MCIMX6G2AVM05AA

IC MPU I.MX6UL 528MHZ 289MAPBGA
Part Description

ARM® Cortex®-A7 Microprocessor IC i.MX6UL 1 Core, 32-Bit 528MHz 289-MAPBGA (14x14)

Quantity 1,387 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6G
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A7Device Package289-MAPBGA (14x14)
Display & Interface ControllersLCD, LVDSECCN5A992CEthernet10/100Mbps (2)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case289-LFBGARAM ControllersLPDDR2, DDR3, DDR3L
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Speed528MHzSupplier Device Package289-MAPBGA (14×14)USBUSB 2.0 + PHY (2)
Voltage – I/O1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6G2AVM05AA – IC MPU I.MX6UL 528MHZ 289MAPBGA

The MCIMX6G2AVM05AA is a single‑core ARM® Cortex®‑A7 microprocessor IC running at 528 MHz in a 289‑MAPBGA (14 × 14 mm) package. It targets embedded applications requiring a compact, low‑power 32‑bit application processor with integrated peripheral support.

As part of the i.MX 6 family, this device emphasizes system integration and efficiency, offering an integrated power management module and a broad set of memory and peripheral interfaces to simplify board design and reduce external component count.

Key Features

  • Core Single ARM® Cortex®‑A7 core, 32‑bit, operating at 528 MHz for general embedded application processing.
  • Multimedia Processing Includes multimedia co‑processors and NEON™ SIMD to accelerate signal and media‑oriented workloads.
  • Memory Interfaces Supports LPDDR2, DDR3 and DDR3L memory controllers for flexible system memory choices.
  • Display Interface Integrated controllers for LCD and LVDS panels to support display and HMI implementations.
  • Connectivity Dual 10/100 Mbps Ethernet controllers and two USB 2.0 ports with PHY provide wired network and host/device connectivity.
  • Additional Interfaces On‑chip CAN interface to support vehicle and industrial bus integration scenarios.
  • Security Hardware security features including ARM TrustZone (ARM TZ), A‑HAB, CAAM, CSU, SJC and SNVS for platform security and secure boot options.
  • Power Management Integrated power management module reduces external power supply complexity and simplifies power sequencing (family feature documented in the datasheet).
  • Package & Mounting 289‑MAPBGA (14 × 14 mm) surface‑mount package; package information documented as 14 × 14 mm, 0.8 mm pitch.
  • Operating Range Extended operating temperature range from −40 °C to 125 °C for deployment in harsh environments.
  • Compliance RoHS compliant.
  • Graphics Acceleration No dedicated graphics accelerator reported for this device.

Typical Applications

  • Human‑Machine Interfaces (HMI) Local display control and user interface processing using the onboard LCD/LVDS controllers and application core.
  • Connectivity‑Enabled Embedded Devices Systems that require Ethernet, USB and CAN connectivity alongside application processing and security features.
  • Display and Sensor Systems Embedded platforms integrating displays and camera or sensor subsystems, leveraging the device’s display interfaces and multimedia capabilities.

Unique Advantages

  • Highly integrated single‑chip solution: Combines a 528 MHz Cortex‑A7 core with memory controllers and multiple peripheral interfaces to reduce BOM and board complexity.
  • Integrated power management: On‑chip power management module (documented for the family) simplifies external supply design and power sequencing.
  • Broad peripheral set: Dual Ethernet, dual USB 2.0 with PHY, and CAN support enable flexible connectivity options for embedded systems.
  • Security building blocks: Multiple hardware security engines and subsystems (ARM TZ, A‑HAB, CAAM, CSU, SJC, SNVS) provide layered security capabilities for secure boot and runtime protection.
  • Flexible memory support: Support for LPDDR2, DDR3 and DDR3L lets designers choose memory optimized for performance, power or cost.
  • Extended temperature capability: Rated for −40 °C to 125 °C operation to support deployment in thermally demanding environments.

Why Choose MCIMX6G2AVM05AA?

The MCIMX6G2AVM05AA positions as a compact, integrated application processor for embedded designs that require a balance of processing, connectivity and hardware security. Its single Cortex‑A7 core, comprehensive peripheral set and on‑chip power management help streamline system design and reduce external component count.

This device is suited to engineers building display‑driven and connectivity‑focused embedded platforms that need robust security features and an extended operating temperature range. As part of the documented i.MX 6 family, it offers a clear upgrade path within a family of processors sharing similar architectural elements.

Request a quote or submit a pricing and availability request to receive more details and lead‑time information for MCIMX6G2AVM05AA.

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