MCIMX6Q4AVT08ACR

IC MPU I.MX6Q 852MHZ 624FCBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6Q 4 Core, 32-Bit 852MHz 624-FCBGA (21x21)

Quantity 36 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6Q
ManufacturerNXP USA Inc.
Manufacturing StatusNot For New Designs
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width4 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-FBGA, FCBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed852MHzSupplier Device Package624-FCBGA (21×21)
USBUSB 2.0 + PHY (4)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6Q4AVT08ACR – IC MPU I.MX6Q 852MHZ 624FCBGA

The MCIMX6Q4AVT08ACR is a 32-bit microprocessor based on a quad ARM® Cortex®-A9 architecture running at 852 MHz in a 624-FCBGA (21 × 21 mm) package. It is designed for embedded multimedia applications that require multi-core processing, graphics acceleration and extensive peripheral integration.

With on-chip multimedia acceleration and a broad set of interfaces, this i.MX 6Quad part targets advanced HMI and multimedia-rich embedded designs where integration, I/O diversity and robust thermal range are important.

Key Features

  • Core & Performance Quad ARM® Cortex®-A9 cores at 852 MHz providing multi-threaded processing for embedded applications.
  • Multimedia & Graphics Integrated graphics acceleration and series-level support for 2D/3D graphics and 1080p video processing (as described in the series datasheet), plus NEON™ SIMD for multimedia DSP workloads.
  • Memory Support Memory controller support for LPDDR2, LVDDR3 and DDR3, enabling flexible system memory configurations.
  • Storage & Networking Single SATA 3Gbps interface and single Gigabit Ethernet (10/100/1000 Mbps) for high-bandwidth storage and network connectivity.
  • USB & Expansion Four USB 2.0 ports with integrated PHYs and additional peripheral interfaces including CAN for diverse system integration.
  • Security & Boot Hardware security features including ARM TrustZone (ARM TZ), boot security, cryptography, secure fusebox, secure JTAG, secure memory and secure RTC, plus tamper detection.
  • Package & Mounting 624-FCBGA (21 × 21 mm) surface-mount package suitable for compact, board-level integration.
  • Operating Range Rated for operation from −40 °C to 125 °C for deployment in thermally demanding embedded environments.
  • Standards Compliance RoHS compliant for environmental and manufacturing considerations.

Typical Applications

  • Infotainment and multimedia systems Drives high-definition video playback and graphical user interfaces using on-chip graphics acceleration and multimedia processing.
  • Human–Machine Interfaces (HMI) Powers advanced displays and touch-panel interfaces with support for LCD and keypad controllers.
  • Networked storage and gateways Provides Gigabit Ethernet and SATA connectivity for storage subsystems and networked appliances.
  • Industrial embedded systems Suitable for designs requiring broad memory options, CAN connectivity and wide operating temperature capability.

Unique Advantages

  • Highly integrated multimedia engine: Quad Cortex‑A9 cores, NEON SIMD and graphics acceleration simplify multimedia system design.
  • Flexible memory interfaces: Support for LPDDR2, LVDDR3 and DDR3 enables designers to optimize cost, performance and power for each application.
  • Comprehensive I/O set: Gigabit Ethernet, SATA 3Gbps, four USB 2.0 PHYs and CAN provide broad connectivity without extensive external components.
  • Robust hardware security: ARM TrustZone, boot security, cryptographic functions and secure fusing protect system integrity and sensitive data.
  • Wide thermal capability: −40 °C to 125 °C operation supports deployment in thermally challenging embedded environments.
  • Compact, manufacturable package: 624-FCBGA (21 × 21 mm) surface-mount package balances integration density with PCB assembly requirements.

Why Choose MCIMX6Q4AVT08ACR?

This NXP i.MX 6Quad device combines multi-core ARM® Cortex®‑A9 processing with dedicated multimedia engines and a broad peripheral set to deliver a balanced platform for embedded multimedia and HMI designs. Its flexible memory support and extensive I/O options reduce the need for external components while enabling higher system integration.

The combination of hardware security features, graphics/multimedia capabilities and wide operating temperature range makes the MCIMX6Q4AVT08ACR a practical choice for engineers building robust, long-lived embedded products that require both compute and real-time connectivity.

Request a quote or submit a quote to receive pricing and availability for the MCIMX6Q4AVT08ACR and begin integrating this i.MX 6Quad microprocessor into your design.

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