6Q
ManufacturerNXP USA Inc.
Manufacturing StatusNot For New Designs
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCPBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width4 Core, 32-Bit
Operating Temperature-20°C ~ 105°C (TJ)Package / Case624-LFBGA, FCBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed1.2GHzSupplier Device Package624-FCPBGA (21×21)
USBUSB 2.0 + PHY (4)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6Q5EYM12AC – IC MPU I.MX6Q 1.2GHZ 624FCPBGA

The MCIMX6Q5EYM12AC is an NXP i.MX 6Quad ARM® Cortex®-A9 multimedia applications processor featuring four 32-bit cores running at up to 1.2 GHz. It is designed for embedded and industrial applications that require multi-core processing, graphics acceleration and a broad set of integrated I/O.

With integrated memory controllers, display and storage interfaces, high-speed networking and comprehensive security features, this device targets embedded multimedia systems, human-machine interfaces and networked storage or gateway designs that demand performance and integration in a compact 624-FCPBGA package.

Key Features

  • Core & Architecture — Quad ARM® Cortex®-A9 cores (4 core, 32-bit) operating up to 1.2 GHz to support parallel processing and multitasking in embedded applications.
  • Memory Subsystem — 64-bit DDR memory interface and support for LPDDR2, LVDDR3 and DDR3 technologies for flexible system memory choices.
  • Multimedia & Graphics — Graphics acceleration and multimedia-oriented coprocessors including NEON™ SIMD to enable rich user interfaces and media handling.
  • Storage & Networking — Integrated SATA 3 Gbps interface and a single 10/100/1000 Mbps Ethernet port to support local storage and high-speed networking.
  • USB & Peripherals — Four USB 2.0 ports with PHY integration and display interface controllers for LCD and keypad connectivity.
  • Security & Trust — Hardware security features including ARM TrustZone (ARM TZ), boot security, cryptography, secure JTAG, secure memory and secure RTC to support protected boot and runtime security models.
  • Package & Thermal — 624-FCPBGA (21 × 21 mm) surface-mount package; rated for an operating temperature range of −20 °C to 105 °C.
  • Additional Interfaces — CAN interface and other general-purpose peripheral interfaces suitable for connected embedded systems.

Typical Applications

  • Industrial Multimedia Systems — Drive HMI and display subsystems where graphics acceleration and multiple display interfaces are required.
  • Embedded Networking & Storage Gateways — Use the gigabit Ethernet and SATA 3 Gbps interface to implement networked storage, gateway or media server functions.
  • Human-Machine Interfaces (HMIs) — Combine LCD and keypad controllers with NEON™-accelerated graphics for responsive user interfaces.
  • Machine Vision & Camera Integration — Integrate camera sensors and multimedia pipelines using the processor’s multimedia coprocessors and peripheral interfaces.

Unique Advantages

  • Highly integrated connectivity: On-chip Gigabit Ethernet, SATA 3 Gbps and four USB 2.0 ports reduce external components and simplify board design.
  • Multicore performance: Four ARM® Cortex®-A9 cores at up to 1.2 GHz deliver parallel compute capacity for multitasking and media processing workloads.
  • Flexible memory support: The 64-bit DDR interface plus support for LPDDR2, LVDDR3 and DDR3 enables designers to choose memory technology that fits cost and performance targets.
  • Comprehensive security: Built-in ARM TrustZone, secure boot, cryptography and secure JTAG support help protect system integrity and sensitive data.
  • Industrial temperature range: Rated operation from −20 °C to 105 °C enables deployment in a range of embedded and industrial environments.
  • Compact production-ready package: 624-FCPBGA (21 × 21 mm, 0.8 mm pitch) surface-mount package supports dense system designs and automated assembly.

Why Choose MCIMX6Q5EYM12AC?

The MCIMX6Q5EYM12AC positions itself as a high-integration, performance-focused choice for embedded multimedia and industrial applications. Its quad-core Cortex-A9 architecture, multimedia acceleration and broad set of integrated I/O (Ethernet, SATA, multiple USB, display controllers and CAN) make it well suited for designs that require concurrent media processing, networking and storage capabilities.

Designed for long-lived embedded deployments, the device’s security features, flexible memory support and extended operating temperature range provide designers with a scalable platform and the system-level capabilities needed to reduce BOM complexity and accelerate time to market.

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