| N/A | N/A | MCIMX6G2AVM05ABR | NXP Semiconductors | I.MX 32-BIT MPU, ARM CORTEX-A7 C | Microprocessors | 289-MAPBGA (14x14) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: DDR3, DDR3L, LPDDR2 Display & Interface Controllers: LCD, LVDS Voltage – I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 289-MAPBGA (14×14) | 724 | |
 | | MCIMX6G2AVM07AA | NXP Semiconductors | IC MPU I.MX6UL 696MHZ 289MAPBGA | Microprocessors | 289-MAPBGA (14x14) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Display & Interface Controllers: LCD, LVDS Voltage – I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 289-MAPBGA (14×14) | 324 | |
 | | MCIMX6G2AVM07AB | NXP Semiconductors | IC MPU I.MX6UL 696MHZ 289MAPBGA | Microprocessors | 289-MAPBGA (14x14) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Display & Interface Controllers: LCD, LVDS Voltage – I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 289-MAPBGA (14×14) | 110 | |
 | | MCIMX6G2CVK05AA | NXP Semiconductors | IC MPU I.MX6UL 528MHZ 272MAPBGA | Microprocessors | 272-MAPBGA (9x9) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Display & Interface Controllers: LCD, LVDS Voltage – I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 272-MAPBGA (9×9) | 797 | |
 | | MCIMX6G2CVK05AB | NXP Semiconductors | IC MPU I.MX6UL 528MHZ 272MAPBGA | Microprocessors | 272-MAPBGA (9x9) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Display & Interface Controllers: LCD, LVDS Voltage – I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 272-MAPBGA (9×9) | 391 | |
 | | MCIMX6G2CVM05AA | NXP Semiconductors | IC MPU I.MX6UL 528MHZ 289MAPBGA | Microprocessors | 289-MAPBGA (14x14) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Display & Interface Controllers: LCD, LVDS Voltage – I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 289-MAPBGA (14×14) | 177 | |
 | | MCIMX6G2CVM05AB | NXP Semiconductors | IC MPU I.MX6UL 528MHZ 289MAPBGA | Microprocessors | 289-MAPBGA (14x14) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Display & Interface Controllers: LCD, LVDS Voltage – I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 289-MAPBGA (14×14) | 427 | |
 | | MCIMX6G2CVM05ABR | NXP Semiconductors | IC MPU I.MX6G 528MHZ 289MAPBGA | Microprocessors | 289-MAPBGA (14x14) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: DDR3, DDR3L, LPDDR2 Display & Interface Controllers: LCD, LVDS Voltage – I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 289-MAPBGA (14×14) | 60 | |
 | | MCIMX6G2DVK05AA | NXP Semiconductors | IC MPU I.MX6UL 528MHZ 272MAPBGA | Microprocessors | 272-MAPBGA (9x9) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Display & Interface Controllers: LCD, LVDS Voltage – I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 272-MAPBGA (9×9) | 1,466 | |
 | | MCIMX6G2DVK05AA-NXP | NXP Semiconductors | IC MPU I.MX6 528MHZ 272MAPBGA | Microprocessors | 272-MAPBGA (9x9) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Display & Interface Controllers: LCD, LVDS Voltage – I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 272-MAPBGA (9×9) | 288 | |
 | | MCIMX6G2DVK05AB | NXP Semiconductors | IC MPU I.MX6UL 528MHZ 272MAPBGA | Microprocessors | 272-MAPBGA (9x9) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Display & Interface Controllers: LCD, LVDS Voltage – I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 272-MAPBGA (9×9) | 365 | |
 | | MCIMX6G2DVM05AA | NXP Semiconductors | IC MPU I.MX6UL 528MHZ 289MAPBGA | Microprocessors | 289-MAPBGA (14x14) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Display & Interface Controllers: LCD, LVDS Voltage – I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 289-MAPBGA (14×14) | 829 | |
 | | MCIMX6G2DVM05AA-NXP | NXP Semiconductors | IC MPU I.MX6 528MHZ 289MAPBGA | Microprocessors | 289-MAPBGA (14x14) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Display & Interface Controllers: LCD, LVDS Voltage – I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 289-MAPBGA (14×14) | 746 | |
 | | MCIMX6G2DVM05AB | NXP Semiconductors | IC MPU I.MX6UL 528MHZ 289MAPBGA | Microprocessors | 289-MAPBGA (14x14) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Display & Interface Controllers: LCD, LVDS Voltage – I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 289-MAPBGA (14×14) | 858 | |
 | | MCIMX6G3CVK05AA | NXP Semiconductors | IC MPU I.MX6UL 528MHZ 272MAPBGA | Microprocessors | 272-MAPBGA (9x9) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Display & Interface Controllers: LCD, LVDS Voltage – I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 272-MAPBGA (9×9) | 1,046 | |
 | | MCIMX6G3CVK05AB | NXP Semiconductors | IC MPU I.MX6UL 528MHZ 272MAPBGA | Microprocessors | 272-MAPBGA (9x9) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Display & Interface Controllers: LCD, LVDS Voltage – I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 272-MAPBGA (9×9) | 286 | |
 | | MCIMX6G3CVM05AA | NXP Semiconductors | IC MPU I.MX6UL 528MHZ 289MAPBGA | Microprocessors | 289-MAPBGA (14x14) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Display & Interface Controllers: LCD, LVDS Voltage – I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 289-MAPBGA (14×14) | 1,849 | |
 | | MCIMX6G3CVM05AB | NXP Semiconductors | IC MPU I.MX6UL 528MHZ 289MAPBGA | Microprocessors | 289-MAPBGA (14x14) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Display & Interface Controllers: LCD, LVDS Voltage – I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 289-MAPBGA (14×14) | 130 | |
 | | MCIMX6G3DVK05AA | NXP Semiconductors | IC MPU I.MX6UL 528MHZ 272MAPBGA | Microprocessors | 272-MAPBGA (9x9) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Display & Interface Controllers: LCD, LVDS Voltage – I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 272-MAPBGA (9×9) | 1,575 | |
 | | MCIMX6G3DVK05AA-NXP | NXP Semiconductors | I.MX 32 BIT MPU, ARM CORTEX-A7 C | Microprocessors | N/A | N/A | N/A | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: LPDDR2, DDR3, DDR3L Co-Processors/DSP: Multimedia; NEON™ SIMD | 1,007 | |