MCIMX6G2DVK05AA

IC MPU I.MX6UL 528MHZ 272MAPBGA
Part Description

ARM® Cortex®-A7 Microprocessor IC i.MX6UL 1 Core, 32-Bit 528MHz 272-MAPBGA (9x9)

Quantity 1,907 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6G
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A7Device Package272-MAPBGA (9x9)
Display & Interface ControllersLCD, LVDSECCN5A992CEthernet10/100Mbps (2)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature0°C ~ 95°C (TJ)Package / Case272-LFBGARAM ControllersLPDDR2, DDR3, DDR3L
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Speed528MHzSupplier Device Package272-MAPBGA (9×9)USBUSB 2.0 + PHY (2)
Voltage – I/O1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6G2DVK05AA – IC MPU I.MX6UL 528MHZ 272MAPBGA

The MCIMX6G2DVK05AA is an i.MX 6UltraLite microprocessor from NXP Semiconductors featuring a single ARM® Cortex®-A7 32‑bit core running up to 528 MHz. It targets embedded and consumer applications where efficient compute, integrated peripherals and a compact BGA package are required.

Designed for use in applications such as IoT gateways, point-of-sale terminals, telematics, human‑machine interfaces and smart appliances, the device combines an ultra‑efficient core with an integrated power management module and a broad set of memory and peripheral interfaces to simplify system design.

Key Features

  • Core — Single ARM® Cortex®-A7 32‑bit core operating up to 528 MHz for efficient embedded processing.
  • Multimedia and SIMD — Multimedia co‑processor and NEON™ SIMD support for optimized signal processing workloads.
  • Memory interfaces — Integrated controllers for LPDDR2, DDR3 and DDR3L memory types to match a range of system memory choices.
  • Display — Built‑in LCD and LVDS display interface controllers for embedded display connectivity.
  • Connectivity — Dual 10/100 Mbps Ethernet ports, two USB 2.0 ports with PHY and CAN interface for common network and peripheral needs.
  • Security — Security features including ARM TrustZone (ARM TZ), A‑HAB, CAAM, CSU, SJC and SNVS for platform security functions.
  • Power integration — Integrated power management module to reduce external power supply complexity and simplify power sequencing.
  • Package and mounting — Supplied in a compact 272‑MAPBGA (9×9 mm) surface‑mount package; package case 272‑LFBGA referenced in product documentation.
  • Operating range — Consumer qualification with an operating temperature range of 0 °C to 95 °C.
  • No dedicated graphics accelerator — Device does not include a separate graphics acceleration unit.

Typical Applications

  • Point‑of‑Sale (POS) systems — Drives transaction terminals and kiosks, using the integrated interfaces and compact package to simplify board design.
  • Telematics — Suitable for telematics controllers where the single‑core Cortex‑A7 and security features support vehicle communications and data handling.
  • IoT Gateways — Acts as an efficient gateway processor connecting sensors and peripherals via Ethernet, USB and CAN.
  • Human‑Machine Interfaces (HMI) — Powers embedded displays and user interfaces using LCD or LVDS display controllers.
  • Smart appliances — Enables connected appliance control leveraging the integrated power management and peripheral set.

Unique Advantages

  • Highly integrated power management: On‑chip power management reduces external supply complexity and eases power sequencing.
  • Flexible memory support: Native controllers for LPDDR2, DDR3 and DDR3L accommodate a variety of memory architectures and BOM choices.
  • Rich peripheral connectivity: Dual Ethernet, dual USB 2.0 with PHY and CAN provide multiple connectivity options for networked embedded systems.
  • Hardware security stack: ARM TrustZone plus A‑HAB, CAAM, CSU, SJC and SNVS deliver a layered security feature set for protected boot and secure operations.
  • Compact BGA package: 272‑MAPBGA (9×9 mm) footprint enables space‑constrained designs while supporting surface‑mount assembly.
  • Consumer product focus: Documented for consumer qualification and positioned for a range of consumer embedded applications.

Why Choose MCIMX6G2DVK05AA?

The MCIMX6G2DVK05AA positions itself as a compact, efficient embedded application processor combining a single ARM® Cortex®‑A7 core at up to 528 MHz with integrated power management and a broad peripheral set. Its memory flexibility, dual Ethernet, USB PHYs and security features make it applicable to connected consumer systems, IoT gateways, HMI solutions and telematics.

Engineers selecting this device benefit from a focused feature set for consumer embedded designs that need efficient processing, simplified power architecture and multiple connectivity options in a small MAPBGA package.

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