MCIMX6G3DVK05AB

IC MPU I.MX6UL 528MHZ 272MAPBGA
Part Description

ARM® Cortex®-A7 Microprocessor IC i.MX6UL 1 Core, 32-Bit 528MHz 272-MAPBGA (9x9)

Quantity 162 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6G
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A7Device Package272-MAPBGA (9x9)
Display & Interface ControllersLCD, LVDSECCN5A992CEthernet10/100Mbps (2)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature0°C ~ 95°C (TJ)Package / Case272-LFBGARAM ControllersLPDDR2, DDR3, DDR3L
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Speed528MHzSupplier Device Package272-MAPBGA (9×9)USBUSB 2.0 + PHY (2)
Voltage – I/O1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6G3DVK05AB – IC MPU I.MX6UL 528MHz 272-MAPBGA

The MCIMX6G3DVK05AB is an NXP Semiconductors i.MX 6G series microprocessor based on a single ARM® Cortex®-A7 core running at up to 528 MHz. It targets embedded and consumer applications that require efficient processing, integrated system features and flexible memory and peripheral connectivity.

Designed for compact, surface-mount implementations, this device is supplied in a 272-MAPBGA (9×9 mm) package and includes an integrated power management module to simplify external power supply design and sequencing.

Key Features

  • Core and Performance Single ARM® Cortex®-A7 core, 32-bit, operating up to 528 MHz for efficient application processing.
  • Memory Interface Flexibility Supports LPDDR2, DDR3 and DDR3L memory controllers and a range of boot/storage options including raw and managed NAND flash, NOR flash, eMMC and Quad SPI.
  • Connectivity Dual 10/100 Mbps Ethernet interfaces and two USB 2.0 ports with integrated PHY provide wired networking and host/device connectivity.
  • Peripheral Interfaces Integrated display controllers include LCD and LVDS support; additional interfaces include CAN for vehicle and industrial networks.
  • Multimedia and DSP Acceleration Includes multimedia co-processor capabilities and NEON™ SIMD support to accelerate signal processing tasks.
  • Security and System Integrity Hardware security features include ARM TrustZone (ARM TZ), A-HAB, CAAM, CSU, SJC and SNVS to support secure boot and runtime protections.
  • Power Management Integrated power management module reduces external power-supply complexity and simplifies sequencing for streamlined board design.
  • Package and Mounting 272-LFBGA / 272-MAPBGA (9×9 mm) surface-mount package suitable for compact embedded designs.
  • Operating Range and Compliance Consumer-qualified device with an operating temperature range of 0 °C to 95 °C and RoHS compliance.

Typical Applications

  • Point-of-Sale Systems — Compact processing, multimedia support and multiple I/O interfaces suitable for terminals and kiosks.
  • Telematics — Network interfaces, CAN and integrated power management enable vehicle telematics and fleet communication units.
  • IoT Gateways and Edge Devices — Flexible memory options, Ethernet and USB connectivity make it suitable for edge processing and gateway functions.
  • Consumer Embedded Products — Single-core efficiency and security features support consumer electronics and connected devices.

Unique Advantages

  • Compact, Surface-Mount Package: 272-MAPBGA (9×9 mm) package allows high-density board designs without sacrificing connectivity.
  • Integrated Power Management: On-chip power management reduces external component count and simplifies power sequencing.
  • Broad Memory and Boot Options: Support for LPDDR2, DDR3, DDR3L, NAND, NOR, eMMC and Quad SPI provides flexibility for storage and performance trade-offs.
  • Comprehensive Security Suite: Multiple hardware security modules (ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS) help implement secure boot and protected runtime environments.
  • Rich Peripheral Set: Dual Ethernet, dual USB 2.0 with PHY, CAN and display controller support enable diverse connectivity and interface requirements.
  • Targeted for Embedded Consumer Designs: Consumer qualification and a 0 °C to 95 °C operating range align the device with mainstream embedded product requirements.

Why Choose MCIMX6G3DVK05AB?

The MCIMX6G3DVK05AB brings together a proven single-core ARM® Cortex®-A7 architecture with flexible memory interfaces, integrated power management and a broad set of security and connectivity features from NXP Semiconductors’ i.MX 6G family. Its compact 272-MAPBGA package and surface-mount mounting make it well suited for space-constrained embedded and consumer designs.

This part is a practical choice for engineers building point-of-sale systems, telematics units, IoT gateways and consumer embedded products that require a balanced mix of performance, integration and secure system capabilities, backed by documentation and datasheet support from the manufacturer.

If you would like pricing, availability or to request a quote for the MCIMX6G3DVK05AB, please submit a quote request or contact sales to start the procurement process.

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