MCIMX6Q4AVT08AC
| Part Description |
ARM® Cortex®-A9 Microprocessor IC i.MX6Q 4 Core, 32-Bit 852MHz 624-FCBGA (21x21) |
|---|---|
| Quantity | 1,461 Available (as of October 9, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6Q |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Not For New Designs |
| Manufacturer Standard Lead Time | 15 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A9 | Device Package | 624-FCBGA (21x21) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Keypad, LCD | ECCN | 5A992C | Ethernet | 10/100/1000Mbps (1) | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 4 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 125°C (TJ) | Package / Case | 624-FBGA, FCBGA | RAM Controllers | LPDDR2, LVDDR3, DDR3 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | SATA | SATA 3Gbps (1) | ||
| Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Speed | 852MHz | Supplier Device Package | 624-FCBGA (21×21) | ||
| USB | USB 2.0 + PHY (4) | Voltage – I/O | 1.8V, 2.5V, 2.8V, 3.3V |
Overview of MCIMX6Q4AVT08AC – IC MPU I.MX6Q 852MHZ 624FCBGA
The MCIMX6Q4AVT08AC is an ARM® Cortex®-A9 based microprocessor IC featuring a quad-core, 32‑bit architecture running at 852 MHz in a 624‑FCBGA (21 × 21 mm) package. Designed for multimedia-focused and display-based systems, the device combines multi-core compute, graphics acceleration and a broad set of I/O to support demanding embedded applications.
With integrated memory controllers, on-chip multimedia engines and extensive security features, this part targets designs that require high integration of processing, graphics and connectivity while operating across a wide temperature range.
Key Features
- Core and Performance Quad ARM Cortex-A9, 32‑bit cores operating at 852 MHz to support concurrent application and multimedia workloads.
- Multimedia Acceleration On-chip graphics acceleration and multimedia co-processors including NEON™ SIMD for accelerated media and signal processing.
- Memory Interfaces Integrated memory controllers supporting LPDDR2, LVDDR3 and DDR3, providing flexible memory choices for system designers.
- Display and UI Built-in display interface controllers including LCD and keypad connectivity for human‑machine interfaces and display subsystems.
- High-Speed Connectivity Single Gigabit Ethernet port (10/100/1000 Mbps), SATA 3 Gbps and four USB 2.0 ports with PHY for networking and storage integration.
- Vehicle/Control Bus CAN interface for robust controller-area-network communications in control and distributed I/O systems.
- Security Comprehensive security feature set: ARM TrustZone (ARM TZ), boot security, cryptography, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection.
- Package and Mounting 624‑FBGA (FCBGA) package, 21 × 21 mm footprint, surface mount for high‑density PCB implementations.
- Industrial Temperature Range Rated for operation from −40 °C to 125 °C to support deployments in wide‑temperature environments.
- Compliance RoHS compliant for environmental and manufacturing considerations.
Typical Applications
- Infotainment & Media Use graphics acceleration and multimedia processing to deliver UI rendering and 1080p media playback in embedded systems.
- Display-Based HMI LCD interface and keypad support for human‑machine interfaces in equipment and operator panels.
- Networking & Storage Appliances Gigabit Ethernet, SATA 3 Gbps and multiple USB 2.0 ports enable networked devices and local storage subsystems.
- Control & CAN Systems CAN interface and rich I/O set for control nodes and distributed sensor/actuator aggregation in industrial applications.
Unique Advantages
- Balanced Multi-Core Compute: Four ARM Cortex-A9 cores at 852 MHz deliver parallel processing capacity for multitasking embedded workloads.
- Integrated Multimedia Stack: Graphics acceleration plus NEON SIMD and multimedia co-processors reduce the need for external accelerators.
- Broad I/O Integration: On-chip Ethernet, SATA, USB, CAN and display interfaces simplify board-level design and reduce BOM complexity.
- Flexible Memory Support: Native LPDDR2, LVDDR3 and DDR3 controllers allow designers to choose memory technology that matches cost and performance targets.
- Comprehensive Security: Multiple hardware security primitives and secure boot features help protect system integrity and sensitive data.
- Rugged Temperature Range: −40 °C to 125 °C operating range supports deployment in thermally challenging environments.
Why Choose MCIMX6Q4AVT08AC?
The MCIMX6Q4AVT08AC positions itself as a highly integrated processor solution for embedded systems that require a combination of multi-core processing, multimedia capability and extensive connectivity. The device’s integration of memory controllers, display interfaces, storage and communications ports reduces system complexity and shortens development cycles.
Engineers designing display-driven devices, networked appliances or control systems will find the MCIMX6Q4AVT08AC well-suited to projects that demand sustained compute and multimedia throughput, robust security features, and support for wide operating temperatures—backed by thorough technical documentation from the manufacturer.
Request a quote or submit a procurement inquiry to evaluate MCIMX6Q4AVT08AC for your next embedded design project.

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