MCIMX6G2AVM07AA

IC MPU I.MX6UL 696MHZ 289MAPBGA
Part Description

ARM® Cortex®-A7 Microprocessor IC i.MX6UL 1 Core, 32-Bit 696MHz 289-MAPBGA (14x14)

Quantity 975 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6G
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A7Device Package289-MAPBGA (14x14)
Display & Interface ControllersLCD, LVDSECCN5A992CEthernet10/100Mbps (2)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case289-LFBGARAM ControllersLPDDR2, DDR3, DDR3L
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Speed696MHzSupplier Device Package289-MAPBGA (14×14)USBUSB 2.0 + PHY (2)
Voltage – I/O1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6G2AVM07AA – IC MPU I.MX6UL 696MHZ 289MAPBGA

The MCIMX6G2AVM07AA from NXP Semiconductors is a single-core ARM® Cortex®-A7 microprocessor operating at up to 696 MHz in a 289-ball MAPBGA (14 × 14 mm) package. Designed for embedded applications, it combines a high-efficiency application core with integrated system-level features to simplify power and memory subsystem design.

Its architecture and peripheral set make it suitable for compact, connectivity‑focused devices that require multimedia processing, multiple memory interface options, and a broad range of I/O including Ethernet, USB and CAN.

Key Features

  • Core Single ARM® Cortex®-A7 core running up to 696 MHz providing 32‑bit processing for control and application tasks.
  • Multimedia Processing Integrated multimedia/DSP capabilities and NEON™ SIMD support for efficient signal and media processing workloads.
  • Memory Interfaces Flexible memory controller support for LPDDR2, DDR3 and DDR3L plus additional interfaces listed in the technical documentation for NAND, NOR, eMMC and Quad SPI.
  • Display Support Integrated display interface controllers supporting LCD and LVDS panels for HMI and graphical displays.
  • Connectivity Dual 10/100 Mbps Ethernet controllers, two USB 2.0 ports with PHY, and CAN interface support for wired networking and peripheral connectivity.
  • Security Features On‑chip security building blocks including ARM TrustZone (TZ), A‑HAB, CAAM, CSU, SJC and SNVS to support system security functions.
  • Power Management Integrated power management module to reduce external power supply complexity and simplify sequencing (as described in the device technical documentation).
  • Package & Mounting 289‑MAPBGA (14 × 14 mm) surface‑mount package, designed for compact board layouts.
  • Operating Range Rated for operation from −40 °C to 125 °C.
  • Compliance RoHS compliant.
  • Graphics Acceleration No dedicated graphics acceleration included.

Typical Applications

  • Human‑Machine Interfaces (HMI) Drive LCD or LVDS displays and manage local user interaction with a single Cortex‑A7 core and integrated display controllers.
  • Connected Devices Implement Ethernet, USB and CAN connectivity for networked embedded systems and communication gateways.
  • Multimedia‑Enabled Embedded Systems Use the multimedia/DSP and NEON SIMD capabilities to handle audio, sensor data processing and light media workloads.
  • Compact, Rugged Designs Deploy in size‑constrained boards that require a 14 × 14 mm MAPBGA package and extended temperature operation.

Unique Advantages

  • Highly integrated power management: The on‑chip power management module reduces external PMIC complexity and simplifies power sequencing.
  • Flexible memory support: Native controllers for LPDDR2, DDR3 and DDR3L plus documented support for NAND, NOR, eMMC and Quad SPI enable use with a wide range of storage options.
  • Rich connectivity set: Dual Ethernet, USB 2.0 with PHY and CAN provide multiple wired communication options without additional controllers.
  • Security building blocks included: Hardware security features such as ARM TZ, A‑HAB and CAAM help implement secure boot and runtime protection schemes.
  • Extended temperature capability: Rated from −40 °C to 125 °C for demanding thermal environments.
  • Compact BGA footprint: 289‑MAPBGA (14 × 14 mm) package balances density and board space for compact embedded products.

Why Choose MCIMX6G2AVM07AA?

The MCIMX6G2AVM07AA positions itself as a compact, application‑focused MPU within the NXP i.MX 6UltraLite family, delivering a balanced combination of compute efficiency, integrated power management and a broad peripheral set. It is aimed at embedded designs that require a single ARM Cortex‑A7 core with multimedia assistance, multiple memory interface choices, and substantial I/O connectivity.

For developers and procurement teams targeting compact, connected systems that demand extended temperature operation and hardware security primitives, this device offers a clear integration advantage and scalability across the i.MX 6UltraLite family as documented in the technical datasheet.

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