MCIMX6L2EVN10AB
| Part Description |
ARM® Cortex®-A9 Microprocessor IC i.MX6SL 1 Core, 32-Bit 1.0GHz 432-MAPBGA (13x13) |
|---|---|
| Quantity | 489 Available (as of October 9, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6L |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 15 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A9 | Device Package | 432-MAPBGA (13x13) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Keypad, LCD | ECCN | 5A992C | Ethernet | 10/100Mbps (1) | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 105°C (TA) | Package / Case | 432-TFBGA | RAM Controllers | LPDDR2, LVDDR3, DDR3 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | ||
| Speed | 1.0GHz | Supplier Device Package | 432-MAPBGA (13×13) | USB | USB 2.0 + PHY (3) | ||
| Voltage – I/O | 1.2V, 1.8V, 3.0V |
Overview of MCIMX6L2EVN10AB – IC MPU I.MX6SL 1.0GHz 432-MAPBGA
The MCIMX6L2EVN10AB is an NXP Semiconductors i.MX 6SoloLite application processor based on a single ARM® Cortex®-A9 core running up to 1.0 GHz. It combines a 32-bit application core with multimedia acceleration and integrated power management to support embedded consumer and industrial designs.
Designed for low-power multimedia applications, this industrial-qualified device targets entry-level tablets, eReaders and barcode scanners, offering integrated display and peripheral interfaces alongside security and power-management capabilities.
Key Features
- Core — Single ARM® Cortex®-A9 32-bit core operating up to 1 GHz for general-purpose embedded processing.
- Memory Interfaces — Supports LPDDR2, LVDDR3 and DDR3 memory controllers for flexible system memory choices.
- Graphics and Multimedia — Includes a 2D graphics processor and NEON™ SIMD multimedia acceleration for UI and media handling.
- Display and Input — Integrated LCD and keypad display interface controllers for direct human‑machine interface connections.
- Connectivity — Integrated 10/100 Mbps Ethernet (1) and three USB 2.0 ports with PHY to support common wired interfaces; additional AC97 audio interface.
- Security — Hardware security features including ARM TrustZone, boot security, cryptography, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection.
- Power and Integration — On-chip integrated power management to optimize for lower power consumption in multimedia applications.
- Package and Mounting — 432‑MAPBGA (13 × 13 mm, 0.5 mm pitch) surface-mount package (432-TFBGA supplier case) suitable for compact board designs.
- Industrial Temperature Range — Rated for operation from −40°C to 105°C for deployment in industrial environments.
Typical Applications
- eReaders — Color and monochrome eReaders leveraging integrated graphics and low-power operation for extended battery life.
- Entry-Level Tablets — Cost-sensitive tablet platforms that require multimedia acceleration, display interfaces and USB connectivity.
- Barcode Scanners — Embedded scanning devices benefiting from compact packaging, integrated peripherals and industrial temperature operation.
Unique Advantages
- Highly integrated multimedia platform: Combines an ARM® Cortex®-A9 core with 2D graphics and NEON SIMD acceleration to simplify multimedia system design.
- Flexible memory support: LPDDR2, LVDDR3 and DDR3 controller support enables a range of performance and cost trade-offs for system memory.
- Comprehensive security features: Multiple hardware security mechanisms (TrustZone, secure boot, cryptography, secure JTAG, tamper detection) help protect device integrity and data.
- Industrial-ready thermal performance: Rated −40°C to 105°C and supplied with industrial qualification for reliable operation in demanding environments.
- Compact, production-friendly package: 13 × 13 mm 432-MAPBGA with 0.5 mm pitch provides a small footprint for space-constrained designs while supporting surface-mount assembly.
- Integrated power management: On-chip power management reduces external BOM and helps optimize power consumption for battery-powered applications.
Why Choose MCIMX6L2EVN10AB?
The MCIMX6L2EVN10AB positions itself as a balanced platform for embedded multimedia applications that need a combination of processing, graphics acceleration and security in a compact, industrial-rated package. Its single ARM® Cortex®-A9 core, memory flexibility and integrated peripheral set make it suitable for cost-conscious consumer devices and robust industrial products alike.
Backed by NXP's documentation and technical datasheet, this device is appropriate for engineers seeking a scalable, secure and power-aware solution for entry-level tablets, eReaders and similar embedded systems where compact packaging and industrial temperature operation are required.
Request a quote or submit an inquiry to start the procurement process for the MCIMX6L2EVN10AB and receive pricing and availability details from our team.

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