MCIMX6G3CVK05AB

IC MPU I.MX6UL 528MHZ 272MAPBGA
Part Description

ARM® Cortex®-A7 Microprocessor IC i.MX6UL 1 Core, 32-Bit 528MHz 272-MAPBGA (9x9)

Quantity 1,392 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6G
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A7Device Package272-MAPBGA (9x9)
Display & Interface ControllersLCD, LVDSECCN5A992CEthernet10/100Mbps (2)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TJ)Package / Case272-LFBGARAM ControllersLPDDR2, DDR3, DDR3L
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Speed528MHzSupplier Device Package272-MAPBGA (9×9)USBUSB 2.0 + PHY (2)
Voltage – I/O1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6G3CVK05AB – IC MPU I.MX6UL 528MHZ 272MAPBGA

The MCIMX6G3CVK05AB is a single-core ARM® Cortex®-A7 microprocessor IC from the i.MX 6UltraLite family, running at 528 MHz and supplied in a compact 272-MAPBGA (9×9) package. It targets embedded designs that require a power-efficient application processor with integrated system features and industrial operating temperature support.

Designed for integration into user interfaces, edge gateways and secure embedded systems, the device combines low-power operation, flexible memory and peripheral interfaces, and hardware security features to simplify system design and deployment.

Key Features

  • Core  Single ARM® Cortex®-A7 core at 528 MHz with NEON™ SIMD support for multimedia processing and efficient compute.
  • Memory & Boot  Memory controller support for LPDDR2, DDR3 and DDR3L; flexible boot options include Quad SPI and raw NAND, with support for eMMC and SD interfaces as described for the i.MX 6UltraLite family.
  • Power & Integration  Integrated power management module (family feature) reduces external power-supply complexity and simplifies power sequencing for embedded designs.
  • Security  Multiple hardware security building blocks are provided, including ARM TrustZone (ARM TZ), A‑HAB, CAAM, CSU, SJC and SNVS, plus family-level capabilities such as secure boot and on-the-fly DRAM encryption.
  • Connectivity & Interfaces  Dual 10/100 Mbps Ethernet ports, two USB 2.0 OTG controllers with PHY, two CAN ports, multiple UART/SPI/I2C interfaces and smart card support enable broad peripheral connectivity.
  • Analog & System  Two 12-bit ADC modules (up to 10 total inputs), RTC, watchdog timers and multiple PWM/timer channels support sensor interfacing and real-time control.
  • Display & Video I/O  Parallel LCD and LVDS display interface controllers are available for driving embedded displays and HMIs.
  • Package & Temperature  272‑MAPBGA (9×9) surface-mount package with industrial qualification and an operating temperature range of −40 °C to 105 °C.

Typical Applications

  • Human‑Machine Interfaces (HMI)  Drive LCD or LVDS displays and handle touch/sensor input with the Cortex‑A7 core, display controllers and ADC resources for responsive user interfaces.
  • IoT Gateways & Edge Devices  Dual Ethernet, USB OTG, and flexible memory/boot options make it suitable for secure edge processing and protocol bridging in gateway applications.
  • Intelligent Industrial Control  Industrial temperature grade, CAN ports, multiple timers and robust security features support control, monitoring and secure firmware handling in industrial systems.
  • Point‑of‑Sale & Secure Payment Terminals  Built-in hardware security modules and smart card interfaces compatible with EMV standards enable secure transactions and tamper-aware designs.

Unique Advantages

  • Highly integrated power management: The family’s integrated power management module reduces external BOM and eases power-sequencing design.
  • Comprehensive hardware security: ARM TrustZone plus A‑HAB, CAAM and related secure subsystems provide a hardware foundation for secure boot, encryption and protected storage.
  • Flexible memory and boot connectivity: Support for LPDDR2/DDR3/DDR3L, eMMC, Quad SPI, NAND and SD allows designers to optimize cost, performance and boot/storage strategies.
  • Rich peripheral set: Dual Ethernet, dual USB OTG with PHY, CAN, multiple UART/SPI/I2C and smart card interfaces enable extensive I/O integration without additional controllers.
  • Industrial ready: Industrial qualification and an operating range from −40 °C to 105 °C meet common embedded deployment requirements.
  • Compact package: 272‑MAPBGA (9×9) package supports space-constrained boards while exposing many GPIOs and interfaces.

Why Choose MCIMX6G3CVK05AB?

MCIMX6G3CVK05AB positions itself as a power-efficient, secure and compact application processor for embedded systems that require reliable connectivity, flexible memory options and hardware security. Its single Cortex‑A7 core combined with on-chip integration simplifies BOM and board design while supporting a broad set of peripheral interfaces.

This part is well suited for designers building industrial HMI, IoT edge devices, secure payment terminals and other embedded applications that benefit from a balance of performance, integration and long-term ecosystem support provided by the i.MX 6UltraLite family.

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