MCIMX6G2AVM07AB
| Part Description |
ARM® Cortex®-A7 Microprocessor IC i.MX6UL 1 Core, 32-Bit 696MHz 289-MAPBGA (14x14) |
|---|---|
| Quantity | 871 Available (as of October 9, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6G |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A7 | Device Package | 289-MAPBGA (14x14) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LCD, LVDS | ECCN | 5A992C | Ethernet | 10/100Mbps (2) | ||
| Graphics Acceleration | No | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 125°C (TJ) | Package / Case | 289-LFBGA | RAM Controllers | LPDDR2, DDR3, DDR3L | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | ||
| Speed | 696MHz | Supplier Device Package | 289-MAPBGA (14×14) | USB | USB 2.0 + PHY (2) | ||
| Voltage – I/O | 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V |
Overview of MCIMX6G2AVM07AB – IC MPU I.MX6UL 696MHz 289-MAPBGA
The MCIMX6G2AVM07AB is a single-core ARM® Cortex®-A7 microprocessor operating at up to 696 MHz from NXP’s i.MX 6UltraLite family. It targets embedded applications that require an ultra-efficient application processor with integrated power management and a broad set of memory and peripheral interfaces.
Designed for compact, system-level integration, this device combines a 32-bit Cortex-A7 core with multimedia DSP/NEON support, multiple memory controller options, and an array of I/O including Ethernet, USB and CAN to support display, connectivity and sensor subsystems.
Key Features
- Core Single ARM® Cortex®-A7 core, 32-bit, operating up to 696 MHz for efficient application processing.
- Multimedia & DSP Multimedia co-processor support with NEON™ SIMD acceleration for signal processing and media tasks.
- Memory Interfaces Compatible with LPDDR2, DDR3 and DDR3L memory types via integrated memory controllers.
- Display Integrated display controllers supporting LCD and LVDS panels for HMI and embedded display systems.
- Connectivity Dual 10/100 Mbps Ethernet ports, two USB 2.0 ports with integrated PHY, and CAN interface for vehicle and industrial networks.
- Security Hardware security features including ARM TrustZone (ARM TZ), A-HAB, CAAM, CSU, SJC and SNVS for system integrity and secure boot options.
- Power Management Integrated power management module to reduce external supply complexity and simplify power sequencing.
- Package & Mounting Supplier device package: 289-MAPBGA (14×14 mm); package case referenced as 289-LFBGA. Surface-mount BGA construction.
- Operating Range Extended operating temperature range from -40°C to 125°C suitable for demanding environmental conditions.
- Graphics Acceleration No dedicated graphics acceleration (as specified).
Typical Applications
- Human–Machine Interfaces (HMI) Drive LCD/LVDS display panels and interface with touch and input peripherals for embedded user interfaces.
- Telematics and Connectivity Modules Support for Ethernet, CAN, USB and wireless host interfaces enables data and device connectivity in embedded systems.
- Sensor and Multimedia Subsystems NEON SIMD and multimedia DSP support for sensor data processing, audio and lightweight media tasks.
Unique Advantages
- Highly integrated power management: On-chip power management module reduces BOM and simplifies board-level power sequencing.
- Flexible memory support: Native controllers for LPDDR2, DDR3 and DDR3L enable choice of memory types to match performance and cost targets.
- Broad peripheral set: Dual Ethernet, dual USB 2.0 with PHY, CAN and multiple display interfaces consolidate common system I/O needs.
- Security building blocks: Multiple hardware security modules (ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS) provide layered options for secure boot and runtime protection.
- Compact BGA footprint: 289-ball MAPBGA 14×14 mm packaging enables a small board area for space-constrained designs.
- Extended thermal range: Specified operation from -40°C to 125°C supports deployment in wide environmental conditions.
Why Choose MCIMX6G2AVM07AB?
The MCIMX6G2AVM07AB delivers a balanced combination of efficient single-core processing, integrated power management and a rich set of memory and peripheral interfaces that simplify embedded system design. Its NEON-enabled Cortex‑A7 core and on-chip security modules make it suitable for applications requiring compact hardware, controlled power architecture and secure operation.
This device is appropriate for engineers building space- and power-conscious embedded systems that need a compact BGA package, flexible memory options and a comprehensive I/O mix. Documentation and package information are available from the i.MX 6UltraLite family technical materials to support system integration and board design.
Request a quote or submit an inquiry to learn more about availability, ordering and how MCIMX6G2AVM07AB can fit into your embedded designs.

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