MCIMX6Q4AVT10ACR

IC MPU I.MX6Q 1.0GHZ 624FCBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6Q 4 Core, 32-Bit 1.0GHz 624-FCBGA (21x21)

Quantity 1,319 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6Q
ManufacturerNXP USA Inc.
Manufacturing StatusNot For New Designs
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width4 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-FBGA, FCBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed1.0GHzSupplier Device Package624-FCBGA (21×21)
USBUSB 2.0 + PHY (4)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6Q4AVT10ACR – IC MPU I.MX6Q 1.0GHZ 624FCBGA

The MCIMX6Q4AVT10ACR is a quad-core ARM® Cortex®-A9 microprocessor operating at up to 1.0 GHz. Designed for high-performance multimedia applications, the device integrates 2D/3D graphics acceleration, video processing capabilities and multiple high-speed peripheral interfaces to support rich user interfaces and system-level integration.

Built for embedded multimedia and infotainment-class designs, the i.MX 6Q architecture delivers multi-core processing, extensive memory interface support and on-chip security features to address demanding HMI, telematics, infotainment and display-based cluster use cases.

Key Features

  • Quad ARM® Cortex®-A9 cores — Four 32‑bit cores running up to 1 GHz for parallel processing of application and multimedia workloads.
  • Multimedia acceleration — Integrated 2D and 3D graphics engines and 1080p video processing described in the device family datasheet to support rich visual user interfaces.
  • DSP and SIMD — Multimedia co‑processor and NEON™ SIMD support for accelerated media and signal-processing tasks.
  • Memory controllers — Multi‑type memory support including LPDDR2, LVDDR3 and DDR3 to suit a range of system performance and cost targets.
  • Comprehensive interfaces — Gigabit Ethernet (10/100/1000 Mbps, 1), SATA 3 Gbps (1), USB 2.0 with PHY (4 ports), and CAN for broad peripheral and storage connectivity.
  • Security and boot — On-chip security features including ARM TrustZone, boot security, cryptography, secure fusebox, secure JTAG and secure memory/RTC to support device and data protection.
  • Package and mounting — 624‑FBGA (624‑FCBGA) package in a 21 × 21 mm footprint with surface-mount mounting for compact system integration.
  • Operating range — Qualified for an operating temperature span of −40 °C to 125 °C for use in thermally demanding environments.
  • Integrated power and timing — Family datasheet documents integrated power management, PLLs and on‑chip oscillators to simplify system power and clock design.

Typical Applications

  • Infotainment systems — Enables rich multimedia playback and graphical user interfaces with integrated video and graphics acceleration.
  • Human–Machine Interfaces (HMI) — Drives responsive, graphic‑intensive displays and touch interfaces using multi‑core processing and accelerated graphics.
  • Telematics and connected devices — Provides networking and storage interfaces along with on‑chip security to support connected device functions.
  • Display-based clusters — Supports high‑resolution displays and video pipelines required for advanced instrument and cluster designs.

Unique Advantages

  • High-performance quad-core processing: Four Cortex‑A9 cores at up to 1 GHz deliver parallel compute for application and multimedia workloads.
  • Broad multimedia capability: Integrated 2D/3D graphics and 1080p video processing from the device family reduce the need for external accelerators.
  • Extensive peripheral set: Native Gigabit Ethernet, SATA, multiple USB ports and CAN support a wide variety of connectivity and storage options, lowering system BOM.
  • Robust security and boot features: ARM TrustZone, cryptography and secure boot primitives provide layered protection for system and data integrity.
  • Flexible memory support: LPDDR2, LVDDR3 and DDR3 controllers allow designers to select memory technology that best fits performance and cost requirements.
  • Industrial temperature capability: −40 °C to 125 °C operating range enables use in thermally challenging environments.

Why Choose MCIMX6Q4AVT10ACR?

The MCIMX6Q4AVT10ACR combines quad-core Cortex‑A9 performance with integrated multimedia engines, a wide set of high-speed interfaces and comprehensive on-chip security to deliver a tightly integrated solution for embedded multimedia and infotainment-class designs. Its flexible memory support and documented power/clock management features from the family datasheet simplify system design and integration.

This part is well suited to designers seeking multi-core processing, advanced graphics/video capabilities and a broad peripheral mix in a compact FCBGA package with a wide operating temperature range and surface-mount packaging for modern embedded systems.

Request a quote or submit an inquiry to receive pricing and availability information for the MCIMX6Q4AVT10ACR today.

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