MCIMX6G2AVM05AB

IC MPU I.MX6UL 528MHZ 289MAPBGA
Part Description

ARM® Cortex®-A7 Microprocessor IC i.MX6UL 1 Core, 32-Bit 528MHz 289-MAPBGA (14x14)

Quantity 561 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6G
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A7Device Package289-MAPBGA (14x14)
Display & Interface ControllersLCD, LVDSECCN5A992CEthernet10/100Mbps (2)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case289-LFBGARAM ControllersLPDDR2, DDR3, DDR3L
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Speed528MHzSupplier Device Package289-MAPBGA (14×14)USBUSB 2.0 + PHY (2)
Voltage – I/O1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6G2AVM05AB – IC MPU I.MX6UL 528MHz 289MAPBGA

The MCIMX6G2AVM05AB is a single-core ARM® Cortex®-A7 microprocessor in the i.MX 6UltraLite family, operating at 528 MHz and delivered in a 289-MAPBGA (14 × 14 mm) package. Designed for embedded systems, it combines a compact package, integrated power-management elements described in the i.MX 6UltraLite documentation, and a suite of peripheral interfaces for connectivity and human‑machine interface applications.

This device targets embedded designs that require an efficient 32‑bit application core with extensive I/O options, integrated security capabilities, and memory interface flexibility for LPDDR2, DDR3 and DDR3L memory types.

Key Features

  • Core  Single ARM® Cortex®‑A7 core, 32‑bit, running at 528 MHz for application processing in compact embedded systems.
  • Memory Interfaces  Integrated controllers supporting LPDDR2, DDR3 and DDR3L memory, enabling flexible memory selection for performance and power tradeoffs.
  • Multimedia Acceleration  Multimedia co‑processor support including NEON™ SIMD to accelerate media and signal processing workloads.
  • Connectivity  Dual 10/100 Mbps Ethernet MACs, two USB 2.0 controllers with PHY, and CAN interface support for wired networking and peripheral connectivity.
  • Display Support  Integrated display controllers for LCD and LVDS panels to support HMI and embedded display applications.
  • Security Features  On‑chip security modules including ARM TZ, A‑HAB, CAAM, CSU, SJC and SNVS to address hardware security requirements.
  • Power and Integration  Part of the i.MX 6UltraLite family that includes an integrated power management module to simplify external power supply design and sequencing.
  • Package and Mounting  289‑MAPBGA (14 × 14 mm) package, surface‑mountable, suitable for space‑constrained PCB layouts.
  • Environmental  RoHS compliant and specified for an operating temperature range of −40 °C to 125 °C for use in thermally demanding environments.

Typical Applications

  • Telematics  Processing and connectivity functions for telematics endpoints, leveraging Ethernet, USB and CAN interfaces.
  • Human Machine Interfaces (HMI)  Driving LCD/LVDS displays and handling user interaction tasks with the Cortex‑A7 core and integrated display controllers.
  • Connectivity‑enabled Embedded Systems  Networked embedded controllers and gateways that require multiple wired interfaces and flexible memory options.

Unique Advantages

  • Highly integrated power management: The i.MX 6UltraLite family includes an integrated power management module, reducing external BOM complexity and simplifying power sequencing.
  • Flexible memory support: Native controllers for LPDDR2, DDR3 and DDR3L allow designers to choose memory types that match cost, power and performance targets.
  • Broad connectivity: Dual Ethernet MACs, dual USB 2.0 with PHY and CAN support enable diverse wired networking and peripheral topologies.
  • Security building blocks: Multiple on‑chip security modules (ARM TZ, A‑HAB, CAAM, CSU, SJC, SNVS) provide hardware features to support secure system designs.
  • Compact, production‑ready package: 289‑MAPBGA (14 × 14 mm) surface‑mount package balances density and assembly compatibility for volume production.
  • Wide operating range: Specified −40 °C to 125 °C operation supports deployment in thermally challenging embedded environments.

Why Choose MCIMX6G2AVM05AB?

The MCIMX6G2AVM05AB positions itself as a compact, efficient single‑core application processor for embedded designs that need a pragmatic balance of compute, connectivity and security. Its ARM® Cortex®‑A7 core at 528 MHz, combined with flexible memory interfaces and integrated power management from the i.MX 6UltraLite family, makes it suitable for designs where board space, interface count and secure system operation are important.

This device is well suited to designers building connectivity‑centric embedded systems, telematics solutions, and HMI platforms that require a compact package, multiple wired interfaces and a broad temperature range. The inclusion of on‑chip security modules and standard peripheral interfaces simplifies integration and helps streamline development and long‑term deployments.

Request a quote or submit a product inquiry to receive pricing and lead‑time information for MCIMX6G2AVM05AB and to discuss qualification and volume availability for your design.

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