MCIMX6G2DVK05AA-NXP
| Part Description |
ARM® Cortex®-A7 Microprocessor IC i.MX6 1 Core, 32-Bit 528MHz 272-MAPBGA (9x9) |
|---|---|
| Quantity | 797 Available (as of October 9, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6G |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A7 | Device Package | 272-MAPBGA (9x9) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LCD, LVDS | ECCN | 5A992 | Ethernet | 10/100Mbps (1) | ||
| Graphics Acceleration | No | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | 0°C ~ 95°C (TJ) | Package / Case | 272-LFBGA | RAM Controllers | LPDDR2, DDR3, DDR3L | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | ||
| Speed | 528MHz | Supplier Device Package | 272-MAPBGA (9×9) | USB | USB 2.0 + PHY (1) | ||
| Voltage – I/O | 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V |
Overview of MCIMX6G2DVK05AA-NXP – IC MPU I.MX6 528MHZ 272MAPBGA
The MCIMX6G2DVK05AA-NXP is a single-core ARM® Cortex®-A7 microprocessor operating at 528 MHz, provided in a 272-MAPBGA (9×9) surface-mount package. It is offered as part of the i.MX 6G series for embedded applications and is qualified for consumer use.
Designed for embedded systems requiring a compact, integrated MPU, this device combines a 32-bit Cortex-A7 core with multimedia co-processing, flexible memory controller support, multiple display and connectivity interfaces, and a set of hardware security features.
Key Features
- Core and Performance Single ARM® Cortex®-A7 core running at 528 MHz with 32-bit bus width for straightforward embedded processing tasks.
- Multimedia Co-processing Includes multimedia and NEON™ SIMD co-processor capabilities to accelerate signal and media-oriented workloads.
- Memory Support Integrated memory controllers for LPDDR2, DDR3, and DDR3L to support a range of low-power and standard DRAM options.
- Display Interfaces On-chip controllers for LCD and LVDS displays to enable direct connection of common panel types for user interfaces.
- Connectivity Integrated 10/100 Mbps Ethernet (1), USB 2.0 with PHY (1), and CAN interface for networked and peripheral connectivity.
- Security Features Hardware security capabilities including ARM TrustZone (ARM TZ), A-HAB, CAAM, CSU, SJC, and SNVS for platform integrity and secure boot support.
- Package and Mounting 272-LFBGA / 272-MAPBGA (9×9) supplier device package designed for surface-mount assembly.
- Operating Range and Compliance Consumer-qualified device with an operating temperature range of 0 °C to 95 °C and RoHS compliance.
Typical Applications
- Consumer Embedded Devices Suitable for consumer-grade embedded products that require a compact MPU with multimedia and connectivity features.
- User Interface and Display Control LCD and LVDS controllers enable use as the processing engine for display-driven interfaces and panel controllers.
- Networked Peripherals Built-in 10/100 Ethernet, USB 2.0 with PHY, and CAN support networked and connected peripheral designs.
Unique Advantages
- Single-core Cortex-A7 Efficiency: Provides a focused 528 MHz processing element for power- and cost-sensitive embedded designs.
- Multimedia and SIMD Acceleration: NEON™ SIMD and multimedia co-processor support offloads media and signal processing tasks from the main core.
- Flexible Memory Options: Support for LPDDR2, DDR3, and DDR3L memory controllers simplifies choices for power and performance trade-offs.
- Integrated Connectivity: On-chip Ethernet, USB 2.0 with PHY, and CAN reduce external component count for connected designs.
- Hardware Security Suite: Multiple built-in security modules (ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS) support platform integrity and secure boot strategies.
- Compact, Surface-Mount Package: 272-MAPBGA (9×9) package enables high-density board designs in space-constrained applications.
Why Choose MCIMX6G2DVK05AA-NXP?
The MCIMX6G2DVK05AA-NXP balances processing capability, multimedia acceleration, and integrated connectivity in a compact, RoHS-compliant package for consumer-qualified embedded designs. Its single ARM® Cortex®-A7 core at 528 MHz, together with NEON SIMD support and multiple security engines, makes it a practical choice when you need a focused MPU with on-chip peripherals and memory flexibility.
This part is well suited to designers building consumer-focused embedded systems that require display support, networked interfaces, and hardware security features within a compact surface-mount package and a specified 0 °C to 95 °C operating range.
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