MCIMX6G3DVK05AA

IC MPU I.MX6UL 528MHZ 272MAPBGA
Part Description

ARM® Cortex®-A7 Microprocessor IC i.MX6UL 1 Core, 32-Bit 528MHz 272-MAPBGA (9x9)

Quantity 1,224 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6G
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A7Device Package272-MAPBGA (9x9)
Display & Interface ControllersLCD, LVDSECCN5A992CEthernet10/100Mbps (2)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature0°C ~ 95°C (TJ)Package / Case272-LFBGARAM ControllersLPDDR2, DDR3, DDR3L
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Speed528MHzSupplier Device Package272-MAPBGA (9×9)USBUSB 2.0 + PHY (2)
Voltage – I/O1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6G3DVK05AA – IC MPU I.MX6UL 528MHz 272‑MAPBGA

The MCIMX6G3DVK05AA is an NXP Semiconductors i.MX 6UltraLite family microprocessor implementing a single ARM® Cortex®-A7 32-bit core running up to 528 MHz. It targets embedded consumer applications and offers an ultra-efficient architecture with integrated system-level features to simplify board design.

Designed for use in markets such as IoT gateways, point-of-sale, telematics, access control and human machine interfaces, the device combines a compact BGA package with multiple memory and peripheral interfaces and on-chip power management to reduce external component count.

Key Features

  • Core and Acceleration  Single ARM® Cortex®-A7 32-bit core operating at up to 528 MHz with multimedia co-processor support including NEON™ SIMD for accelerated data processing.
  • Memory Interfaces  Integrated controllers for LPDDR2, DDR3 and DDR3L plus support for raw and managed NAND flash, NOR flash, eMMC and Quad SPI as documented for the i.MX 6UltraLite family.
  • Integrated Power Management  On-chip power management module reduces external power supply complexity and simplifies power sequencing as described in the device family documentation.
  • Connectivity and Peripherals  Dual 10/100 Mbps Ethernet ports, two USB 2.0 interfaces with PHY, and additional interfaces including CAN and display controllers for LCD and LVDS.
  • Security Features  Hardware security features include ARM TrustZone (ARM TZ), A-HAB, CAAM, CSU, SJC and SNVS to support secure boot and system protection functions.
  • Package and Mounting  Supplier device package: 272‑MAPBGA (9×9 mm) with surface mount; package case listed as 272‑LFBGA in family documentation.
  • Environmental and Qualification  Consumer qualification and RoHS compliance; specified operating temperature range 0 °C to 95 °C.

Typical Applications

  • Point-of-Sale (POS) systems  Use the single-core Cortex‑A7 performance and multimedia processing to drive transaction UI, peripheral interfacing and secure boot functionality.
  • IoT Gateways  Dual Ethernet, USB and CAN support make the device suitable for gateway designs requiring multiple wired interfaces and reliable connectivity.
  • Telematics and Access Control  Integration of security modules and multiple peripheral interfaces supports secure device authentication and connectivity in telematics and access control panels.
  • Human Machine Interfaces (HMI)  LCD and LVDS display controllers plus multimedia capabilities enable user interface control for embedded display applications.
  • Smart Appliances  On-chip power management, compact BGA packaging and flexible memory support are useful for embedded appliance control and feature integration.

Unique Advantages

  • Highly integrated power management: Integrated power management module reduces external regulator count and simplifies board-level power sequencing.
  • Flexible memory support: Native controllers for LPDDR2, DDR3 and DDR3L and support for multiple flash types enable a wide range of memory configurations.
  • Broad peripheral mix: Dual Ethernet, USB 2.0 with PHY, CAN and display interfaces provide ready-made connectivity options for diverse embedded designs.
  • Security-capable platform: Hardware security blocks (ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS) help implement secure boot and runtime protection strategies.
  • Compact BGA footprint: 272‑MAPBGA (9×9 mm) supplier package supports high-density board designs where space is a premium.
  • Consumer-grade qualification and RoHS compliance: Designed for consumer embedded applications with documented operating range and environmental compliance.

Why Choose MCIMX6G3DVK05AA?

The MCIMX6G3DVK05AA positions itself as a compact, ultra-efficient single-core application processor for embedded consumer designs that require a balanced mix of processing, connectivity and security. Its integrated power management and broad memory/peripheral support simplify system architecture and reduce BOM complexity.

This part is suited for engineers developing IoT gateways, POS, telematics, HMI and appliance control systems who need a verified family platform with documented package options, security features and consumer-grade qualification backed by NXP’s i.MX 6UltraLite documentation.

Request a quote or submit a procurement inquiry to receive pricing and availability for MCIMX6G3DVK05AA and to discuss volume packaging or technical support options.

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