MCIMX6G2AVM07AA
| Part Description |
ARM® Cortex®-A7 Microprocessor IC i.MX6UL 1 Core, 32-Bit 696MHz 289-MAPBGA (14x14) |
|---|---|
| Quantity | 975 Available (as of October 9, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6G |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A7 | Device Package | 289-MAPBGA (14x14) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LCD, LVDS | ECCN | 5A992C | Ethernet | 10/100Mbps (2) | ||
| Graphics Acceleration | No | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 125°C (TJ) | Package / Case | 289-LFBGA | RAM Controllers | LPDDR2, DDR3, DDR3L | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | ||
| Speed | 696MHz | Supplier Device Package | 289-MAPBGA (14×14) | USB | USB 2.0 + PHY (2) | ||
| Voltage – I/O | 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V |
Overview of MCIMX6G2AVM07AA – IC MPU I.MX6UL 696MHZ 289MAPBGA
The MCIMX6G2AVM07AA from NXP Semiconductors is a single-core ARM® Cortex®-A7 microprocessor operating at up to 696 MHz in a 289-ball MAPBGA (14 × 14 mm) package. Designed for embedded applications, it combines a high-efficiency application core with integrated system-level features to simplify power and memory subsystem design.
Its architecture and peripheral set make it suitable for compact, connectivity‑focused devices that require multimedia processing, multiple memory interface options, and a broad range of I/O including Ethernet, USB and CAN.
Key Features
- Core Single ARM® Cortex®-A7 core running up to 696 MHz providing 32‑bit processing for control and application tasks.
- Multimedia Processing Integrated multimedia/DSP capabilities and NEON™ SIMD support for efficient signal and media processing workloads.
- Memory Interfaces Flexible memory controller support for LPDDR2, DDR3 and DDR3L plus additional interfaces listed in the technical documentation for NAND, NOR, eMMC and Quad SPI.
- Display Support Integrated display interface controllers supporting LCD and LVDS panels for HMI and graphical displays.
- Connectivity Dual 10/100 Mbps Ethernet controllers, two USB 2.0 ports with PHY, and CAN interface support for wired networking and peripheral connectivity.
- Security Features On‑chip security building blocks including ARM TrustZone (TZ), A‑HAB, CAAM, CSU, SJC and SNVS to support system security functions.
- Power Management Integrated power management module to reduce external power supply complexity and simplify sequencing (as described in the device technical documentation).
- Package & Mounting 289‑MAPBGA (14 × 14 mm) surface‑mount package, designed for compact board layouts.
- Operating Range Rated for operation from −40 °C to 125 °C.
- Compliance RoHS compliant.
- Graphics Acceleration No dedicated graphics acceleration included.
Typical Applications
- Human‑Machine Interfaces (HMI) Drive LCD or LVDS displays and manage local user interaction with a single Cortex‑A7 core and integrated display controllers.
- Connected Devices Implement Ethernet, USB and CAN connectivity for networked embedded systems and communication gateways.
- Multimedia‑Enabled Embedded Systems Use the multimedia/DSP and NEON SIMD capabilities to handle audio, sensor data processing and light media workloads.
- Compact, Rugged Designs Deploy in size‑constrained boards that require a 14 × 14 mm MAPBGA package and extended temperature operation.
Unique Advantages
- Highly integrated power management: The on‑chip power management module reduces external PMIC complexity and simplifies power sequencing.
- Flexible memory support: Native controllers for LPDDR2, DDR3 and DDR3L plus documented support for NAND, NOR, eMMC and Quad SPI enable use with a wide range of storage options.
- Rich connectivity set: Dual Ethernet, USB 2.0 with PHY and CAN provide multiple wired communication options without additional controllers.
- Security building blocks included: Hardware security features such as ARM TZ, A‑HAB and CAAM help implement secure boot and runtime protection schemes.
- Extended temperature capability: Rated from −40 °C to 125 °C for demanding thermal environments.
- Compact BGA footprint: 289‑MAPBGA (14 × 14 mm) package balances density and board space for compact embedded products.
Why Choose MCIMX6G2AVM07AA?
The MCIMX6G2AVM07AA positions itself as a compact, application‑focused MPU within the NXP i.MX 6UltraLite family, delivering a balanced combination of compute efficiency, integrated power management and a broad peripheral set. It is aimed at embedded designs that require a single ARM Cortex‑A7 core with multimedia assistance, multiple memory interface choices, and substantial I/O connectivity.
For developers and procurement teams targeting compact, connected systems that demand extended temperature operation and hardware security primitives, this device offers a clear integration advantage and scalability across the i.MX 6UltraLite family as documented in the technical datasheet.
Request a quote or submit a quote to check current availability and pricing for the MCIMX6G2AVM07AA.

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