MCIMX6G1AVM05ABR

IC MPU I.MX6G 528MHZ 289MAPBGA
Part Description

ARM® Cortex®-A7 Microprocessor IC i.MX6G 1 Core, 32-Bit 528MHz 289-MAPBGA (14x14)

Quantity 1,481 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6G
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A7Device Package289-MAPBGA (14x14)
Display & Interface ControllersLVDSECCNN/AEthernet10/100Mbps (1)
Graphics AccelerationNoHTS CodeN/AMoisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case289-LFBGARAM ControllersDDR3, DDR3L, LPDDR2
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Speed528MHzSupplier Device Package289-MAPBGA (14×14)USBUSB 2.0 + PHY (2)
Voltage – I/O1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6G1AVM05ABR – ARM Cortex-A7 1-Core 528 MHz MPU, 289-MAPBGA

The MCIMX6G1AVM05ABR is a single-core ARM® Cortex®-A7 microprocessor from NXP Semiconductors' i.MX 6G family, delivering a 528 MHz 32-bit processing core in a compact 289-MAPBGA (14 × 14 mm) package. It targets embedded system designs that require an efficient application processor with integrated peripherals and flexible memory support.

Built for integration and simplified power management at the SoC level, this device is suitable for human–machine interfaces and other embedded applications that need a balance of performance, peripheral integration, and extended temperature operation.

Key Features

  • Core — Single ARM® Cortex®-A7 core running at 528 MHz providing 32-bit application processing.
  • Memory interfaces — Supports DDR3, DDR3L and LPDDR2 memory controllers for flexible system memory choices.
  • Co-processors — Multimedia and NEON™ SIMD co-processor support for optimized media and signal processing workloads.
  • Display and USB — LVDS display interface controller and two USB 2.0 ports with integrated PHYs for display and host/device connectivity.
  • Networking and fieldbus — Integrated 10/100 Mbps Ethernet controller (1) and CAN interface for wired communications and control networks.
  • Security — On-chip security features including ARM TrustZone (TZ), A-HAB, CAAM, CSU, SJC, and SNVS to support secure boot and trusted execution architectures.
  • Power and integration — Part of the i.MX 6UltraLite family architecture with integrated power management elements to simplify external power design and sequencing.
  • Package and mounting — 289-ball MAPBGA (14 × 14 mm) surface-mount package for compact board layouts.
  • Operating range — Extended operating temperature from -40 °C to 125 °C for deployment in demanding environments.
  • Regulatory — RoHS-compliant device.

Typical Applications

  • Human–Machine Interfaces (HMI) — Use the Cortex‑A7 core, LVDS display interface, and multimedia support to drive responsive operator interfaces.
  • Embedded controllers — Compact package, broad memory support and integrated peripherals make it suitable for general embedded control and application processing.
  • Connected devices — Integrated Ethernet, CAN and USB interfaces enable wired connectivity and peripheral interfacing for networked devices.

Unique Advantages

  • Compact BGA footprint: The 289-MAPBGA (14 × 14 mm) package enables high-density board designs while keeping a powerful application processor on a small PCB area.
  • Flexible memory support: Native controllers for DDR3, DDR3L and LPDDR2 allow designers to choose memory technology that fits performance and power targets.
  • Integrated peripheral set: Built-in LVDS, USB 2.0 with PHYs, Ethernet and CAN reduce external component count and simplify system integration.
  • Hardware security building blocks: Multiple on-chip security modules provide primitives required for secure boot and trusted execution implementations.
  • Extended temperature capability: Rated for -40 °C to 125 °C operation to support deployment in thermally challenging environments.
  • Manufacturer pedigree: Part of NXP’s i.MX 6G family, benefiting from the i.MX 6UltraLite architecture and associated technical documentation for design integration.

Why Choose MCIMX6G1AVM05ABR?

The MCIMX6G1AVM05ABR positions itself as a balanced application processor for embedded designs that require a dependable single-core Cortex‑A7, flexible memory options, and a strong set of on-chip interfaces. Its compact 289-MAPBGA package and extended operating temperature range make it suitable for space-constrained and thermally varied deployments.

For teams building HMI and embedded controller applications that value integration and security primitives alongside standard connectivity (Ethernet, USB, CAN), this NXP i.MX 6G family part provides a practical platform with comprehensive datasheet support and system-level features to accelerate development.

Request a quote or submit an inquiry for pricing and availability to start your design procurement.

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