MCIMX6G1AVM07AB

IC MPU I.MX6UL 696MHZ 289MAPBGA
Part Description

ARM® Cortex®-A7 Microprocessor IC i.MX6UL 1 Core, 32-Bit 696MHz 289-MAPBGA (14x14)

Quantity 540 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6G
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A7Device Package289-MAPBGA (14x14)
Display & Interface ControllersLVDSECCN5A992CEthernet10/100Mbps (1)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case289-LFBGARAM ControllersLPDDR2, DDR3, DDR3L
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Speed696MHzSupplier Device Package289-MAPBGA (14×14)USBUSB 2.0 + PHY (2)
Voltage – I/O1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6G1AVM07AB – IC MPU I.MX6UL 696MHZ 289MAPBGA

The MCIMX6G1AVM07AB is an NXP Semiconductors i.MX 6UltraLite family application processor featuring a single Arm® Cortex®‑A7 core operating up to 696 MHz. It targets embedded designs that require a power‑efficient, secure application processor with flexible memory and peripheral connectivity for HMI, IoT, industrial control and other embedded systems.

Designed for integration, the device combines a compact 289‑MAPBGA (14×14) package, on‑chip power management, hardware security features and a broad set of interfaces to simplify board design and system development.

Key Features

  • Core Single Arm® Cortex®‑A7 core, 32‑bit, up to 696 MHz delivering efficient application processing for embedded workloads.
  • Memory and Storage Memory controller supports 16‑bit LPDDR2, DDR3 and DDR3L. Integrated interfaces include raw and managed NAND, NOR, eMMC, Quad SPI NOR and SD for flexible storage options.
  • Power Management Integrated power management module reduces the complexity of external power supplies and simplifies power sequencing for streamlined system power design.
  • Security Hardware security features include ARM TrustZone (ARM TZ), A‑HAB, CAAM, CSU, SJC and SNVS to support secure boot, encryption and tamper detection functions.
  • Connectivity High‑speed connectivity options include USB 2.0 OTG with PHY (two ports) and 10/100 Mbps Ethernet. Additional interfaces include CAN, UART, I2C and I2S.
  • Analog and Control Two 12‑bit ADC modules (up to 10 channels total), RTC, multiple timers, PWM and watchdog timers for real‑time control and sensor interfacing.
  • Package and Mounting 289‑MAPBGA (14×14) surface‑mount package with 0.8 mm pitch option for compact PCB layouts and full I/O availability.
  • Operating Range and Compliance Rated for operation from −40 °C to 125 °C and RoHS compliant for regulated production environments.
  • Graphics and Multimedia Multimedia acceleration is provided by Neon™ SIMD and multimedia processing engines; the device does not include a dedicated graphics acceleration unit.

Typical Applications

  • Human‑Machine Interfaces (HMI) — Use as the application processor for user panels, local control displays and interface logic in embedded equipment.
  • IoT Gateways — Acts as a low‑power host processor for edge gateways requiring secure connectivity and local protocol translation.
  • Industrial Control Systems — Suitable for intelligent controllers and automation nodes needing multiple serial interfaces, ADCs and real‑time control peripherals.
  • Point‑of‑Sale & Payment Terminals — Hardware security features and smart card interfaces support secure transactions and payment applications.
  • Smart Appliances and Energy Management — Integrates sensor ADCs, communication interfaces and on‑chip power management for appliance control and energy concentrators.

Unique Advantages

  • Integrated power management: On‑chip power management module simplifies external power design and sequencing, reducing board complexity.
  • Comprehensive security stack: Multiple hardware security engines and features (ARM TZ, A‑HAB, CAAM, CSU, SJC, SNVS) support secure boot, encryption and tamper resistance.
  • Flexible memory and storage support: Native support for LPDDR2/DDR3/DDR3L and a wide range of flash interfaces enables scalable storage architectures.
  • Rich peripheral set: Dual USB OTG with PHY, 10/100 Mbps Ethernet, CAN, multiple UART/I2C/SPI and ADCs cover common embedded connectivity and I/O needs.
  • Compact package footprint: 289‑MAPBGA (14×14) brings full feature availability in a PCB‑friendly package for space‑constrained designs.
  • Extended temperature capability: −40 °C to 125 °C rating supports deployment in thermally demanding embedded environments.

Why Choose MCIMX6G1AVM07AB?

The MCIMX6G1AVM07AB combines a power‑efficient Arm® Cortex®‑A7 core with an integrated power manager, extensive memory and storage interfaces, and a broad peripheral set to address a wide range of embedded applications. Its hardware security features and compact 289‑MAPBGA package make it suitable for designs that require secure operation and high integration in a small footprint.

Supported by evaluation hardware and software tools, this device is positioned for development teams building HMIs, IoT gateways, industrial controllers, payment terminals and smart appliances that need a balanced mix of performance, connectivity and system‑level integration.

Request a quote or submit a pricing and availability inquiry for MCIMX6G1AVM07AB to get started with your design procurement and development planning.

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