MCIMX6Q4AVT08AD

IC MPU I.MX6Q 852MHZ 624FCBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6Q 4 Core, 32-Bit 852MHz 624-FCBGA (21x21)

Quantity 446 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6Q
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width4 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-FBGA, FCBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed852MHzSupplier Device Package624-FCBGA (21×21)
USBUSB 2.0 + PHY (4)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6Q4AVT08AD – IC MPU I.MX6Q 852MHZ 624FCBGA

The MCIMX6Q4AVT08AD is a 4-core ARM® Cortex®-A9 microprocessor from NXP Semiconductors' i.MX 6Q series, specified at 852 MHz and delivered in a 624-FCBGA (21 × 21 mm) package. It targets multimedia and display-based systems, offering integrated processing, graphics acceleration, and a broad set of peripheral interfaces for embedded applications.

Series-level documentation for the i.MX 6Dual/6Quad family highlights integrated 2D/3D graphics, 1080p video processing, and a wide-memory interface—capabilities reflected in this part’s architecture and peripheral set for demanding embedded multimedia use cases.

Key Features

  • Core  ARM® Cortex®-A9 processor core architecture, quad-core configuration (4 cores, 32-bit) running at 852 MHz.
  • Multimedia & DSP  Multimedia co-processor support and NEON™ SIMD acceleration for optimized media and signal processing workloads.
  • Memory  Memory controller support for LPDDR2, LVDDR3, and DDR3; series documentation references a 64-bit DDR memory interface.
  • Graphics & Video  Graphics acceleration with 2D/3D capabilities and 1080p video processing described at the series level.
  • High-speed Interfaces  Integrated Gigabit Ethernet (10/100/1000 Mbps, 1 port), SATA 3 Gbps (1 port), and four USB 2.0 ports with PHY.
  • Peripheral I/O  Display interface controllers (LCD, keypad), CAN interface, and a wide set of general-purpose and multimedia interfaces.
  • Security  On-chip security features including ARM TrustZone (ARM TZ), boot security, cryptography, RTIC, secure fusebox, secure JTAG, secure memory, secure RTC, and tamper detection.
  • Package & Mounting  624-FCBGA package (21 × 21 mm, FCPBGA 0.8 mm pitch) designed for surface-mount assembly.
  • Operating Range  Specified operating temperature range −40 °C to 125 °C.
  • Compliance  RoHS compliant.

Typical Applications

  • Infotainment systems  Multimedia processing, graphics and video playback for embedded infotainment and display-centered platforms.
  • Human–Machine Interfaces (HMI)  Drives LCD displays and keypad interfaces for responsive, graphics-rich user interfaces.
  • Telematics and connected devices  Integrated networking and peripheral support—Ethernet, CAN, USB, and SATA—suitable for connected embedded systems.
  • Multimedia appliances  Handles 2D/3D graphics and 1080p video processing workloads in embedded media applications.

Unique Advantages

  • Quad-core processing with SIMD acceleration: Four ARM® Cortex®-A9 cores plus NEON™ SIMD provide parallel compute capacity for multimedia and signal-processing tasks.
  • Broad, high-speed I/O set: Gigabit Ethernet, SATA 3 Gbps, and multiple USB 2.0 ports enable high-throughput connectivity and storage options.
  • Flexible memory support: Controllers for LPDDR2, LVDDR3, and DDR3 give designers options for balancing performance, capacity, and cost.
  • Integrated security mechanisms: Multiple on-chip security features (ARM TZ, secure boot, cryptography, secure JTAG, tamper detection) help protect system integrity and assets.
  • Designed for dense embedded designs: 624-FCBGA (21 × 21 mm) package supports compact, surface-mount system designs while providing extensive pinout functionality.
  • Wide operating temperature: −40 °C to 125 °C rating supports deployment in thermally demanding embedded environments.

Why Choose MCIMX6Q4AVT08AD?

The MCIMX6Q4AVT08AD combines quad-core ARM® Cortex®-A9 processing, multimedia acceleration, and a comprehensive set of high-speed interfaces in a compact 624-FCBGA package. As a member of the i.MX 6Q family from NXP Semiconductors, it aligns with a series-level design approach that emphasizes multimedia integration, graphics capability, and system-level connectivity.

This part is well suited for engineers building embedded systems that require integrated multimedia processing, robust security features, and flexible memory and I/O options. Its package density and operating range provide long-term value for space-constrained, performance-focused designs supported by i.MX 6-series technical documentation.

Request a quote or submit a pricing and availability request to get MCIMX6Q4AVT08AD for your next embedded multimedia or display project.

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