MCIMX6G1AVM07AB
| Part Description |
ARM® Cortex®-A7 Microprocessor IC i.MX6UL 1 Core, 32-Bit 696MHz 289-MAPBGA (14x14) |
|---|---|
| Quantity | 540 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6G |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A7 | Device Package | 289-MAPBGA (14x14) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LVDS | ECCN | 5A992C | Ethernet | 10/100Mbps (1) | ||
| Graphics Acceleration | No | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 125°C (TJ) | Package / Case | 289-LFBGA | RAM Controllers | LPDDR2, DDR3, DDR3L | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | ||
| Speed | 696MHz | Supplier Device Package | 289-MAPBGA (14×14) | USB | USB 2.0 + PHY (2) | ||
| Voltage – I/O | 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V |
Overview of MCIMX6G1AVM07AB – IC MPU I.MX6UL 696MHZ 289MAPBGA
The MCIMX6G1AVM07AB is an NXP Semiconductors i.MX 6UltraLite family application processor featuring a single Arm® Cortex®‑A7 core operating up to 696 MHz. It targets embedded designs that require a power‑efficient, secure application processor with flexible memory and peripheral connectivity for HMI, IoT, industrial control and other embedded systems.
Designed for integration, the device combines a compact 289‑MAPBGA (14×14) package, on‑chip power management, hardware security features and a broad set of interfaces to simplify board design and system development.
Key Features
- Core Single Arm® Cortex®‑A7 core, 32‑bit, up to 696 MHz delivering efficient application processing for embedded workloads.
- Memory and Storage Memory controller supports 16‑bit LPDDR2, DDR3 and DDR3L. Integrated interfaces include raw and managed NAND, NOR, eMMC, Quad SPI NOR and SD for flexible storage options.
- Power Management Integrated power management module reduces the complexity of external power supplies and simplifies power sequencing for streamlined system power design.
- Security Hardware security features include ARM TrustZone (ARM TZ), A‑HAB, CAAM, CSU, SJC and SNVS to support secure boot, encryption and tamper detection functions.
- Connectivity High‑speed connectivity options include USB 2.0 OTG with PHY (two ports) and 10/100 Mbps Ethernet. Additional interfaces include CAN, UART, I2C and I2S.
- Analog and Control Two 12‑bit ADC modules (up to 10 channels total), RTC, multiple timers, PWM and watchdog timers for real‑time control and sensor interfacing.
- Package and Mounting 289‑MAPBGA (14×14) surface‑mount package with 0.8 mm pitch option for compact PCB layouts and full I/O availability.
- Operating Range and Compliance Rated for operation from −40 °C to 125 °C and RoHS compliant for regulated production environments.
- Graphics and Multimedia Multimedia acceleration is provided by Neon™ SIMD and multimedia processing engines; the device does not include a dedicated graphics acceleration unit.
Typical Applications
- Human‑Machine Interfaces (HMI) — Use as the application processor for user panels, local control displays and interface logic in embedded equipment.
- IoT Gateways — Acts as a low‑power host processor for edge gateways requiring secure connectivity and local protocol translation.
- Industrial Control Systems — Suitable for intelligent controllers and automation nodes needing multiple serial interfaces, ADCs and real‑time control peripherals.
- Point‑of‑Sale & Payment Terminals — Hardware security features and smart card interfaces support secure transactions and payment applications.
- Smart Appliances and Energy Management — Integrates sensor ADCs, communication interfaces and on‑chip power management for appliance control and energy concentrators.
Unique Advantages
- Integrated power management: On‑chip power management module simplifies external power design and sequencing, reducing board complexity.
- Comprehensive security stack: Multiple hardware security engines and features (ARM TZ, A‑HAB, CAAM, CSU, SJC, SNVS) support secure boot, encryption and tamper resistance.
- Flexible memory and storage support: Native support for LPDDR2/DDR3/DDR3L and a wide range of flash interfaces enables scalable storage architectures.
- Rich peripheral set: Dual USB OTG with PHY, 10/100 Mbps Ethernet, CAN, multiple UART/I2C/SPI and ADCs cover common embedded connectivity and I/O needs.
- Compact package footprint: 289‑MAPBGA (14×14) brings full feature availability in a PCB‑friendly package for space‑constrained designs.
- Extended temperature capability: −40 °C to 125 °C rating supports deployment in thermally demanding embedded environments.
Why Choose MCIMX6G1AVM07AB?
The MCIMX6G1AVM07AB combines a power‑efficient Arm® Cortex®‑A7 core with an integrated power manager, extensive memory and storage interfaces, and a broad peripheral set to address a wide range of embedded applications. Its hardware security features and compact 289‑MAPBGA package make it suitable for designs that require secure operation and high integration in a small footprint.
Supported by evaluation hardware and software tools, this device is positioned for development teams building HMIs, IoT gateways, industrial controllers, payment terminals and smart appliances that need a balanced mix of performance, connectivity and system‑level integration.
Request a quote or submit a pricing and availability inquiry for MCIMX6G1AVM07AB to get started with your design procurement and development planning.

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