MCIMX6G2DVM05AB

IC MPU I.MX6UL 528MHZ 289MAPBGA
Part Description

ARM® Cortex®-A7 Microprocessor IC i.MX6UL 1 Core, 32-Bit 528MHz 289-MAPBGA (14x14)

Quantity 1,457 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6G
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A7Device Package289-MAPBGA (14x14)
Display & Interface ControllersLCD, LVDSECCN5A992CEthernet10/100Mbps (2)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature0°C ~ 95°C (TJ)Package / Case289-LFBGARAM ControllersLPDDR2, DDR3, DDR3L
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Speed528MHzSupplier Device Package289-MAPBGA (14×14)USBUSB 2.0 + PHY (2)
Voltage – I/O1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6G2DVM05AB – IC MPU I.MX6UL 528MHz 289MAPBGA

The MCIMX6G2DVM05AB is an NXP i.MX 6UltraLite family microprocessor based on a single ARM® Cortex®‑A7 core running at up to 528 MHz. It targets embedded and consumer applications that require a compact, power‑efficient application processor with integrated system support.

Built with an integrated power management module and a broad set of peripheral interfaces, this device is suited for designs such as point‑of‑sale terminals, telematics, and IoT endpoints where integration, connectivity, and secure operation are priorities.

Key Features

  • Core & Performance Single ARM® Cortex®‑A7 core, 32‑bit, operating at up to 528 MHz for control and application processing.
  • Multimedia & SIMD Multimedia co‑processor capabilities including NEON™ SIMD acceleration for signal processing and media tasks.
  • Memory Interfaces Supports multiple memory controller options including LPDDR2, DDR3 and DDR3L; the i.MX 6UltraLite family also provides interfaces for raw and managed NAND, NOR flash, eMMC and Quad SPI (series feature).
  • Display Interfaces Integrated display controllers for LCD and LVDS panels to support graphical user interfaces.
  • Connectivity Dual 10/100 Mbps Ethernet controllers, two USB 2.0 ports with PHY, and CAN interface support for networked and vehicle/industrial communication.
  • Security Hardware security features including ARM TrustZone (ARM TZ), A‑HAB, CAAM, CSU, SJC and SNVS to support secure boot, cryptography and system integrity.
  • Power Management Integrated power management module reduces external power supply complexity and simplifies power sequencing (series feature).
  • Package & Mounting 289‑MAPBGA (14 × 14 mm) surface‑mount package; supplier package listed as 289‑LFBGA / 289‑MAPBGA.
  • Environmental & Operating Range RoHS compliant and specified for an operating temperature range of 0 °C to 95 °C.

Typical Applications

  • Point‑of‑Sale (POS) Systems Runs payment and POS application logic while driving local displays and handling networking via Ethernet and USB.
  • Telematics Integrates connectivity (Ethernet, CAN) and secure processing for vehicle and fleet telematics solutions.
  • IoT Endpoints Acts as an application processor in smart IoT devices where low power, secure boot and flexible memory options are required.

Unique Advantages

  • Highly integrated power management: The on‑chip power management module simplifies external power design and sequencing, reducing BOM complexity.
  • Flexible memory support: Multiple supported memory controllers (LPDDR2, DDR3, DDR3L) and series‑level support for NAND, NOR, eMMC and Quad SPI enable adaptable storage choices.
  • Comprehensive connectivity: Dual Ethernet, dual USB 2.0 with PHY and CAN provide a range of wired interfaces for networking and peripheral connectivity.
  • Built‑in security primitives: ARM TrustZone plus A‑HAB, CAAM, CSU, SJC and SNVS provide layered hardware security for secure boot, cryptography and runtime protection.
  • Compact BGA package: 289‑MAPBGA (14 × 14 mm) surface‑mount package supports high‑density board designs for space‑constrained products.

Why Choose MCIMX6G2DVM05AB?

The MCIMX6G2DVM05AB positions itself as a compact, energy‑aware application processor offering a balanced mix of performance, connectivity and integrated system features. Its single Cortex‑A7 core at 528 MHz combined with series‑level multimedia and security capabilities makes it suitable for delivery of secure, networked embedded solutions.

Engineers designing consumer and embedded products that require flexible memory options, integrated power sequencing and multiple wired interfaces will find this device appropriate for reducing BOM complexity and accelerating time to market while leveraging NXP’s i.MX ecosystem and documentation.

Request a quote or submit an inquiry to receive pricing, availability and technical support information for MCIMX6G2DVM05AB.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 2006


    Headquarters: Eindhoven, North Brabant, Netherlands


    Employees: 38,000+


    Revenue: $10.53 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up