MCIMX6G2CVM05ABR

IC MPU I.MX6G 528MHZ 289MAPBGA
Part Description

ARM® Cortex®-A7 Microprocessor IC i.MX6G 1 Core, 32-Bit 528MHz 289-MAPBGA (14x14)

Quantity 283 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6G
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A7Device Package289-MAPBGA (14x14)
Display & Interface ControllersLCD, LVDSECCNN/AEthernet10/100Mbps (2)
Graphics AccelerationNoHTS CodeN/AMoisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TJ)Package / Case289-LFBGARAM ControllersDDR3, DDR3L, LPDDR2
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Speed528MHzSupplier Device Package289-MAPBGA (14×14)USBUSB 2.0 + PHY (2)
Voltage – I/O1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6G2CVM05ABR – IC MPU I.MX6G 528MHZ 289MAPBGA

The MCIMX6G2CVM05ABR is an NXP Semiconductors i.MX 6G family microprocessor IC based on a single ARM® Cortex®‑A7 core running at 528 MHz. Designed for embedded and industrial applications, it combines a compact BGA package with integrated system interfaces and security features to support connected control and HMI implementations.

Built for efficient single‑core performance, the device targets embedded systems that require a balance of processing, multimedia assist, memory flexibility and industrial temperature operation.

Key Features

  • Core Single ARM® Cortex®‑A7 core, 32‑bit, operating at 528 MHz for deterministic embedded processing.
  • Multimedia and SIMD Includes multimedia co‑processor support plus NEON™ SIMD for accelerated signal and media operations.
  • Memory Interfaces Supports DDR3, DDR3L and LPDDR2 memory controllers to match a range of system memory selections.
  • Display Support Integrated display interface controllers for LCD and LVDS panels, enabling local HMI and display applications.
  • Connectivity Two 10/100 Mbps Ethernet interfaces, two USB 2.0 ports with PHY, and CAN support for robust wired communications.
  • Security Built‑in security capabilities including ARM TrustZone (ARM TZ), A‑HAB, CAAM, CSU, SJC and SNVS to address device and data protection needs.
  • Power and Integration Datasheet for the series describes an integrated power management module to simplify external power supply design and sequencing.
  • Package and Mounting 289‑MAPBGA supplier device package (14×14 mm); package case listed as 289‑LFBGA. Surface‑mount package suited for compact board layouts.
  • Industrial Temperature Range Rated for operation from -40 °C to 105 °C for deployment in industrial environments.
  • Qualification Listed qualification: Industrial.

Typical Applications

  • Human‑Machine Interfaces (HMI) Drive LCD or LVDS displays and deliver responsive control for operator panels and interface devices.
  • Industrial Control and Automation Single‑core processing with industrial temperature rating and multiple field interfaces for embedded controllers and gateways.
  • Connected Devices and Gateways Dual Ethernet, USB 2.0 and CAN enable networked embedded systems and protocol bridging or gateway applications.
  • Multimedia‑Assisted Embedded Systems NEON SIMD and multimedia co‑processor support for basic media processing and signal acceleration tasks.

Unique Advantages

  • Compact BGA package: Small 14×14 mm MAPBGA package enables dense board designs and reduces PCB footprint.
  • Flexible memory support: Native controllers for DDR3, DDR3L and LPDDR2 simplify memory choices across performance and power targets.
  • Integrated system interfaces: Multiple Ethernet ports, USB 2.0 with PHY and CAN reduce external interface components and lower BOM complexity.
  • Industrial‑grade operation: -40 °C to 105 °C operating range supports deployment in temperature‑challenging industrial environments.
  • Security feature set: Hardware security blocks (ARM TZ, A‑HAB, CAAM, CSU, SJC, SNVS) provide layered protection for secure boot and runtime safeguards.
  • Power management integration: Series documentation describes an integrated power management module that can simplify external power sequencing and design.

Why Choose MCIMX6G2CVM05ABR?

The MCIMX6G2CVM05ABR positions itself as a practical single‑core ARM® Cortex®‑A7 solution for embedded and industrial systems that require a compact package, flexible memory options and multiple wired connectivity interfaces. Its security primitives and industrial temperature rating make it suitable for designs that need secure, reliable operation in demanding environments.

Engineers developing control panels, HMI units, connectivity gateways or other embedded devices will find the combination of integrated interfaces, memory support and NXP Semiconductors pedigree useful for building robust, production‑ready systems.

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