MCIMX6Q4AVT08AER

IC MPU I.MX6Q 852MHZ 624FCBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6Q 4 Core, 32-Bit 852MHz 624-FCBGA (21x21)

Quantity 1,521 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6Q
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width4 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-FBGA, FCBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed852MHzSupplier Device Package624-FCBGA (21×21)
USBUSB 2.0 + PHY (4)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6Q4AVT08AER – IC MPU I.MX6Q 852MHZ 624FCBGA

The MCIMX6Q4AVT08AER is a high-integration microprocessor from NXP featuring a quad ARM® Cortex®-A9 core architecture running at 852 MHz. It targets embedded multimedia and display-based designs, delivering multicore processing, graphics acceleration, and broad peripheral support for advanced HMI, infotainment, telematics, and industrial display systems.

Designed for systems that require a combination of compute, media processing, and extensive I/O, the device provides key interfaces and memory controller support to simplify integration and accelerate time-to-market.

Key Features

  • Core Quad ARM® Cortex®-A9 processor cores, 32-bit, operating at 852 MHz to handle concurrent application and media workloads.
  • Multimedia Acceleration Integrated multimedia/DSP functions with NEON™ SIMD and graphics acceleration for 2D/3D graphics and video processing.
  • Memory Support Built-in memory controllers for LPDDR2, LVDDR3 and DDR3 to support flexible system memory choices and bandwidth requirements.
  • Display & HMI Display interface controllers supporting LCD and keypad connections for rich human‑machine interface designs.
  • High-Speed Interfaces Gigabit Ethernet (10/100/1000 Mbps), SATA 3 Gbps, and four USB 2.0 + PHY ports provide a broad set of connectivity and storage options.
  • Additional I/O CAN interface and a variety of peripheral interfaces enable integration with vehicle networks, industrial buses, and external sensors.
  • Security Hardware security features including ARM TrustZone, boot security, cryptography, secure JTAG, secure memory, secure RTC, secure fusebox, RTIC, and tamper detection to support protected system designs.
  • Package & Mounting 624-FCBGA package (21 × 21 mm) in a surface-mount form factor for compact board-level integration.
  • Operating Range & Compliance Qualified for operation from −40 °C to 125 °C and RoHS compliant for environmental alignment.

Typical Applications

  • Infotainment and HMI systems — Drive graphical displays and user interfaces using integrated graphics acceleration and display controllers.
  • Multimedia processing — Handle video decode/encode and advanced media tasks leveraging NEON SIMD and multimedia coprocessors.
  • Networking and storage gateways — Implement networked storage or gateway functions using Gigabit Ethernet, SATA, and multiple USB ports.
  • Industrial and telematics devices — Support rugged embedded applications with broad temperature range and CAN connectivity for system control and communication.

Unique Advantages

  • Quad-core processing performance: Four ARM® Cortex®-A9 cores at 852 MHz provide multicore throughput for parallel application and media tasks.
  • Comprehensive I/O mix: Integrated Gigabit Ethernet, SATA, multiple USB 2.0 ports and CAN reduce external bridging and simplify board design.
  • Flexible memory interface: Support for LPDDR2, LVDDR3 and DDR3 enables selection of memory types to match cost, power and performance targets.
  • Robust security feature set: On-chip TrustZone, cryptography, secure boot and tamper detection provide hardware foundations for secure embedded systems.
  • Wide operating temperature: −40 °C to 125 °C operation supports deployment in thermally demanding environments.
  • Compact package: 624-FCBGA (21 × 21 mm) delivers high pin density in a compact footprint for space-constrained designs.

Why Choose MCIMX6Q4AVT08AER?

The MCIMX6Q4AVT08AER combines a quad-core ARM® Cortex®-A9 architecture with integrated multimedia acceleration and a rich set of high-speed interfaces to address demanding embedded system requirements. As part of the i.MX 6 series, it provides a consistent platform for designs that need multicore compute, video/graphics capabilities, and extensive peripheral connectivity.

This device is well suited for engineers building advanced HMI, multimedia, networking, and industrial display products that require secure boot, hardware cryptography, and a broad operating temperature range. Its package density and memory flexibility support compact, scalable designs across varying performance and cost targets.

Request a quote or submit an inquiry to receive pricing, availability, and technical sales assistance for the MCIMX6Q4AVT08AER.

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