MCIMX6G3DVK05AB
| Part Description |
ARM® Cortex®-A7 Microprocessor IC i.MX6UL 1 Core, 32-Bit 528MHz 272-MAPBGA (9x9) |
|---|---|
| Quantity | 162 Available (as of October 9, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6G |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A7 | Device Package | 272-MAPBGA (9x9) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LCD, LVDS | ECCN | 5A992C | Ethernet | 10/100Mbps (2) | ||
| Graphics Acceleration | No | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | 0°C ~ 95°C (TJ) | Package / Case | 272-LFBGA | RAM Controllers | LPDDR2, DDR3, DDR3L | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | ||
| Speed | 528MHz | Supplier Device Package | 272-MAPBGA (9×9) | USB | USB 2.0 + PHY (2) | ||
| Voltage – I/O | 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V |
Overview of MCIMX6G3DVK05AB – IC MPU I.MX6UL 528MHz 272-MAPBGA
The MCIMX6G3DVK05AB is an NXP Semiconductors i.MX 6G series microprocessor based on a single ARM® Cortex®-A7 core running at up to 528 MHz. It targets embedded and consumer applications that require efficient processing, integrated system features and flexible memory and peripheral connectivity.
Designed for compact, surface-mount implementations, this device is supplied in a 272-MAPBGA (9×9 mm) package and includes an integrated power management module to simplify external power supply design and sequencing.
Key Features
- Core and Performance Single ARM® Cortex®-A7 core, 32-bit, operating up to 528 MHz for efficient application processing.
- Memory Interface Flexibility Supports LPDDR2, DDR3 and DDR3L memory controllers and a range of boot/storage options including raw and managed NAND flash, NOR flash, eMMC and Quad SPI.
- Connectivity Dual 10/100 Mbps Ethernet interfaces and two USB 2.0 ports with integrated PHY provide wired networking and host/device connectivity.
- Peripheral Interfaces Integrated display controllers include LCD and LVDS support; additional interfaces include CAN for vehicle and industrial networks.
- Multimedia and DSP Acceleration Includes multimedia co-processor capabilities and NEON™ SIMD support to accelerate signal processing tasks.
- Security and System Integrity Hardware security features include ARM TrustZone (ARM TZ), A-HAB, CAAM, CSU, SJC and SNVS to support secure boot and runtime protections.
- Power Management Integrated power management module reduces external power-supply complexity and simplifies sequencing for streamlined board design.
- Package and Mounting 272-LFBGA / 272-MAPBGA (9×9 mm) surface-mount package suitable for compact embedded designs.
- Operating Range and Compliance Consumer-qualified device with an operating temperature range of 0 °C to 95 °C and RoHS compliance.
Typical Applications
- Point-of-Sale Systems — Compact processing, multimedia support and multiple I/O interfaces suitable for terminals and kiosks.
- Telematics — Network interfaces, CAN and integrated power management enable vehicle telematics and fleet communication units.
- IoT Gateways and Edge Devices — Flexible memory options, Ethernet and USB connectivity make it suitable for edge processing and gateway functions.
- Consumer Embedded Products — Single-core efficiency and security features support consumer electronics and connected devices.
Unique Advantages
- Compact, Surface-Mount Package: 272-MAPBGA (9×9 mm) package allows high-density board designs without sacrificing connectivity.
- Integrated Power Management: On-chip power management reduces external component count and simplifies power sequencing.
- Broad Memory and Boot Options: Support for LPDDR2, DDR3, DDR3L, NAND, NOR, eMMC and Quad SPI provides flexibility for storage and performance trade-offs.
- Comprehensive Security Suite: Multiple hardware security modules (ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS) help implement secure boot and protected runtime environments.
- Rich Peripheral Set: Dual Ethernet, dual USB 2.0 with PHY, CAN and display controller support enable diverse connectivity and interface requirements.
- Targeted for Embedded Consumer Designs: Consumer qualification and a 0 °C to 95 °C operating range align the device with mainstream embedded product requirements.
Why Choose MCIMX6G3DVK05AB?
The MCIMX6G3DVK05AB brings together a proven single-core ARM® Cortex®-A7 architecture with flexible memory interfaces, integrated power management and a broad set of security and connectivity features from NXP Semiconductors’ i.MX 6G family. Its compact 272-MAPBGA package and surface-mount mounting make it well suited for space-constrained embedded and consumer designs.
This part is a practical choice for engineers building point-of-sale systems, telematics units, IoT gateways and consumer embedded products that require a balanced mix of performance, integration and secure system capabilities, backed by documentation and datasheet support from the manufacturer.
If you would like pricing, availability or to request a quote for the MCIMX6G3DVK05AB, please submit a quote request or contact sales to start the procurement process.

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