MCIMX6Q4AVT08AE

IC MPU I.MX6Q 852MHZ 624FCBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6Q 4 Core, 32-Bit 852MHz 624-FCBGA (21x21)

Quantity 861 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6Q
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width4 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-FBGA, FCBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed852MHzSupplier Device Package624-FCBGA (21×21)
USBUSB 2.0 + PHY (4)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6Q4AVT08AE – IC MPU I.MX6Q 852MHZ 624FCBGA

The MCIMX6Q4AVT08AE is a 32-bit ARM® Cortex®-A9 quad-core microprocessor running at 852 MHz, designed for embedded multimedia applications. As a member of the i.MX 6Q series from NXP Semiconductors, it delivers multi-core processing, integrated graphics acceleration and a broad set of high-speed interfaces for feature-rich embedded systems.

Targeted at embedded designs that require multimedia processing, display control and extensive peripheral connectivity, this device emphasizes integration and system-level capabilities to simplify BOM and platform design.

Key Features

  • Quad ARM® Cortex®‑A9 cores Four 32‑bit cores operating at 852 MHz provide parallel processing bandwidth for multitasking and multimedia workloads.
  • Multimedia acceleration Integrated graphics acceleration and NEON™ SIMD co-processor support multimedia and signal-processing tasks.
  • Memory interfaces Built‑in controllers for LPDDR2, LVDDR3 and DDR3 memory types enable flexible memory configurations.
  • Display and user interface On-chip display interface controllers support LCD and keypad connectivity for display-centric applications.
  • High-speed connectivity Single Gigabit Ethernet (10/100/1000 Mbps), one SATA 3 Gbps port and four USB 2.0 ports with PHY provide extensive I/O options.
  • Fieldbus and peripheral interfaces Includes CAN and additional peripheral interfaces for broad system integration.
  • Security and trusted boot Security features include ARM TrustZone, boot security, cryptography, RTIC, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection to support protected execution and secure boot flows.
  • Package and mounting 624‑FBGA (624‑FCBGA) surface‑mount package in a 21 × 21 mm footprint for compact system designs.
  • Operating temperature Rated for extended temperature operation from -40 °C to 125 °C for use in demanding environments.
  • RoHS compliant Meets RoHS environmental requirements.

Typical Applications

  • Infotainment systems Multi‑core processing and graphics acceleration enable multimedia playback, UI rendering and system control in embedded infotainment platforms.
  • Human‑machine interfaces (HMI) LCD and keypad controllers combined with graphics support make the device well suited for advanced operator displays and touchless interfaces.
  • Display‑based systems High‑performance cores with integrated graphics and multiple high‑speed I/O options fit display clusters and multimedia panels.
  • Telematics and connected platforms Built‑in Ethernet, CAN and multiple USB ports provide the connectivity required for data, diagnostic and peripheral integration.

Unique Advantages

  • High parallel processing capacity Four Cortex‑A9 cores at 852 MHz deliver multi‑threaded performance for concurrent multimedia and control tasks.
  • Comprehensive memory support Flexible support for LPDDR2, LVDDR3 and DDR3 simplifies memory selection across platform variants.
  • Broad on‑chip connectivity Integrated Gigabit Ethernet, SATA 3 Gbps, four USB 2.0 + PHY and CAN reduce external bridge components and simplify board design.
  • Integrated security suite Multiple hardware security features support robust boot and run‑time protection without separate security ICs.
  • Durable thermal range -40 °C to 125 °C operating range supports deployment in thermally challenging environments.
  • Compact BGA footprint 624‑FCBGA 21 × 21 mm package enables high‑density PCB layouts for space‑constrained designs.

Why Choose MCIMX6Q4AVT08AE?

The MCIMX6Q4AVT08AE positions itself as a highly integrated multimedia‑centric MPU within the i.MX 6Q family, combining quad‑core processing, hardware acceleration and a wide set of peripheral interfaces. Its feature set is suited to embedded designs that require simultaneous media processing, display control and extensive I/O with built‑in security mechanisms.

Designed for engineers and system integrators seeking a scalable platform, this device offers a clear upgrade path within the i.MX family, compact packaging and extended temperature operation for robust deployments over product lifecycles.

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