MCIMX6G2AVM07AB

IC MPU I.MX6UL 696MHZ 289MAPBGA
Part Description

ARM® Cortex®-A7 Microprocessor IC i.MX6UL 1 Core, 32-Bit 696MHz 289-MAPBGA (14x14)

Quantity 871 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6G
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A7Device Package289-MAPBGA (14x14)
Display & Interface ControllersLCD, LVDSECCN5A992CEthernet10/100Mbps (2)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case289-LFBGARAM ControllersLPDDR2, DDR3, DDR3L
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Speed696MHzSupplier Device Package289-MAPBGA (14×14)USBUSB 2.0 + PHY (2)
Voltage – I/O1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6G2AVM07AB – IC MPU I.MX6UL 696MHz 289-MAPBGA

The MCIMX6G2AVM07AB is a single-core ARM® Cortex®-A7 microprocessor operating at up to 696 MHz from NXP’s i.MX 6UltraLite family. It targets embedded applications that require an ultra-efficient application processor with integrated power management and a broad set of memory and peripheral interfaces.

Designed for compact, system-level integration, this device combines a 32-bit Cortex-A7 core with multimedia DSP/NEON support, multiple memory controller options, and an array of I/O including Ethernet, USB and CAN to support display, connectivity and sensor subsystems.

Key Features

  • Core Single ARM® Cortex®-A7 core, 32-bit, operating up to 696 MHz for efficient application processing.
  • Multimedia & DSP Multimedia co-processor support with NEON™ SIMD acceleration for signal processing and media tasks.
  • Memory Interfaces Compatible with LPDDR2, DDR3 and DDR3L memory types via integrated memory controllers.
  • Display Integrated display controllers supporting LCD and LVDS panels for HMI and embedded display systems.
  • Connectivity Dual 10/100 Mbps Ethernet ports, two USB 2.0 ports with integrated PHY, and CAN interface for vehicle and industrial networks.
  • Security Hardware security features including ARM TrustZone (ARM TZ), A-HAB, CAAM, CSU, SJC and SNVS for system integrity and secure boot options.
  • Power Management Integrated power management module to reduce external supply complexity and simplify power sequencing.
  • Package & Mounting Supplier device package: 289-MAPBGA (14×14 mm); package case referenced as 289-LFBGA. Surface-mount BGA construction.
  • Operating Range Extended operating temperature range from -40°C to 125°C suitable for demanding environmental conditions.
  • Graphics Acceleration No dedicated graphics acceleration (as specified).

Typical Applications

  • Human–Machine Interfaces (HMI) Drive LCD/LVDS display panels and interface with touch and input peripherals for embedded user interfaces.
  • Telematics and Connectivity Modules Support for Ethernet, CAN, USB and wireless host interfaces enables data and device connectivity in embedded systems.
  • Sensor and Multimedia Subsystems NEON SIMD and multimedia DSP support for sensor data processing, audio and lightweight media tasks.

Unique Advantages

  • Highly integrated power management: On-chip power management module reduces BOM and simplifies board-level power sequencing.
  • Flexible memory support: Native controllers for LPDDR2, DDR3 and DDR3L enable choice of memory types to match performance and cost targets.
  • Broad peripheral set: Dual Ethernet, dual USB 2.0 with PHY, CAN and multiple display interfaces consolidate common system I/O needs.
  • Security building blocks: Multiple hardware security modules (ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS) provide layered options for secure boot and runtime protection.
  • Compact BGA footprint: 289-ball MAPBGA 14×14 mm packaging enables a small board area for space-constrained designs.
  • Extended thermal range: Specified operation from -40°C to 125°C supports deployment in wide environmental conditions.

Why Choose MCIMX6G2AVM07AB?

The MCIMX6G2AVM07AB delivers a balanced combination of efficient single-core processing, integrated power management and a rich set of memory and peripheral interfaces that simplify embedded system design. Its NEON-enabled Cortex‑A7 core and on-chip security modules make it suitable for applications requiring compact hardware, controlled power architecture and secure operation.

This device is appropriate for engineers building space- and power-conscious embedded systems that need a compact BGA package, flexible memory options and a comprehensive I/O mix. Documentation and package information are available from the i.MX 6UltraLite family technical materials to support system integration and board design.

Request a quote or submit an inquiry to learn more about availability, ordering and how MCIMX6G2AVM07AB can fit into your embedded designs.

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