MCIMX6L2EVN10AB

IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6SL 1 Core, 32-Bit 1.0GHz 432-MAPBGA (13x13)

Quantity 489 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6L
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package432-MAPBGA (13x13)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TA)Package / Case432-TFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Speed1.0GHzSupplier Device Package432-MAPBGA (13×13)USBUSB 2.0 + PHY (3)
Voltage – I/O1.2V, 1.8V, 3.0V

Overview of MCIMX6L2EVN10AB – IC MPU I.MX6SL 1.0GHz 432-MAPBGA

The MCIMX6L2EVN10AB is an NXP Semiconductors i.MX 6SoloLite application processor based on a single ARM® Cortex®-A9 core running up to 1.0 GHz. It combines a 32-bit application core with multimedia acceleration and integrated power management to support embedded consumer and industrial designs.

Designed for low-power multimedia applications, this industrial-qualified device targets entry-level tablets, eReaders and barcode scanners, offering integrated display and peripheral interfaces alongside security and power-management capabilities.

Key Features

  • Core — Single ARM® Cortex®-A9 32-bit core operating up to 1 GHz for general-purpose embedded processing.
  • Memory Interfaces — Supports LPDDR2, LVDDR3 and DDR3 memory controllers for flexible system memory choices.
  • Graphics and Multimedia — Includes a 2D graphics processor and NEON™ SIMD multimedia acceleration for UI and media handling.
  • Display and Input — Integrated LCD and keypad display interface controllers for direct human‑machine interface connections.
  • Connectivity — Integrated 10/100 Mbps Ethernet (1) and three USB 2.0 ports with PHY to support common wired interfaces; additional AC97 audio interface.
  • Security — Hardware security features including ARM TrustZone, boot security, cryptography, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection.
  • Power and Integration — On-chip integrated power management to optimize for lower power consumption in multimedia applications.
  • Package and Mounting — 432‑MAPBGA (13 × 13 mm, 0.5 mm pitch) surface-mount package (432-TFBGA supplier case) suitable for compact board designs.
  • Industrial Temperature Range — Rated for operation from −40°C to 105°C for deployment in industrial environments.

Typical Applications

  • eReaders — Color and monochrome eReaders leveraging integrated graphics and low-power operation for extended battery life.
  • Entry-Level Tablets — Cost-sensitive tablet platforms that require multimedia acceleration, display interfaces and USB connectivity.
  • Barcode Scanners — Embedded scanning devices benefiting from compact packaging, integrated peripherals and industrial temperature operation.

Unique Advantages

  • Highly integrated multimedia platform: Combines an ARM® Cortex®-A9 core with 2D graphics and NEON SIMD acceleration to simplify multimedia system design.
  • Flexible memory support: LPDDR2, LVDDR3 and DDR3 controller support enables a range of performance and cost trade-offs for system memory.
  • Comprehensive security features: Multiple hardware security mechanisms (TrustZone, secure boot, cryptography, secure JTAG, tamper detection) help protect device integrity and data.
  • Industrial-ready thermal performance: Rated −40°C to 105°C and supplied with industrial qualification for reliable operation in demanding environments.
  • Compact, production-friendly package: 13 × 13 mm 432-MAPBGA with 0.5 mm pitch provides a small footprint for space-constrained designs while supporting surface-mount assembly.
  • Integrated power management: On-chip power management reduces external BOM and helps optimize power consumption for battery-powered applications.

Why Choose MCIMX6L2EVN10AB?

The MCIMX6L2EVN10AB positions itself as a balanced platform for embedded multimedia applications that need a combination of processing, graphics acceleration and security in a compact, industrial-rated package. Its single ARM® Cortex®-A9 core, memory flexibility and integrated peripheral set make it suitable for cost-conscious consumer devices and robust industrial products alike.

Backed by NXP's documentation and technical datasheet, this device is appropriate for engineers seeking a scalable, secure and power-aware solution for entry-level tablets, eReaders and similar embedded systems where compact packaging and industrial temperature operation are required.

Request a quote or submit an inquiry to start the procurement process for the MCIMX6L2EVN10AB and receive pricing and availability details from our team.

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