MCIMX6G3DVM05AA

IC MPU I.MX6UL 528MHZ 289MAPBGA
Part Description

ARM® Cortex®-A7 Microprocessor IC i.MX6UL 1 Core, 32-Bit 528MHz 289-MAPBGA (14x14)

Quantity 116 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6G
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A7Device Package289-MAPBGA (14x14)
Display & Interface ControllersLCD, LVDSECCN5A992CEthernet10/100Mbps (2)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature0°C ~ 95°C (TJ)Package / Case289-LFBGARAM ControllersLPDDR2, DDR3, DDR3L
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Speed528MHzSupplier Device Package289-MAPBGA (14×14)USBUSB 2.0 + PHY (2)
Voltage – I/O1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6G3DVM05AA – IC MPU I.MX6UL 528MHz 289-MAPBGA

The MCIMX6G3DVM05AA is an NXP i.MX 6UltraLite series microprocessor implemented as a single 32‑bit ARM® Cortex®‑A7 core running at up to 528 MHz. It combines an efficient application core with integrated power management and a breadth of peripheral interfaces tailored for consumer and embedded designs.

Designed for compact, low‑power systems, this device targets applications such as point‑of‑sale, telematics, IoT gateways, access control panels, HMIs and smart appliances where integration, interface variety and predictable operating temperature range are important.

Key Features

  • Core — Single ARM® Cortex®‑A7 32‑bit core operating up to 528 MHz for general application processing.
  • Multimedia & DSP — Includes multimedia co‑processor support and NEON™ SIMD for accelerated media and signal processing tasks.
  • Memory Interfaces — On‑chip controllers for LPDDR2, DDR3 and DDR3L; datasheet also documents support for raw and managed NAND, NOR flash, eMMC and Quad SPI devices.
  • Display Support — Integrated display controllers with LCD and LVDS interface support for user‑interface and HMI designs.
  • Connectivity — Dual 10/100 Mbps Ethernet ports, dual USB 2.0 controllers with PHY, and CAN interface to support networking and peripheral connectivity.
  • Security — Hardware security features including ARM TrustZone (ARM TZ), A‑HAB, CAAM, CSU, SJC and SNVS to enable secure boot and runtime protection.
  • Power Management — Integrated power management module and on‑chip LDO regulation reduce external power‑supply complexity and simplify power sequencing.
  • Package & Mounting — 289‑MAPBGA package (14 × 14 mm) suitable for surface‑mount assembly; plastic BGA details and 0.8 mm pitch documented in the package information.
  • Operating Conditions — Consumer‑grade qualification with an operating temperature range of 0 °C to 95 °C; RoHS compliant.

Typical Applications

  • Point‑of‑Sale (POS) — Application processing, display control and peripheral connectivity for transactional terminals.
  • Telematics — Networked gateway and data‑processing functions using Ethernet, CAN and USB interfaces.
  • IoT Gateways — Edge device processing and secure connectivity with integrated power sequencing and security features.
  • Human‑Machine Interfaces (HMI) — Drive LCD/LVDS displays and handle user‑interface tasks with single‑core application performance.
  • Smart Appliances — Control and connectivity in consumer appliances leveraging low power and integrated memory/peripheral controllers.

Unique Advantages

  • Integrated power management: On‑chip power module and LDO parameters reduce external component count and simplify board design and sequencing.
  • Broad peripheral set: Multiple Ethernet ports, dual USB 2.0 + PHY, CAN and display controllers enable versatile system I/O without extensive external controllers.
  • Security hardware blocks: Built‑in TrustZone, CAAM and related security modules help establish secure boot and runtime protection in connected devices.
  • Flexible memory support: Controllers for LPDDR2, DDR3 and DDR3L plus documented flash interfaces allow designers to choose memory suited to performance and cost targets.
  • Compact BGA package: 289‑MAPBGA (14×14 mm) fits space‑constrained designs while providing rich pinout for interfaces.
  • Consumer‑grade thermal range: Specified 0 °C to 95 °C operation for typical embedded and consumer environments.

Why Choose MCIMX6G3DVM05AA?

The MCIMX6G3DVM05AA positions itself as a compact, integrated microprocessor solution for consumer and embedded devices that need a balance of application performance, peripheral flexibility and on‑chip power management. Its ARM® Cortex®‑A7 core at up to 528 MHz, combined with NEON SIMD support and a broad set of interfaces, makes it suitable for user interfaces, connectivity hubs and secure edge applications.

Designers seeking reduced BOM complexity, integrated security and documented package and electrical characteristics will find this part suitable for mid‑range embedded designs where reliable operation across a defined consumer temperature range and RoHS compliance are required.

Request a quote or submit an inquiry to evaluate MCIMX6G3DVM05AA for your next embedded design and get detailed ordering and availability information.

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