MCIMX6G3CVK05AB
| Part Description |
ARM® Cortex®-A7 Microprocessor IC i.MX6UL 1 Core, 32-Bit 528MHz 272-MAPBGA (9x9) |
|---|---|
| Quantity | 1,392 Available (as of October 9, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6G |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A7 | Device Package | 272-MAPBGA (9x9) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LCD, LVDS | ECCN | 5A992C | Ethernet | 10/100Mbps (2) | ||
| Graphics Acceleration | No | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 105°C (TJ) | Package / Case | 272-LFBGA | RAM Controllers | LPDDR2, DDR3, DDR3L | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | ||
| Speed | 528MHz | Supplier Device Package | 272-MAPBGA (9×9) | USB | USB 2.0 + PHY (2) | ||
| Voltage – I/O | 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V |
Overview of MCIMX6G3CVK05AB – IC MPU I.MX6UL 528MHZ 272MAPBGA
The MCIMX6G3CVK05AB is a single-core ARM® Cortex®-A7 microprocessor IC from the i.MX 6UltraLite family, running at 528 MHz and supplied in a compact 272-MAPBGA (9×9) package. It targets embedded designs that require a power-efficient application processor with integrated system features and industrial operating temperature support.
Designed for integration into user interfaces, edge gateways and secure embedded systems, the device combines low-power operation, flexible memory and peripheral interfaces, and hardware security features to simplify system design and deployment.
Key Features
- Core Single ARM® Cortex®-A7 core at 528 MHz with NEON™ SIMD support for multimedia processing and efficient compute.
- Memory & Boot Memory controller support for LPDDR2, DDR3 and DDR3L; flexible boot options include Quad SPI and raw NAND, with support for eMMC and SD interfaces as described for the i.MX 6UltraLite family.
- Power & Integration Integrated power management module (family feature) reduces external power-supply complexity and simplifies power sequencing for embedded designs.
- Security Multiple hardware security building blocks are provided, including ARM TrustZone (ARM TZ), A‑HAB, CAAM, CSU, SJC and SNVS, plus family-level capabilities such as secure boot and on-the-fly DRAM encryption.
- Connectivity & Interfaces Dual 10/100 Mbps Ethernet ports, two USB 2.0 OTG controllers with PHY, two CAN ports, multiple UART/SPI/I2C interfaces and smart card support enable broad peripheral connectivity.
- Analog & System Two 12-bit ADC modules (up to 10 total inputs), RTC, watchdog timers and multiple PWM/timer channels support sensor interfacing and real-time control.
- Display & Video I/O Parallel LCD and LVDS display interface controllers are available for driving embedded displays and HMIs.
- Package & Temperature 272‑MAPBGA (9×9) surface-mount package with industrial qualification and an operating temperature range of −40 °C to 105 °C.
Typical Applications
- Human‑Machine Interfaces (HMI) Drive LCD or LVDS displays and handle touch/sensor input with the Cortex‑A7 core, display controllers and ADC resources for responsive user interfaces.
- IoT Gateways & Edge Devices Dual Ethernet, USB OTG, and flexible memory/boot options make it suitable for secure edge processing and protocol bridging in gateway applications.
- Intelligent Industrial Control Industrial temperature grade, CAN ports, multiple timers and robust security features support control, monitoring and secure firmware handling in industrial systems.
- Point‑of‑Sale & Secure Payment Terminals Built-in hardware security modules and smart card interfaces compatible with EMV standards enable secure transactions and tamper-aware designs.
Unique Advantages
- Highly integrated power management: The family’s integrated power management module reduces external BOM and eases power-sequencing design.
- Comprehensive hardware security: ARM TrustZone plus A‑HAB, CAAM and related secure subsystems provide a hardware foundation for secure boot, encryption and protected storage.
- Flexible memory and boot connectivity: Support for LPDDR2/DDR3/DDR3L, eMMC, Quad SPI, NAND and SD allows designers to optimize cost, performance and boot/storage strategies.
- Rich peripheral set: Dual Ethernet, dual USB OTG with PHY, CAN, multiple UART/SPI/I2C and smart card interfaces enable extensive I/O integration without additional controllers.
- Industrial ready: Industrial qualification and an operating range from −40 °C to 105 °C meet common embedded deployment requirements.
- Compact package: 272‑MAPBGA (9×9) package supports space-constrained boards while exposing many GPIOs and interfaces.
Why Choose MCIMX6G3CVK05AB?
MCIMX6G3CVK05AB positions itself as a power-efficient, secure and compact application processor for embedded systems that require reliable connectivity, flexible memory options and hardware security. Its single Cortex‑A7 core combined with on-chip integration simplifies BOM and board design while supporting a broad set of peripheral interfaces.
This part is well suited for designers building industrial HMI, IoT edge devices, secure payment terminals and other embedded applications that benefit from a balance of performance, integration and long-term ecosystem support provided by the i.MX 6UltraLite family.
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