MCIMX6G1AVM07AA
| Part Description |
ARM® Cortex®-A7 Microprocessor IC i.MX6UL 1 Core, 32-Bit 696MHz 289-MAPBGA (14x14) |
|---|---|
| Quantity | 1,317 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6G |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A7 | Device Package | 289-MAPBGA (14x14) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LVDS | ECCN | 5A992C | Ethernet | 10/100Mbps (1) | ||
| Graphics Acceleration | No | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 125°C (TJ) | Package / Case | 289-LFBGA | RAM Controllers | LPDDR2, DDR3, DDR3L | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | ||
| Speed | 696MHz | Supplier Device Package | 289-MAPBGA (14×14) | USB | USB 2.0 + PHY (2) | ||
| Voltage – I/O | 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V |
Overview of MCIMX6G1AVM07AA – IC MPU I.MX6UL 696MHZ 289MAPBGA
The MCIMX6G1AVM07AA is a single-core ARM® Cortex®-A7 microprocessor operating at up to 696 MHz, supplied in a 289-ball MAPBGA (14 × 14 mm) package. It combines a Cortex-A7 core with integrated power management and a broad set of memory and peripheral interfaces for embedded system designs.
This device targets embedded applications that require efficient 32-bit processing, flexible memory options and extensive peripheral connectivity, offering an integrated architecture to simplify power sequencing and reduce external component count.
Key Features
- Core Single ARM® Cortex®-A7 core, 32-bit, operating up to 696 MHz for general-purpose embedded processing.
- Memory & Storage Supports LPDDR2, DDR3 and DDR3L; interfaces for raw and managed NAND flash, NOR flash, eMMC and Quad SPI for flexible storage choices.
- Power Integrated power management module to reduce external power supply complexity and simplify power sequencing.
- Multimedia Acceleration Includes multimedia co-processing and NEON™ SIMD for accelerated media and signal processing tasks.
- Display LVDS display interface controller support for connected display designs.
- Networking & USB Single 10/100 Mbps Ethernet port and two USB 2.0 ports with PHY for wired connectivity and host/device USB functions.
- Fieldbus & Serial CAN interface and a wide range of peripheral I/Os for industrial and vehicle-bus applications.
- Security & System Management On-chip security and management features including ARM TrustZone (TZ), A-HAB, CAAM, CSU, SJC and SNVS.
- Package & Temperature 289-MAPBGA (14 × 14 mm, 0.8 mm pitch) package; specified operating temperature range −40 °C to 125 °C.
Typical Applications
- Embedded control systems Use the single-core Cortex-A7 for control and coordination tasks in compact embedded platforms.
- Connected gateways and communications Ethernet and USB interfaces make it suitable for networked gateway and peripheral aggregation roles.
- Display and HMI controllers LVDS support and multimedia acceleration enable user interface and display-driving applications.
- Sensor and data acquisition nodes Flexible memory and peripheral interfaces support local logging, sensor interfacing and wireless front-ends.
Unique Advantages
- Integrated power management: Reduces external supply complexity and simplifies board-level power sequencing.
- Flexible memory support: Native support for LPDDR2, DDR3, DDR3L plus multiple flash options (NAND, NOR, eMMC, Quad SPI) enables diverse storage architectures.
- Broad peripheral set: Ethernet, dual USB 2.0 with PHY, CAN and LVDS cover common connectivity and display requirements without heavy external logic.
- Built-in security modules: ARM TZ, A-HAB, CAAM, CSU, SJC and SNVS provide layered hardware security and system integrity features.
- Industrial temperature capability: Specified operation from −40 °C to 125 °C for deployments in demanding thermal environments.
- Compact BGA footprint: 289-MAPBGA 14 × 14 mm package balances board area and integration for space-constrained designs.
Why Choose MCIMX6G1AVM07AA?
The MCIMX6G1AVM07AA delivers a balanced combination of processor performance, integrated power management and flexible I/O/memory options for embedded applications. Its single ARM® Cortex®-A7 core at 696 MHz, multimedia SIMD support and extensive storage interfaces make it suited to designs that need capable control and media handling in a compact package.
Backed by NXP Semiconductors product design and documentation, this device serves projects that require a verified hardware platform with on-chip security features, broad peripheral connectivity and a wide operating temperature range for robust deployment.
Request a quote or submit an inquiry to receive pricing and availability information for the MCIMX6G1AVM07AA.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
Employees: 38,000+
Revenue: $10.53 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016