MCIMX6Q4AVT10AC

IC MPU I.MX6Q 1.0GHZ 624FCBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6Q 4 Core, 32-Bit 1.0GHz 624-FCBGA (21x21)

Quantity 924 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6Q
ManufacturerNXP USA Inc.
Manufacturing StatusNot For New Designs
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width4 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-FBGA, FCBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed1.0GHzSupplier Device Package624-FCBGA (21×21)
USBUSB 2.0 + PHY (4)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6Q4AVT10AC – IC MPU I.MX6Q 1.0GHZ 624FCBGA

The MCIMX6Q4AVT10AC is a high-integration multimedia microprocessor based on a quad ARM® Cortex®-A9 architecture running at 1.0 GHz. Its combination of four 32-bit cores, NEON™ SIMD multimedia co-processing and integrated 2D/3D graphics and 1080p video processing targets embedded systems that require responsive CPU performance alongside rich media and display capabilities.

Designed with a broad set of peripheral interfaces and memory controllers, this device supports complex display, storage and networked applications while providing extensive on-chip security features and wide operating temperature range for demanding embedded environments.

Key Features

  • Core  Quad ARM® Cortex®-A9, 32-bit cores running at 1 GHz for parallel processing of application and multimedia tasks.
  • Multimedia & Acceleration  Integrated multimedia co-processors including NEON™ SIMD, 2D and 3D graphics acceleration and 1080p video processing for rich user interfaces and video playback.
  • Memory Support  Built-in controllers for LPDDR2, LVDDR3 and DDR3 memory to support high-bandwidth system memory configurations.
  • High-speed I/O  Single Gigabit Ethernet (10/100/1000 Mbps), one SATA 3 Gbps port and four USB 2.0 ports with PHY enable robust connectivity and storage options.
  • Additional Interfaces  CAN interface and display interface controllers (Keypad, LCD) for diverse peripheral integration.
  • Security  On-chip security capabilities including ARM TrustZone, boot security, cryptography, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection.
  • Package & Mounting  624-FCBGA (21 × 21 mm) surface-mount package suitable for compact board designs.
  • Operating Range & Compliance  Wide operating temperature range from −40°C to 125°C and RoHS-compliant status.
  • Integrated Power & Timing  On-chip power management elements referenced in the technical documentation (integrated LDOs, PLLs and oscillators are included in the device family documentation).

Typical Applications

  • Multimedia Embedded Systems  Hardware platforms requiring integrated video decoding, 2D/3D graphics and responsive multi-core processing for rich UI and video playback.
  • Display-based Systems  Devices with LCD or keypad interfaces that need a compact processor with dedicated display controllers and graphics acceleration.
  • Networked & Storage Devices  Systems leveraging Gigabit Ethernet, SATA and multiple USB ports for high-throughput connectivity and local storage.

Unique Advantages

  • Highly integrated multimedia platform: Combines quad Cortex‑A9 cores, NEON SIMD and dedicated graphics/video processing to reduce external accelerator requirements.
  • Flexible memory support: Native controllers for LPDDR2, LVDDR3 and DDR3 simplify memory selection across performance and cost trade-offs.
  • Broad I/O repertoire: Gigabit Ethernet, SATA 3 Gbps, four USB 2.0 ports and CAN provide versatile connectivity without extensive external bridging.
  • Comprehensive on-chip security: Multiple security capabilities (TrustZone, secure boot, cryptography and tamper detection) help protect platform integrity and data.
  • Compact, production-ready package: 624-FCBGA (21 × 21 mm) surface-mount package supports dense board designs while maintaining thermal and signal routing characteristics documented in the technical datasheet.
  • Wide operating temperature: −40°C to 125°C operation supports deployment in thermally demanding embedded environments.

Why Choose MCIMX6Q4AVT10AC?

The MCIMX6Q4AVT10AC positions itself as a balanced platform for embedded systems that demand a combination of multi-core processing, advanced multimedia capabilities and a full complement of high-speed interfaces. Its inclusion in the i.MX6 family provides access to family-level documentation and architectural consistency for scalable designs.

Engineers building display-rich devices, networked embedded platforms or multimedia controllers will find the device’s integrated security, memory flexibility and I/O breadth help simplify BOM and enable focused system design. The device’s documented power-management and timing resources support robust system integration and long-term product planning.

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