MCIMX6G3DVM05AB
| Part Description |
ARM® Cortex®-A7 Microprocessor IC i.MX6UL 1 Core, 32-Bit 528MHz 289-MAPBGA (14x14) |
|---|---|
| Quantity | 805 Available (as of October 9, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6G |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A7 | Device Package | 289-MAPBGA (14x14) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LCD, LVDS | ECCN | 5A992C | Ethernet | 10/100Mbps (2) | ||
| Graphics Acceleration | No | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | 0°C ~ 95°C (TJ) | Package / Case | 289-LFBGA | RAM Controllers | LPDDR2, DDR3, DDR3L | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | ||
| Speed | 528MHz | Supplier Device Package | 289-MAPBGA (14×14) | USB | USB 2.0 + PHY (2) | ||
| Voltage – I/O | 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V |
Overview of MCIMX6G3DVM05AB – IC MPU I.MX6UL 528MHz 289-MAPBGA
The MCIMX6G3DVM05AB is an i.MX 6UltraLite-series microprocessor featuring a single ARM® Cortex®-A7 core running at up to 528 MHz. It delivers a compact, integrated processing solution for consumer and embedded designs that require efficient single-core performance and a broad set of peripheral interfaces.
Designed for applications such as point-of-sale, telematics and IoT endpoints, this device combines flexible memory support, on-chip security modules and integrated power management to simplify system design and reduce external component count.
Key Features
- Core & Performance — Single ARM® Cortex®-A7 core, 32-bit, operating at up to 528 MHz for efficient application processing.
- Memory Interfaces — Supports LPDDR2, DDR3 and DDR3L memory controllers to accommodate a range of system memory choices.
- Integration & Power — Includes an integrated power management module to reduce external power-supply complexity and simplify power sequencing.
- Security Subsystem — On-chip security features including ARM TrustZone (ARM TZ), A-HAB, CAAM, CSU, SJC and SNVS to support secure boot and runtime protection strategies.
- Connectivity & I/O — Dual 10/100 Mbps Ethernet interfaces, two USB 2.0 controllers with PHY, and CAN support for common wired communications.
- Display & Multimedia — Integrated display controllers with LCD and LVDS support and multimedia acceleration via NEON™ SIMD coprocessor for media-oriented tasks.
- Package — 289-MAPBGA (14 mm × 14 mm) surface-mount package with BGA 0.8 mm pitch for compact board layouts.
- Qualification & Temperature — Consumer-grade qualification and operating temperature range from 0 °C to 95 °C.
Typical Applications
- Point-of-Sale Systems — Single-core application processing, integrated interfaces and secure boot capabilities for transaction terminals and kiosks.
- Telematics — Connectivity options (Ethernet, CAN, USB) and on-chip security make it suitable for vehicle telematics and fleet devices.
- IoT Endpoints — Low-complexity power management and flexible memory support enable compact, efficient IoT gateway and sensor-hub designs.
- Consumer Devices with Displays — LCD and LVDS display controllers plus NEON SIMD for multimedia handling in consumer appliances and handheld instruments.
Unique Advantages
- Highly integrated single-core processor: A Cortex-A7 core at up to 528 MHz provides a straightforward, efficient compute element for embedded applications.
- Flexible memory support: LPDDR2, DDR3 and DDR3L controller compatibility allows designers to optimize cost and performance across product variants.
- On-chip security stack: Multiple security modules (ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS) support secure boot and trusted execution without large external security subsystems.
- Reduced BOM and simplified power: Integrated power management minimizes external regulator complexity and eases board-level power sequencing.
- Compact BGA package: 289-MAPBGA 14×14 mm footprint enables space-constrained designs while retaining a broad feature set.
- Multiple wired connectivity options: Dual 10/100 Ethernet, dual USB 2.0 + PHY and CAN support provide versatile I/O for networked and vehicle-oriented products.
Why Choose MCIMX6G3DVM05AB?
The MCIMX6G3DVM05AB positions itself as a practical, integrated single-core MPU for consumer and embedded products that need efficient processing, flexible memory choices and on-chip security. Its integrated power management and compact 289-MAPBGA package simplify hardware design while the available peripheral mix (Ethernet, USB, CAN, display controllers) supports a wide range of system architectures.
This part is well suited to designers seeking a balanced combination of performance, integration and proven silicon from the i.MX 6UltraLite family—delivering scalability across consumer and IoT-oriented product lines with support for secure boot and standard memory technologies.
Request a quote or submit an RFQ to get pricing and lead-time details for MCIMX6G3DVM05AB and start integrating this i.MX 6UltraLite MPU into your next design.

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