MCIMX6G1CVM05AB

IC MPU I.MX6UL 528MHZ 289MAPBGA
Part Description

ARM® Cortex®-A7 Microprocessor IC i.MX6UL 1 Core, 32-Bit 528MHz 289-MAPBGA (14x14)

Quantity 507 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6G
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A7Device Package289-MAPBGA (14x14)
Display & Interface ControllersLVDSECCN5A992CEthernet10/100Mbps (1)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TJ)Package / Case289-LFBGARAM ControllersLPDDR2, DDR3, DDR3L
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Speed528MHzSupplier Device Package289-MAPBGA (14×14)USBUSB 2.0 + PHY (2)
Voltage – I/O1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6G1CVM05AB – IC MPU I.MX6UL 528MHz 289‑MAPBGA

The MCIMX6G1CVM05AB is an NXP i.MX 6UltraLite family applications processor implemented as a single Arm® Cortex®‑A7, 32‑bit core running at 528 MHz in a 289‑MAPBGA (14×14) surface‑mount package. It combines a low‑power Cortex‑A7 core with a range of memory interfaces, peripheral connectivity and hardware security functions suited to embedded and industrial designs.

Designed for power‑efficient, integrated systems, the device targets human‑machine interfaces, IoT gateways, industrial control, portable medical devices, point‑of‑sale and other embedded applications where compact packaging, integrated power management and secure booting are valuable.

Key Features

  • Core and Performance – Single Arm® Cortex®‑A7 32‑bit core operating at 528 MHz with NEON™ SIMD multimedia coprocessor support for improved signal processing.
  • Memory and Boot Flexibility – Memory controller supports 16‑bit LPDDR2, DDR3 and DDR3L; series documentation notes support for eMMC, Quad SPI NOR and raw NAND with flexible boot options including Quad SPI and raw NAND.
  • Connectivity – Integrated 10/100 Mbps Ethernet, two USB 2.0 OTG ports with PHY, and CAN connectivity provide a broad set of standard interfaces for networked and peripheral devices.
  • Analog and I/O – Series features include two 12‑bit ADC modules (up to 10 inputs), multiple UART, SPI and I2C ports, PWM, timers and general‑purpose I/O to support mixed‑signal and control tasks.
  • Hardware Security – Built‑in security features include ARM TrustZone, A‑HAB, CAAM, CSU, SJC and SNVS, along with on‑the‑fly DRAM encryption and secure boot capabilities described in the device family documentation.
  • Integrated Power Management – The family includes an integrated power management module to reduce external power supply complexity and simplify sequencing.
  • Package and Reliability – 289‑MAPBGA (14×14, 0.8 mm pitch) package for compact PCB designs; industrial qualification with operating temperature range of −40 °C to 105 °C and RoHS compliance.

Typical Applications

  • Human‑Machine Interfaces (HMI) – Drive displays and local control panels with the processor’s parallel display interfaces and rich I/O set.
  • IoT Gateways – Handle protocol bridging and local processing with Ethernet, USB, CAN and flexible memory options for firmware and storage.
  • Intelligent Industrial Control – Support sensor interfacing, ADC data acquisition and deterministic control tasks across the industrial temperature range.
  • Portable Medical Devices – Provide a compact, power‑efficient application processor with secure boot and hardware security for protected data handling.
  • Point‑of‑Sale and Payment Systems – Combine interface support (USB, serial, secure elements) and hardware security features for transaction processing and peripherals.

Unique Advantages

  • Highly Integrated Power Management: On‑chip power management reduces external component count and simplifies sequencing for streamlined board design.
  • Flexible Memory and Boot Options: Support for LPDDR2/DDR3/DDR3L plus eMMC, Quad SPI and raw NAND enables designers to choose memory and boot modes that match cost and performance targets.
  • Comprehensive Peripheral Set: Dual USB OTG with PHY, 10/100 Ethernet, CAN, multiple UART/SPI/I2C and ADCs provide connectivity for a wide range of sensors and external devices.
  • Hardware Security Suite: Built‑in TrustZone, secure boot, CAAM and related modules help implement secure firmware, encrypted storage and tamper‑resistant features.
  • Industrial‑Grade Operation: Industrial qualification and a −40 °C to 105 °C operating range support deployment in demanding environments.
  • Compact, PCB‑Friendly Package: The 289‑MAPBGA (14×14) package brings out all features and GPIOs while supporting low‑cost PCB layouts.

Why Choose MCIMX6G1CVM05AB?

The MCIMX6G1CVM05AB delivers a balance of power efficiency, integration and industrial robustness for embedded systems requiring a single Arm® Cortex®‑A7 core. Its combination of integrated power management, flexible memory interfaces, extensive peripheral connectivity and hardware security features makes it suitable for designs that demand compact form factors and secure operation.

This part is well suited to engineers and product teams building HMI, IoT gateway, industrial control, portable medical or point‑of‑sale applications where predictable operating temperature performance, reduced BOM complexity and a wide I/O set accelerate development and deployment.

Request a quote or submit an inquiry to receive pricing, availability and lead‑time information for MCIMX6G1CVM05AB.

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