MCIMX6G3DVM05AB

IC MPU I.MX6UL 528MHZ 289MAPBGA
Part Description

ARM® Cortex®-A7 Microprocessor IC i.MX6UL 1 Core, 32-Bit 528MHz 289-MAPBGA (14x14)

Quantity 805 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6G
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A7Device Package289-MAPBGA (14x14)
Display & Interface ControllersLCD, LVDSECCN5A992CEthernet10/100Mbps (2)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature0°C ~ 95°C (TJ)Package / Case289-LFBGARAM ControllersLPDDR2, DDR3, DDR3L
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Speed528MHzSupplier Device Package289-MAPBGA (14×14)USBUSB 2.0 + PHY (2)
Voltage – I/O1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6G3DVM05AB – IC MPU I.MX6UL 528MHz 289-MAPBGA

The MCIMX6G3DVM05AB is an i.MX 6UltraLite-series microprocessor featuring a single ARM® Cortex®-A7 core running at up to 528 MHz. It delivers a compact, integrated processing solution for consumer and embedded designs that require efficient single-core performance and a broad set of peripheral interfaces.

Designed for applications such as point-of-sale, telematics and IoT endpoints, this device combines flexible memory support, on-chip security modules and integrated power management to simplify system design and reduce external component count.

Key Features

  • Core & Performance — Single ARM® Cortex®-A7 core, 32-bit, operating at up to 528 MHz for efficient application processing.
  • Memory Interfaces — Supports LPDDR2, DDR3 and DDR3L memory controllers to accommodate a range of system memory choices.
  • Integration & Power — Includes an integrated power management module to reduce external power-supply complexity and simplify power sequencing.
  • Security Subsystem — On-chip security features including ARM TrustZone (ARM TZ), A-HAB, CAAM, CSU, SJC and SNVS to support secure boot and runtime protection strategies.
  • Connectivity & I/O — Dual 10/100 Mbps Ethernet interfaces, two USB 2.0 controllers with PHY, and CAN support for common wired communications.
  • Display & Multimedia — Integrated display controllers with LCD and LVDS support and multimedia acceleration via NEON™ SIMD coprocessor for media-oriented tasks.
  • Package — 289-MAPBGA (14 mm × 14 mm) surface-mount package with BGA 0.8 mm pitch for compact board layouts.
  • Qualification & Temperature — Consumer-grade qualification and operating temperature range from 0 °C to 95 °C.

Typical Applications

  • Point-of-Sale Systems — Single-core application processing, integrated interfaces and secure boot capabilities for transaction terminals and kiosks.
  • Telematics — Connectivity options (Ethernet, CAN, USB) and on-chip security make it suitable for vehicle telematics and fleet devices.
  • IoT Endpoints — Low-complexity power management and flexible memory support enable compact, efficient IoT gateway and sensor-hub designs.
  • Consumer Devices with Displays — LCD and LVDS display controllers plus NEON SIMD for multimedia handling in consumer appliances and handheld instruments.

Unique Advantages

  • Highly integrated single-core processor: A Cortex-A7 core at up to 528 MHz provides a straightforward, efficient compute element for embedded applications.
  • Flexible memory support: LPDDR2, DDR3 and DDR3L controller compatibility allows designers to optimize cost and performance across product variants.
  • On-chip security stack: Multiple security modules (ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS) support secure boot and trusted execution without large external security subsystems.
  • Reduced BOM and simplified power: Integrated power management minimizes external regulator complexity and eases board-level power sequencing.
  • Compact BGA package: 289-MAPBGA 14×14 mm footprint enables space-constrained designs while retaining a broad feature set.
  • Multiple wired connectivity options: Dual 10/100 Ethernet, dual USB 2.0 + PHY and CAN support provide versatile I/O for networked and vehicle-oriented products.

Why Choose MCIMX6G3DVM05AB?

The MCIMX6G3DVM05AB positions itself as a practical, integrated single-core MPU for consumer and embedded products that need efficient processing, flexible memory choices and on-chip security. Its integrated power management and compact 289-MAPBGA package simplify hardware design while the available peripheral mix (Ethernet, USB, CAN, display controllers) supports a wide range of system architectures.

This part is well suited to designers seeking a balanced combination of performance, integration and proven silicon from the i.MX 6UltraLite family—delivering scalability across consumer and IoT-oriented product lines with support for secure boot and standard memory technologies.

Request a quote or submit an RFQ to get pricing and lead-time details for MCIMX6G3DVM05AB and start integrating this i.MX 6UltraLite MPU into your next design.

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